SCHEMBL31574437

SCHEMBL31574437

Cc1cc(C2CC(c3ccc(O)c(C)c3)CC(c3ccc(O)c(C)c3)C2)ccc1O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.48
TDP1 Q9NUW8 1/20 0.48
PDE10A Q9Y233 1/20 0.45
ESR1 P03372 9/20 0.43
ESR2 Q92731 8/20 0.43
QDPR P09417 4/20 0.43
AR P10275 3/20 0.41
KDM4E B2RXH2 1/20 0.39
ALDH1A1 P00352 1/20 0.39
CYP1A2 P05177 1/20 0.39
CYP3A4 P08684 1/20 0.39
CYP2D6 P10635 1/20 0.39
MAPT P10636 1/20 0.39
G6PD P11413 1/20 0.39
CYP2C9 P11712 1/20 0.39
PKM P14618 1/20 0.39
HPGD P15428 1/20 0.39
ALOX15 P16050 1/20 0.39
ALOX12 P18054 1/20 0.39
MAPK1 P28482 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31574440 0.92 ESR2 (0.44) TP53TDP1PDE10AESR1ESR2
SCHEMBL31574445 0.92 ESR2 (0.44) TP53TDP1PDE10AESR1ESR2
SCHEMBL6756908 0.92 TP53 (0.45) TP53TDP1PDE10AESR1ESR2
SCHEMBL22271934 0.90 TP53 (0.43) TP53TDP1PDE10AESR1ESR2
SCHEMBL930211 0.87 QDPR (0.52) TP53TDP1PDE10AESR1ESR2
SCHEMBL11026644 0.87 ACMSD (0.50) TP53TDP1PDE10AESR1ESR2
SCHEMBL7069800 0.83 ACMSD (0.56) TP53TDP1PDE10AESR1ESR2
SCHEMBL6056653 0.82 FYN (0.42) TP53TDP1ESR1ESR2AR
SCHEMBL10884357 0.82 ACMSD (0.57) TP53TDP1PDE10AESR1ESR2
SCHEMBL917464 0.82 ACMSD (0.57) TP53TDP1PDE10AESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120019086-A Vinyl compound, vinyl composition, cured vinyl resin, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and printed wiring board 住友化学株式会社 2025-05-16 CN disclosed