SCHEMBL31533744

SCHEMBL31533744

Nc1ccc(-c2ccc(N)c(OC(F)(F)F)c2OC(F)(F)F)cc1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KIF11 P52732 2/20 0.38
TDP1 Q9NUW8 3/20 0.34
ALDH1A1 P00352 2/20 0.34
CYP3A4 P08684 2/20 0.34
TP53 P04637 1/20 0.34
GLA P06280 1/20 0.33
POLB P06746 1/20 0.33
GAA P10253 1/20 0.33
TSHR P16473 1/20 0.33
PDK2 Q15119 1/20 0.33
PDE3B Q13370 2/20 0.32
PDE3A Q14432 2/20 0.32
ALOX5AP P20292 2/20 0.31
FEN1 P39748 2/20 0.31
KDM4E B2RXH2 1/20 0.31
TAAR1 Q96RJ0 1/20 0.30
HSD17B10 Q99714 1/20 0.30
CHEK1 O14757 2/20 0.30
GPR3 P46089 1/20 0.30
CNR1 P21554 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3472998 1.00 KIF11 (0.38) KIF11TDP1ALDH1A1CYP3A4TP53
SCHEMBL31533745 0.85 GPR3 (0.35) GLAPOLBGAATSHRKDM4E
SCHEMBL31533767 0.81 PDE3B (0.40) TDP1ALDH1A1CYP3A4POLBTSHR
SCHEMBL31533763 0.80 FFAR4 (0.33) KIF11ALDH1A1CYP3A4TP53GAA
SCHEMBL31533746 0.78 GLA (0.38) GLAPOLBGAATSHRPDK2
SCHEMBL31533765 0.75 KIF11 (0.35) KIF11TDP1ALDH1A1CYP3A4TP53
SCHEMBL27902953 0.74 ALOX5AP (0.41) KIF11ALDH1A1PDE3BPDE3AALOX5AP
SCHEMBL2528747 0.73 CYP3A4 (0.40) KIF11TDP1ALDH1A1CYP3A4TP53
SCHEMBL2141965 0.73 GLA (0.42) KIF11TDP1ALDH1A1CYP3A4TP53
SCHEMBL1119491 0.72 TDP1 (0.41) TDP1ALDH1A1CYP3A4TP53TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025074873-A1 POLYAMIDIMIDE, RESIN COMPOSITION, MOLDED ARTICLE, AND FILM 株式会社カネカ 2025-04-10 WO disclosed
WO-2025063230-A1 POLYIMIDE, RESIN COMPOSITION, MOLDED OBJECT, AND FILM 株式会社カネカ 2025-03-27 WO disclosed