SCHEMBL3144723

SCHEMBL3144723

C=C(CC(C)(C)c1ccc(N)cc1)c1ccc(N)cc1

nearest known ligand 0.44

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 2/20 0.44
MAPT P10636 2/20 0.44
RAB9A P51151 2/20 0.44
EPHX2 P34913 1/20 0.41
ESRRG P62508 1/20 0.40
CYP19A1 P11511 2/20 0.37
ALDH1A1 P00352 1/20 0.37
HPGD P15428 1/20 0.37
MAPK1 P28482 1/20 0.37
ESR1 P03372 1/20 0.37
ESR2 Q92731 1/20 0.37
LMNA P02545 1/20 0.35
CYP1A2 P05177 1/20 0.35
CYP3A4 P08684 1/20 0.35
MAOA P21397 1/20 0.35
MASP2 O00187 1/20 0.34
PLAU P00749 1/20 0.34
THPO P40225 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23792833 0.84 CYP19A1 (0.39) EPHX2ESRRGCYP19A1ESR1ESR2
SCHEMBL3419256 0.82 SHBG (0.53) MAPTESRRGALDH1A1HPGDMAPK1
SCHEMBL1408639 0.82 NPC1 (0.46) NPC1MAPTRAB9AALDH1A1HPGD
SCHEMBL27955984 0.81 HDAC3 (0.42) EPHX2ESR1ESR2
SCHEMBL1408654 0.81 CYP2C9 (0.41) NPC1RAB9AALDH1A1HPGDLMNA
SCHEMBL6935320 0.81 MAOA (0.41) RAB9AESR1ESR2LMNAMAOA
SCHEMBL20975679 0.78 CYP19A1 (0.43) NPC1MAPTRAB9AEPHX2ESRRG
SCHEMBL10597720 0.77 HDAC1 (0.34) NPC1MAPTRAB9AEPHX2ALDH1A1
SCHEMBL9360407 0.76 NPC1 (0.48) NPC1MAPTRAB9AALDH1A1HPGD
SCHEMBL14921 0.76 TAAR1 (0.48) ALDH1A1MAPK1ESR1ESR2CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 109 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114008525-B Method for producing purified resist composition, method for forming resist pattern, and purified resist composition 东京应化工业株式会社 2025-05-23 CN disclosed
US-20250153114-A1 POLYIMIDE-CONTAINING FILTRATION MEMBRANE, FILTERS, AND METHODS ENTEGRIS, INC. 2025-05-15 US disclosed
US-20250110406-A1 METHOD OF PRODUCING RESIST COMPOSITION PURIFIED PRODUCT, RESIST PATTERN FORMING METHOD, AND RESIST COMPOSITION PURIFIED PRODUCT TOKYO OHKA KOGYO CO LTD (JP) 2025-04-03 US disclosed
WO-2025053071-A1 POROUS FILM AND METHOD FOR PRODUCING POROUS FILM 東京応化工業株式会社 2025-03-13 WO disclosed
CN-119552505-A Composition for producing porous film, method for producing porous film, and porous film 东京应化工业株式会社 2025-03-04 CN disclosed
CN-119503513-A Winding device, film winding method, and method for producing porous imide resin film 东京应化工业株式会社 2025-02-25 CN disclosed
CN-119503516-A Slitting machine and system for manufacturing porous imide resin film 东京应化工业株式会社 2025-02-25 CN disclosed
US-20250050269-A1 GAS SEPARATION MEMBRANE, GAS SEPARATION MEMBRANE MODULE, AND GAS PERMEABLE APPARATUS HITACHI GE VERNOVA NUCLEAR ENERGY, LTD. (JP) 2025-02-13 US disclosed
CN-107249720-B Method for purifying liquid, method for producing chemical liquid or cleaning liquid, filter medium, and filter device 东京应化工业株式会社 2025-01-10 CN disclosed
US-12186715-B2 Production method for resist composition purified product, resist pattern forming method, and resist composition purified product TOKYO OHKA KOGYO CO., LTD. (JP) 2025-01-07 US disclosed
US-20080081294-A1 PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF CURED RELIEF PATTERN USING THE SAME AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2008-04-03 US disclosed
EP-1906246-A2 Photosensitive resin composition, production method of cured relief pattern using the same and semiconductor device FUJIFILM Corporation (JP) 2008-04-02 EP disclosed
US-5756254-A CONTAINING PHOTOSENSITIVE ACID GENERATOR KABUSHIKI KAISHA TOSHIBA (JP) 1998-05-26 US disclosed
US-5753407-A Polyamic acid composition KABUSHIKI KAISHA TOSHIBA (JP) 1998-05-19 US disclosed
US-5585217-A Polyamic acid composition KABUSHIKI KAISHA TOSHIBA (JP) 1996-12-17 US disclosed
US-5518864-A PHOTOSENSITIVE, QUINONE DIAZIDE KABUSHIKI KAISHA TOSHIBA (JP) 1996-05-21 US disclosed
EP-0431971-B1 Photosensitive composition and resin-encapsulated semiconductor device TOSHIBA KK (JP) 1995-07-19 EP disclosed
US-5340684-A Polyimidesiloxane copolymers KABUSHIKI KAISHA TOSHIBA (JP) 1994-08-23 US disclosed
EP-0431971-A2 Photosensitive composition and resin-encapsulated semiconductor device KABUSHIKI KAISHA TOSHIBA (JP) 1991-06-12 EP disclosed
US-4323662-A Thermosetting resin compositions comprising bismaleimides and alkenylaniline derivatives MITSUI TOATSU CHEMICALS, INC. (JP) 1982-04-06 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12186715-B2 Production method for resist composition purified product, resist pattern forming method, and resist composition purified product PUF60, RIOK2, SLC11A2 NPC1 3418/4885MAPT 2939/4885RAB9A 1882/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.