SCHEMBL31664535

SCHEMBL31664535

CCCCCOCCCC(=O)N(CCCCC)CCCCC

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES2 O00748 2/20 0.44
MEN1 O00255 1/20 0.42
THRB P10828 1/20 0.42
HTT P42858 1/20 0.42
KMT2A Q03164 1/20 0.42
MAPT P10636 1/20 0.42
ZDHHC20 Q5W0Z9 1/20 0.42
LMNA P02545 1/20 0.42
ALDH1A1 P00352 2/20 0.41
HPGD P15428 1/20 0.40
MMP1 P03956 1/20 0.40
MMP2 P08253 1/20 0.40
MMP3 P08254 1/20 0.40
MMP8 P22894 1/20 0.40
KDM5A P29375 3/20 0.40
KDM5C P41229 1/20 0.39
KDM4C Q9H3R0 1/20 0.39
KDM5B Q9UGL1 1/20 0.39
DNM1 Q05193 1/20 0.39
CA12 O43570 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31664499 0.98 CES2 (0.47) CES2MEN1THRBHTTKMT2A
SCHEMBL31664530 0.96 TSHR (0.42) CES2MEN1THRBHTTKMT2A
SCHEMBL31664522 0.96 CES2 (0.44) CES2MEN1THRBHTTKMT2A
SCHEMBL31664525 0.95 LMNA (0.41) CES2MEN1THRBHTTKMT2A
SCHEMBL31664551 0.95 CES2 (0.47) CES2MEN1THRBHTTKMT2A
SCHEMBL31664523 0.93 LMNA (0.42) CES2LMNAALDH1A1HPGDMMP1
SCHEMBL31664497 0.93 CES2 (0.44) CES2MEN1THRBHTTKMT2A
SCHEMBL31664504 0.93 ALDH1A1 (0.48) CES2MEN1THRBHTTKMT2A
SCHEMBL20610438 0.91 CES2 (0.43) CES2LMNAALDH1A1HPGDMMP1
SCHEMBL31664495 0.91 CES2 (0.47) CES2MEN1THRBHTTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250236812-A1 CLEANING AGENT COMPOSITION FOR SEMICONDUCTOR CLEANING, AND METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-07-24 US disclosed