SCHEMBL31664518

SCHEMBL31664518

CCCCN(CCCC)C(=O)CCCOC

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MMP1 P03956 1/20 0.47
MMP2 P08253 1/20 0.47
MMP3 P08254 1/20 0.47
MMP8 P22894 1/20 0.47
CA12 O43570 2/20 0.45
CA1 P00915 2/20 0.45
CA9 Q16790 2/20 0.45
LMNA P02545 1/20 0.45
ALDH1A1 P00352 3/20 0.43
HPGD P15428 1/20 0.42
HDAC3 O15379 1/20 0.42
HDAC1 Q13547 1/20 0.42
HDAC2 Q92769 1/20 0.42
HDAC6 Q9UBN7 1/20 0.42
NCOR2 Q9Y618 1/20 0.42
SIGMAR1 Q99720 1/20 0.39
CYP1A2 P05177 1/20 0.39
CYP3A4 P08684 1/20 0.39
CYP2D6 P10635 1/20 0.39
CYP2C19 P33261 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31664501 0.94 KDM5A (0.44) MMP1MMP2MMP3MMP8CA12
SCHEMBL31664528 0.90 ALDH1A1 (0.53) MMP1MMP2MMP3MMP8CA12
SCHEMBL15452905 0.90 MMP1 (0.48) MMP1MMP2MMP3MMP8CA12
SCHEMBL31664505 0.86 MMP1 (0.46) MMP1MMP2MMP3MMP8CA12
SCHEMBL31664509 0.86 MMP1 (0.46) MMP1MMP2MMP3MMP8CA12
SCHEMBL6706470 0.85 MMP1 (0.56) MMP1MMP2MMP3MMP8CA12
SCHEMBL1815422 0.85 ALDH1A1 (0.58) MMP1MMP2MMP3MMP8CA12
SCHEMBL31664507 0.85 MMP1 (0.44) MMP1MMP2MMP3MMP8CA12
SCHEMBL31664522 0.85 CES2 (0.44) MMP1MMP2MMP3MMP8CA12
SCHEMBL31664527 0.84 ALDH1A1 (0.42) MMP1MMP2MMP3MMP8CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250236812-A1 CLEANING AGENT COMPOSITION FOR SEMICONDUCTOR CLEANING, AND METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-07-24 US disclosed