SCHEMBL3145573

SCHEMBL3145573

Nc1ccc(Oc2ccccc2Sc2ccccc2Oc2ccc(N)cc2)cc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NCOA1 Q15788 1/20 0.55
NCOA3 Q9Y6Q9 1/20 0.55
MAOA P21397 2/20 0.54
ALDH1A1 P00352 7/20 0.50
TDP1 Q9NUW8 2/20 0.50
CYP3A4 P08684 1/20 0.50
TSHR P16473 1/20 0.50
MAPT P10636 4/20 0.45
MEN1 O00255 3/20 0.45
KMT2A Q03164 3/20 0.45
SMN1; SMN2 Q16637 3/20 0.45
GAA P10253 2/20 0.45
MITF O75030 1/20 0.45
GFER P55789 1/20 0.45
NLRP1 Q9C000 1/20 0.45
NOD2 Q9HC29 1/20 0.45
NPC1 O15118 2/20 0.44
RAB9A P51151 2/20 0.44
NLRP3 Q96P20 1/20 0.44
APAF1 O14727 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7876076 0.89 NCOA1 (0.53) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL7225717 0.88 NCOA1 (0.55) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL11019469 0.85 MAOA (0.52) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL11239908 0.85 NCOA1 (0.51) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL28007611 0.85 NCOA1 (0.51) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL795222 0.83 TSHR (0.50) ALDH1A1TSHRKMT2AGAAMAPK1
SCHEMBL459355 0.83 MAOA (0.68) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL29476109 0.83 MAOA (0.68) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL1270920 0.83 MAOA (0.68) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL6290292 0.81 MAOA (0.65) NCOA1NCOA3MAOAALDH1A1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240329525-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-10-03 US disclosed
US-20240210827-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-06-27 US disclosed
CN-113820920-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2023-07-04 CN disclosed
CN-112512792-B Laminate and method for producing laminate 东洋纺株式会社 2023-02-17 CN disclosed
CN-115185157-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2022-10-14 CN disclosed
CN-114846082-A Resin composition and film 株式会社钟化 2022-08-02 CN disclosed
CN-114423612-A Laminate manufacturing device and laminate manufacturing method 东洋纺株式会社 2022-04-29 CN disclosed
CN-110225820-B Method for manufacturing polymer film laminated substrate and flexible electronic device 东洋纺株式会社 2022-01-28 CN disclosed
CN-113820920-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-12-21 CN disclosed
CN-113574118-A Liquid composition, powder, and method for producing powder AGC株式会社 2021-10-29 CN disclosed
EP-0758665-A1 Polyimides and optical parts obtained by using the same HITACHI CHEMICAL COMPANY, LTD. (JP) 1997-02-19 EP disclosed
US-5518864-A PHOTOSENSITIVE, QUINONE DIAZIDE KABUSHIKI KAISHA TOSHIBA (JP) 1996-05-21 US disclosed
US-5348835-A Without photoresist KABUSHIKI KAISHA TOSHIBA (JP) 1994-09-20 US disclosed
EP-0304136-B1 Novel photosensitive composition ASAHI CHEMICAL IND (JP) 1994-06-29 EP disclosed
EP-0478321-A1 Photosenstive resin composition for forming polyimide film pattern and method of forming polyimide film pattern KABUSHIKI KAISHA TOSHIBA (JP) 1992-04-01 EP disclosed
US-5019482-A Polymer/oxime ester/coumarin compound photosensitive composition ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1991-05-28 US disclosed
EP-0263212-B1 METHOD FOR REMOVING WATER VAPOR FROM WATER VAPOR-CONTAINING GAS UBE INDUSTRIES, LTD. (JP) 1990-12-27 EP disclosed
EP-0304136-A2 Novel photosensitive composition Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1989-02-22 EP disclosed
EP-0263212-A1 Method for removing water vapor from water vapor-containing gas UBE INDUSTRIES, LTD. (JP) 1988-04-13 EP disclosed
US-4718921-A Method for removing water vapor from water vapor-containing gas UBE INDUSTRIES, LTD. (JP) 1988-01-12 US disclosed