SCHEMBL31429639

SCHEMBL31429639

CCOc1cccc(-c2nc(-c3ccccc3)c(-c3ccccc3)[nH]2)c1O

nearest known ligand 0.61

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.61
MEN1 O00255 3/20 0.60
KMT2A Q03164 3/20 0.60
POLB P06746 2/20 0.60
MGAM O43451 1/20 0.58
SMPD3 Q9NY59 2/20 0.54
NOX1 Q9Y5S8 2/20 0.54
FABP4 P15090 2/20 0.52
PLG P00747 3/20 0.52
PLAU P00749 3/20 0.52
F10 P00742 2/20 0.52
F2 P00734 1/20 0.52
PLAT P00750 1/20 0.52
KDM4E B2RXH2 1/20 0.51
TP53 P04637 3/20 0.48
PTPN1 P18031 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29732712 0.89 MEN1 (0.70) MAPTMEN1KMT2APOLBMGAM
SCHEMBL4196255 0.89 MEN1 (0.70) MAPTMEN1KMT2APOLBMGAM
SCHEMBL31429542 0.86 SMPD3 (0.68) MAPTMEN1KMT2APOLBMGAM
SCHEMBL13379393 0.80 MGAM (0.72) MAPTMEN1KMT2APOLBMGAM
SCHEMBL31429640 0.79 MGAM (0.80) MAPTMEN1KMT2APOLBMGAM
SCHEMBL31429748 0.79 PLG (0.67) KMT2APLGPLAUF10F2
SCHEMBL29281310 0.79 PLG (0.67) KMT2APLGPLAUF10F2
SCHEMBL31429715 0.77 MGAM (0.60) MAPTMEN1KMT2APOLBMGAM
SCHEMBL7577244 0.77 ALDH1A1 (0.51) MAPTPLGPLAUF10F2
SCHEMBL14646372 0.77 MEN1 (0.72) MAPTMEN1KMT2APOLBMGAM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO disclosed
CN-119894957-A Epoxy resin composition, resin paste, film-type adhesive, printed circuit board, semiconductor chip package, and electronic device 旭化成株式会社 2025-04-25 CN disclosed
WO-2025058018-A1 COMPOUND 旭化成株式会社 2025-03-20 WO disclosed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L MAPT 3438/4885MEN1 4334/4885KMT2A 400/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.