Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ACHE | P22303 | 3/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.38 |
| ▸ | TGM2 | P21980 | 1/20 | 0.36 |
| ▸ | GAA | P10253 | 1/20 | 0.35 |
| ▸ | MMP9 | P14780 | 1/20 | 0.35 |
| ▸ | HTT | P42858 | 3/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.33 |
| ▸ | LMNA | P02545 | 3/20 | 0.33 |
| ▸ | PKM | P14618 | 2/20 | 0.33 |
| ▸ | HPGD | P15428 | 2/20 | 0.33 |
| ▸ | ATM | Q13315 | 2/20 | 0.33 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.33 |
| ▸ | AGXT | P21549 | 2/20 | 0.33 |
| ▸ | MMP13 | P45452 | 1/20 | 0.33 |
| ▸ | NLRP1 | Q9C000 | 1/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | NTSR1 | P30989 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| P-Xylene SCHEMBL27916325 | 0.85 | L3MBTL1 (0.39) | TDP1TGM2GAAHTTALDH1A1 | |
| M-Xylene SCHEMBL17601871 | 0.83 | ACHE (0.48) | ACHETDP1HTTALDH1A1LMNA | |
| O-Xylene SCHEMBL17601868 | 0.82 | TSHR (0.43) | ACHEHTTALDH1A1MEN1KMT2A | |
| P-Xylene SCHEMBL28856424 | 0.79 | ACHE (0.61) | ACHETDP1GAAALDH1A1LMNA | |
| Vinyl Ether SCHEMBL36984 | 0.79 | — | — | |
| P-Xylene SCHEMBL109385 | 0.79 | ACHE (0.61) | ACHETDP1GAAALDH1A1LMNA | |
| P-Xylene SCHEMBL14117993 | 0.77 | LMNA (0.38) | ACHETDP1TGM2GAAMMP9 | |
| Vinyl Ether SCHEMBL17133764 | 0.76 | TSHR (0.32) | — | |
| Vinyl Ether SCHEMBL7926316 | 0.76 | TSHR (0.32) | — | |
| Vinyl Ether SCHEMBL21044867 | 0.76 | TSHR (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12038557-B2 | Anti-reflection film | DAICEL CORPORATION (JP) | 2024-07-16 | — | — | US | disclosed |
| US-20240210817-A1 | RESIN MOLDED ARTICLE PRODUCTION METHOD AND OPTICAL COMPONENT PRODUCTION METHOD | DAICEL CORPORATION (JP) | 2024-06-27 | — | — | US | disclosed |
| WO-2024135086-A1 | PHOTOCURABLE COMPOSITION, UNDERCOAT LAYER, LAMINATE AND DISPLAY DEVICE | 株式会社ダイセル | 2024-06-27 | — | — | WO | disclosed |
| WO-2024095928-A1 | EPOXY COMPOUND PRODUCT | 株式会社ダイセル | 2024-05-10 | — | — | WO | disclosed |
| US-11927884-B2 | Resin molded article production method and optical component production method | DAICEL CORPORATION (JP) | 2024-03-12 | — | — | US | disclosed |
| US-11915925-B2 | Semiconductor device manufacturing method | DAICEL CORPORATION (JP) | 2024-02-27 | — | — | US | disclosed |
| US-11898057-B2 | Weather-resistant hard coat composition for glass-substitute substrate, cured product, and laminate | DAICEL CORPORATION (JP) | 2024-02-13 | — | — | US | disclosed |
| US-11887975-B2 | Semiconductor device manufacturing method | DAICEL CORPORATION (JP) | 2024-01-30 | — | — | US | disclosed |
| US-11866608-B2 | Weather-resistant hard coat composition for metal, cured product, and coated metal substrate | DAICEL CORPORATION (JP) | 2024-01-09 | — | — | US | disclosed |
| EP-3603937-B1 | RESIN MOLDED ARTICLE PRODUCTION METHOD AND OPTICAL COMPONENT PRODUCTION METHOD | DAICEL CORP (JP) | 2023-09-27 | — | — | EP | disclosed |
| US-20180142128-A1 | CURABLE COMPOSITION, AND MOULDED BODY | DAICEL CORPORATION (JP) | 2018-05-24 | — | — | US | disclosed |
| EP-3312211-A1 | CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, PRODUCTION METHOD FOR ADHESIVE SHEET, AND DEVICE | Daicel Corporation (JP) | 2018-04-25 | — | — | EP | disclosed |
| EP-3312212-A1 | CURABLE COMPOSITION | Daicel Corporation (JP) | 2018-04-25 | — | — | EP | disclosed |
| US-20160297933-A1 | POLYORGANOSILSESQUIOXANE, HARD COAT FILM, ADHESIVE SHEET, AND LAMINATE | DAICEL CORPORATION (JP) | 2016-10-13 | — | — | US | disclosed |
| US-20160130432-A1 | COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL | DAICEL CORPORATION (JP) | 2016-05-12 | — | — | US | disclosed |
| US-20160083544-A1 | COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL | DAICEL CORPORATION (JP) | 2016-03-24 | — | — | US | disclosed |
| EP-1505090-B1 | REACTIVE DILUENT COMPOSITION AND CURABLE RESIN COMPOSITION | NIPPON CATALYTIC CHEM IND (JP) | 2010-03-31 | — | — | EP | disclosed |
| EP-1505090-A1 | REACTIVE DILUENT COMPOSITION AND CURABLE RESIN COMPOSITION | Nippon Shokubai Co., Ltd. (JP) | 2005-02-09 | — | — | EP | disclosed |
| US-6767980-B2 | ACTIVATED ENERGY RAY-CURABLE INK COMPOSITION FOR INK-JET PRINTING; VINYL ETHER GROUP-CONTAINING (METH)ACRYLIC ESTER | NIPPON SHOKUBAI CO., LTD. (JP) | 2004-07-27 | — | — | US | disclosed |
| US-20030199655-A1 | Reactive diluent and curable resin composition | NIPPON SHOKUBAI CO., LTD. | 2003-10-23 | — | — | US | disclosed |