SCHEMBL31634612

SCHEMBL31634612

O=c1oc(=O)c2cc3c4ccccc4c3cc12

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH2 P05091 1/20 0.48
NPSR1 Q6W5P4 3/20 0.48
SMN1; SMN2 Q16637 3/20 0.48
RXFP1 Q9HBX9 2/20 0.48
NPC1 O15118 1/20 0.48
MAPK1 P28482 1/20 0.48
RAB9A P51151 1/20 0.48
KMT2A Q03164 1/20 0.48
ELANE P08246 4/20 0.46
LMNA P02545 3/20 0.46
ALDH1A1 P00352 3/20 0.46
MAPT P10636 3/20 0.46
HSD17B10 Q99714 2/20 0.46
GMNN O75496 1/20 0.46
TP53 P04637 1/20 0.46
CYP1A2 P05177 1/20 0.46
POLB P06746 1/20 0.46
CTSG P08311 1/20 0.46
CTSA P10619 1/20 0.46
CYP2D6 P10635 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30966887 0.86 ALDH1A1 (0.58) ALDH2NPSR1SMN1; SMN2RXFP1NPC1
SCHEMBL257 0.86 ALDH1A1 (0.58) ALDH2NPSR1SMN1; SMN2RXFP1NPC1
SCHEMBL29391754 0.86 ALDH1A1 (0.58) ALDH2NPSR1SMN1; SMN2RXFP1NPC1
SCHEMBL17456072 0.86 CYP1A2 (0.42) ALDH2NPSR1SMN1; SMN2RXFP1NPC1
SCHEMBL25994740 0.86 CYP1A2 (0.42) ALDH2NPSR1SMN1; SMN2RXFP1NPC1
SCHEMBL9313478 0.85 SMN1; SMN2 (0.50) ALDH2NPSR1SMN1; SMN2RXFP1NPC1
SCHEMBL30767392 0.85 SMN1; SMN2 (0.50) ALDH2NPSR1SMN1; SMN2RXFP1NPC1
SCHEMBL28252904 0.83 NPSR1 (0.57) ALDH2NPSR1SMN1; SMN2RXFP1NPC1
SCHEMBL29599746 0.83 NPSR1 (0.57) ALDH2NPSR1SMN1; SMN2RXFP1NPC1
SCHEMBL24891350 0.83 ELANE (0.61) ALDH2NPSR1SMN1; SMN2RXFP1NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120202243-A Thermosetting resin composition, cured film, substrate, and electronic component 捷恩智株式会社 2025-06-24 CN disclosed