SCHEMBL3138030

SCHEMBL3138030

O=C(CI)c1c(Cl)cccc1Cl

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FEN1 P39748 3/20 0.57
ALDH1A1 P00352 2/20 0.54
AKR1B1 P15121 1/20 0.43
HPGD P15428 2/20 0.43
NPC1 O15118 1/20 0.41
GLA P06280 1/20 0.41
KMT2A Q03164 3/20 0.40
MEN1 O00255 2/20 0.40
ERCC5 P28715 2/20 0.39
JAK2 O60674 1/20 0.39
CYP3A4 P08684 1/20 0.39
JAK1 P23458 1/20 0.39
TYK2 P29597 1/20 0.39
TSHR P16473 1/20 0.39
GSK3B P49841 1/20 0.39
CES2 O00748 1/20 0.38
CES1 P23141 1/20 0.38
POLB P06746 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
GAA P10253 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12431212 0.79 FEN1 (0.59) FEN1ALDH1A1AKR1B1HPGDNPC1
SCHEMBL169401 0.77 FEN1 (0.57) FEN1ALDH1A1AKR1B1HPGDNPC1
SCHEMBL8239577 0.77 FEN1 (0.57) FEN1ALDH1A1AKR1B1HPGDNPC1
SCHEMBL9113347 0.77 FEN1 (0.57) FEN1ALDH1A1AKR1B1HPGDNPC1
SCHEMBL4869850 0.77 FEN1 (0.57) FEN1ALDH1A1AKR1B1HPGDNPC1
SCHEMBL15189611 0.77 ERCC5 (0.61) FEN1ALDH1A1AKR1B1KMT2AMEN1
SCHEMBL28166467 0.76 FEN1 (0.71) FEN1ALDH1A1AKR1B1HPGDKMT2A
SCHEMBL19998299 0.75 ALDH1A1 (0.64) FEN1ALDH1A1AKR1B1HPGDNPC1
SCHEMBL5583677 0.74 FEN1 (0.58) FEN1ALDH1A1AKR1B1HPGDGLA
SCHEMBL30119856 0.74 FEN1 (0.53) FEN1ALDH1A1AKR1B1HPGDNPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1605078-B1 SOLDERING PROCESS USING IMIDAZOLE COMPOUND SHIKOKU CHEM (JP) 2010-07-21 EP disclosed
US-7661577-B2 Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-16 US disclosed
US-20070113930-A1 Novel imidazole compound and use thereof SHIKOKU CHEMICALS CORPORATION (JP) 2007-05-24 US disclosed
EP-1605078-A1 NOVEL IMIDAZOLE COMPOUND AND USAGE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2005-12-14 EP disclosed