Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.42 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 3/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.31 |
| ▸ | TP53 | P04637 | 1/20 | 0.31 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.31 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Acrylic Acid SCHEMBL29501168 | 1.00 | LMNA (0.42) | LMNAALOX15HSD17B10TSHRALDH1A1 | |
| Acrylic Acid SCHEMBL3093957 | 1.00 | LMNA (0.42) | LMNAALOX15HSD17B10TSHRALDH1A1 | |
| Acrylic Acid SCHEMBL8498515 | 0.89 | ALDH1A1 (0.33) | LMNAALDH1A1TP53CYP3A4MAPK1 | |
| Acrylic Acid SCHEMBL29735550 | 0.86 | LMNA (0.40) | LMNAALOX15HSD17B10TSHRALDH1A1 | |
| Acrylic Acid SCHEMBL29364248 | 0.84 | LMNA (0.39) | LMNAALOX15HSD17B10TSHRALDH1A1 | |
| Acrylic Acid SCHEMBL29477363 | 0.83 | LMNA (0.46) | LMNAALOX15HSD17B10TSHRALDH1A1 | |
| Acrylic Acid SCHEMBL29285058 | 0.83 | LMNA (0.46) | LMNAALOX15HSD17B10TSHRALDH1A1 | |
| Acrylic Acid SCHEMBL30404328 | 0.82 | LMNA (0.37) | LMNAALOX15HSD17B10TSHRALDH1A1 | |
| Acrylic Acid SCHEMBL9173428 | 0.81 | ALDH1A1 (0.31) | ALDH1A1 | |
| Methacrylic Acid SCHEMBL35549 | 0.79 | TGFBR1 (0.37) | TSHRALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117779030-B | Silicon crystal tank liquid and environment-friendly metal surface treatment process | 开平和盟环保科技有限公司 | 2024-05-17 | — | — | CN | claimed |
| CN-111145935-B | Silver electrode slurry and preparation method and application thereof | 中国人民解放军国防科技大学 | 2022-07-15 | — | — | CN | claimed |
| EP-0283990-B1 | A heat-resistant photosensitive resin composition | TOKYO OHKA KOGYO CO LTD (JP) | 1994-01-26 | — | — | EP | claimed |
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-16 | — | — | US | disclosed |
| EP-4660704-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-20250355350-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-20 | — | — | US | disclosed |
| EP-4650874-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-19 | — | — | EP | disclosed |
| EP-4636011-A1 | POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-4636485-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-10-22 | — | — | EP | disclosed |
| US-12393130-B2 | Electrophotographic photosensitive member, process cartridge, and electrophotographic apparatus | CANON KABUSHIKI KAISHA (JP) | 2025-08-19 | — | — | US | disclosed |
| EP-3936576-B1 | BLACK ALUMINUM PIGMENT AND METHOD OF PRODUCING SAME | TOYO ALUMINIUM KK (JP) | 2025-05-28 | — | — | EP | disclosed |
| CN-114174351-A | Resin composition | 日产化学株式会社 | 2022-03-11 | — | — | CN | disclosed |
| US-10816900-B2 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-10-27 | — | — | US | disclosed |
| US-10203601-B2 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-02-12 | — | — | US | disclosed |
| US-20190018320-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-01-17 | — | — | US | disclosed |
| US-20180120702-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-05-03 | — | — | US | disclosed |
| EP-1901331-B1 | Plasma display panel | SAMSUNG SDI CO LTD (KR) | 2012-10-03 | — | — | EP | disclosed |
| US-8093814-B2 | Electrode-forming composition and plasma display panel manufactured using the same | SAMSUNG SDI CO., LTD. (KR) | 2012-01-10 | — | — | US | disclosed |
| US-20080067938-A1 | ELECTRODE-FORMING COMPOSITION AND PLASMA DISPLAY PANEL MANUFACTURED USING THE SAME | SAMSUNG SDI CO., LTD. (KR) | 2008-03-20 | — | — | US | disclosed |
| EP-1901331-A2 | Electrode-Forming Composition and Plasma Display Panel Manufactured Using the Same | Samsung SDI Co., Ltd. (KR) | 2008-03-19 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ARCN1, PRDM9, LBR | LMNA 1788/4885ALOX15 2767/4885HSD17B10 4284/4885 |
| US-20190018320-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | TET1, KDM2B, ARCN1 | LMNA 1385/4885ALOX15 1940/4885HSD17B10 4077/4885 |
| US-10816900-B2 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | TET1, KDM2B, ARCN1 | LMNA 1385/4885ALOX15 1940/4885HSD17B10 4077/4885 |
| US-20180120702-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | TET1, KDM1A, KDM2B | LMNA 1696/4885ALOX15 1533/4885HSD17B10 3719/4885 |
| US-10203601-B2 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | TET1, KDM1A, KDM2B | LMNA 1696/4885ALOX15 1533/4885HSD17B10 3719/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.