SCHEMBL3472998

SCHEMBL3472998

Nc1ccc(-c2ccc(N)c(OC(F)(F)F)c2OC(F)(F)F)cc1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KIF11 P52732 2/20 0.38
TDP1 Q9NUW8 3/20 0.34
ALDH1A1 P00352 2/20 0.34
CYP3A4 P08684 2/20 0.34
TP53 P04637 1/20 0.34
GLA P06280 1/20 0.33
POLB P06746 1/20 0.33
GAA P10253 1/20 0.33
TSHR P16473 1/20 0.33
PDK2 Q15119 1/20 0.33
PDE3B Q13370 2/20 0.32
PDE3A Q14432 2/20 0.32
ALOX5AP P20292 2/20 0.31
FEN1 P39748 2/20 0.31
KDM4E B2RXH2 1/20 0.31
TAAR1 Q96RJ0 1/20 0.30
HSD17B10 Q99714 1/20 0.30
CHEK1 O14757 2/20 0.30
GPR3 P46089 1/20 0.30
CNR1 P21554 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31533744 1.00 KIF11 (0.38) KIF11TDP1ALDH1A1CYP3A4TP53
SCHEMBL31533745 0.85 GPR3 (0.35) GLAPOLBGAATSHRKDM4E
SCHEMBL31533767 0.81 PDE3B (0.40) TDP1ALDH1A1CYP3A4POLBTSHR
SCHEMBL31533763 0.80 FFAR4 (0.33) KIF11ALDH1A1CYP3A4TP53GAA
SCHEMBL31533746 0.78 GLA (0.38) GLAPOLBGAATSHRPDK2
SCHEMBL31533765 0.75 KIF11 (0.35) KIF11TDP1ALDH1A1CYP3A4TP53
SCHEMBL27902953 0.74 ALOX5AP (0.41) KIF11ALDH1A1PDE3BPDE3AALOX5AP
SCHEMBL2528747 0.73 CYP3A4 (0.40) KIF11TDP1ALDH1A1CYP3A4TP53
SCHEMBL2141965 0.73 GLA (0.42) KIF11TDP1ALDH1A1CYP3A4TP53
SCHEMBL1119491 0.72 TDP1 (0.41) TDP1ALDH1A1CYP3A4TP53TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117186403-B Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2024-04-02 CN claimed
CN-117186403-A Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-12-08 CN claimed
CN-103890057-A Aromatic polyamide film for solvent resistant flexible substrates AKRON POLYMER SYSTEMS INC 2014-06-25 CN claimed
US-20140084499-A1 SOLUTION OF AROMATIC POLYAMIDE FOR PRODUCING DISPLAY ELEMENT, OPTICAL ELEMENT, OR ILLUMINATION ELEMENT AKRON POLYMER SYSTEMS, INC. (US) 2014-03-27 US claimed
EP-2688942-A2 AROMATIC POLYAMIDE FILMS FOR TRANSPARENT FLEXIBLE SUBSTRATES Akron Polymer Systems, Inc. (US) 2014-01-29 EP claimed
EP-2092807-B1 COMPOSITE ORGANIC ENCAPSULANTS CDA PROC LTD LIABILITY COMPANY (US) 2013-04-17 EP claimed
WO-2012129422-A2 AROMATIC POLYAMIDE FILMS FOR TRANSPARENT FLEXIBLE SUBSTRATES AKRON POLYMER SYSTEMS, INC. (US) 2012-09-27 WO claimed
US-7745516-B2 Composition of polyimide and sterically-hindered hydrophobic epoxy E. I. DU PONT DE NEMOURS AND COMPANY (US) 2010-06-29 US claimed
US-20090111948-A1 Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto CDA PROCESSING LIMITED LIABILITY COMPANY 2009-04-30 US claimed
EP-2027184-A2 HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS E.I. DU PONT DE NEMOURS AND COMPANY (US) 2009-02-25 EP claimed
EP-1943311-A1 COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO E.I.Du pont de nemours and company (US) 2008-07-16 EP claimed
WO-2007146382-A2 HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS E. I. DU PONT DE NEMOURS AND COMPANY (US) 2007-12-21 WO claimed
US-20070290379-A1 Hydrophobic compositions for electronic applications E. I. DU PONT DE NEMOURS AND COMPANY 2007-12-20 US claimed
WO-2007047384-A1 COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO E.I. DU PONT DE NEMOURS AND COMPANY (US) 2007-04-26 WO claimed
US-20070083016-A1 Photosensitive polyimide compositions E. I. DUPONT DE NEMOURS AND COMPANY 2007-04-12 US claimed
US-20070083017-A1 Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto CDA PROCESSING LIMITED LIABILITY COMPANY 2007-04-12 US claimed
WO-2025100302-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-05-15 WO disclosed
US-20250138422-A1 PHOTOSENSITIVE RESIN COMPOSITION, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2025-05-01 US disclosed
US-20070083016-A1 Photosensitive polyimide compositions E. I. DUPONT DE NEMOURS AND COMPANY 2007-04-12 US disclosed
US-20070083017-A1 Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto CDA PROCESSING LIMITED LIABILITY COMPANY 2007-04-12 US disclosed