SCHEMBL378744

SCHEMBL378744

F[SiH2][SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18131679 0.72
SCHEMBL177481 0.61
SCHEMBL1255601 0.61
SCHEMBL5344169 0.58
SCHEMBL23749599 0.55
SCHEMBL2734160 0.55
SCHEMBL8354132 0.55
SCHEMBL8587258 0.55
SCHEMBL378743 0.50
SCHEMBL23296276 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4748968-A1 METHOD FOR FORMING THIN FILM USING TWO TYPES OF SILICON PRECURSOR COMPOUNDS Hansol Chemical Co., Ltd (KR) 2026-05-27 EP claimed
EP-4667616-A1 METHOD FOR THE FORMATION OF THIN FILMS USING TWO TYPES OF SILICON PRECURSOR Hansol Chemical Co., Ltd (KR) 2025-12-24 EP claimed
US-20250369114-A1 METHOD FOR THE FORMATION OF THIN FILMS USING TWO TYPES OF SILICON PRECURSOR HANSOL CHEMICAL CO LTD (KR) 2025-12-04 US claimed
WO-2025018802-A1 METHOD FOR FORMING THIN FILM USING TWO TYPES OF SILICON PRECURSOR COMPOUNDS 주식회사 한솔케미칼 2025-01-23 WO claimed
US-11784026-B2 Substrate processing apparatus, material layer deposition apparatus, and atmospheric pressure chemical vapor deposition apparatus SAMSUNG ELECTRONICS CO., LTD. 2023-10-10 US claimed
US-20210222300-A1 SUBSTRATE PROCESSING APPARATUS, MATERIAL LAYER DEPOSITION APPARATUS, AND ATMOSPHERIC PRESSURE CHEMICAL VAPOR DEPOSITION APPARATUS SAMSUNG ELECTRONICS CO., LTD. (KR) 2021-07-22 US claimed
CN-100334182-C Process for preparing silicon blue photoluminescent material UNIV TIANJIN TECHNOLOGY (CN) 2007-08-29 CN claimed
EP-0296702-A2 Method of forming semiconducting amorphous silicon films from the thermal decompositon of fluorohydridodisilanes DOW CORNING CORPORATION (US) 1988-12-28 EP claimed
US-4762808-A Method of forming semiconducting amorphous silicon films from the thermal decomposition of fluorohydridodisilanes DOW CORNING CORPORATION (US) 1988-08-09 US claimed
JP-63030398-A None JP disclosed
JP-8134082-A None JP disclosed
JP-1009614-A None JP disclosed
EP-4748968-A1 METHOD FOR FORMING THIN FILM USING TWO TYPES OF SILICON PRECURSOR COMPOUNDS Hansol Chemical Co., Ltd (KR) 2026-05-27 EP disclosed
EP-4667616-A1 METHOD FOR THE FORMATION OF THIN FILMS USING TWO TYPES OF SILICON PRECURSOR Hansol Chemical Co., Ltd (KR) 2025-12-24 EP disclosed
EP-0296702-A2 Method of forming semiconducting amorphous silicon films from the thermal decompositon of fluorohydridodisilanes DOW CORNING CORPORATION (US) 1988-12-28 EP disclosed
EP-0296702-A2 Method of forming semiconducting amorphous silicon films from the thermal decompositon of fluorohydridodisilanes DOW CORNING CORPORATION (US) 1988-12-28 EP disclosed
US-4762808-A Method of forming semiconducting amorphous silicon films from the thermal decomposition of fluorohydridodisilanes DOW CORNING CORPORATION (US) 1988-08-09 US disclosed
US-4762808-A Method of forming semiconducting amorphous silicon films from the thermal decomposition of fluorohydridodisilanes DOW CORNING CORPORATION (US) 1988-08-09 US disclosed
US-4762808-A Method of forming semiconducting amorphous silicon films from the thermal decomposition of fluorohydridodisilanes DOW CORNING CORPORATION (US) 1988-08-09 US disclosed
JP-S6330398-A EPITAXY TOSHIBA CORP 1988-02-09 JP disclosed