SCHEMBL3155709

SCHEMBL3155709

F[SiH2]Br

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL177481 0.61
SCHEMBL1255601 0.61
SCHEMBL2734160 0.55
SCHEMBL8587258 0.55
SCHEMBL23296276 0.50
SCHEMBL155219 0.50
SCHEMBL378744 0.50
SCHEMBL3489090 0.50
SCHEMBL703656 0.50
SCHEMBL7737619 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1197999-B1 METHOD OF FORMING LOW-DIELECTRIC-CONSTANT FILM, AND SEMICONDUCTOR SUBSTRATE WITH LOW-DIELECTRIC-CONSTANT FILM JGC CATALYSTS & CHEMICALS LTD (JP) 2010-02-17 EP disclosed
EP-1035183-B1 COATING FLUID FOR FORMING LOW-PERMITTIVITY SILICA-BASED COATING FILM AND SUBSTRATE WITH LOW-PERMITTIVITY COATING FILM JGC CATALYSTS & CHEMICALS LTD (JP) 2009-11-25 EP disclosed
US-6716773-B2 Forming a coating film by coating an insulating film-forming coating liquid on substrate mounted on a rotating disc of a spin coater; removing a projected portion of coating film formed at periphery of substrate by ejecting a solvent CATALYSTS & CHEMICALS INDUSTRIES CO., LTD. (JP) 2004-04-06 US disclosed
US-6599846-B2 Method of forming a silica-containing coating film with a low dielectric constant and semiconductor substrate coated with such a film CATALYSTS & CHEMICALS INDUSTRIES CO., LTD. (JP) 2003-07-29 US disclosed
US-20030062599-A1 Process for producing semiconductor substrates and semiconductor substrates CATALYSTS & CHEMICALS INDUSTRIES CO., LTD. 2003-04-03 US disclosed
EP-1296358-A2 Process for producing semiconductor substrates Catalysts &amp; Chemicals Industries Co., Ltd. (JP) 2003-03-26 EP disclosed
US-20020187652-A1 Method of forming a silica-containing coating film with a low dielectric constant and semiconductor substrate coated with such a film CATALYSTS & CHEMICALS INDUSTRIES CO., LTD. (JP) 2002-12-12 US disclosed
US-6451436-B1 EXCELLENT IN RESISTANCE TO OXYGEN PLASMA AND ETCHING; REACTION PRODUCT BETWEEN FINE PARTICLES OF SILICA AND A HALOGENATED SILANE OR A HYDROLYZATE THEREOF EXHIBITS A DIELECTRIC CONSTANT AS LOW AS 3;MECHANICAL STRENGTH AND CHEMICAL RESISTANCE CATALYSTS & CHEMICALS INDUSTRIES CO., LTD. (JP) 2002-09-17 US disclosed
EP-1197999-A1 METHOD OF FORMING LOW-DIELECTRIC-CONSTANT FILM, AND SEMICONDUCTOR SUBSTRATE WITH LOW-DIELECTRIC-CONSTANT FILM Catalysts &amp; Chemicals Industries Co., Ltd. (JP) 2002-04-17 EP disclosed
EP-1035183-A1 COATING FLUID FOR FORMING LOW-PERMITTIVITY SILICA-BASED COATING FILM AND SUBSTRATE WITH LOW-PERMITTIVITY COATING FILM Catalysts & Chemicals Industries Co., Ltd. (JP) 2000-09-13 EP disclosed
EP-0301678-B1 METHOD OF SELECTIVE REDUCTION OF POLYHALOSILANES WITH ALKYLTIN HYDRIDES DOW CORNING CORPORATION (US) 1993-03-24 EP disclosed
US-4814155-A Method of selective reduction of polyhalosilanes with alkyltin hydrides DOW CORNING CORPORATION (US) 1989-03-21 US disclosed
EP-0301678-A2 Method of selective reduction of polyhalosilanes with alkyltin hydrides DOW CORNING CORPORATION (US) 1989-02-01 EP disclosed