SCHEMBL3169248

SCHEMBL3169248

Cc1ncc(N)c(C)c1N

nearest known ligand 0.41

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
UHRF1 Q96T88 1/20 0.41
KDM4E B2RXH2 3/20 0.41
KMT2A Q03164 2/20 0.41
NOS3 P29474 6/20 0.32
NOS2 P35228 6/20 0.32
NOS1 P29475 4/20 0.32
CYP3A4 P08684 2/20 0.32
TSHR P16473 2/20 0.32
PIK3CA P42336 1/20 0.32
ALDH1A1 P00352 1/20 0.32
TP53 P04637 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
MEN1 O00255 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3665628 0.81 UHRF1 (0.42) UHRF1KDM4EKMT2ANOS3NOS2
SCHEMBL3190363 0.81 UHRF1 (0.42) UHRF1KDM4EKMT2ANOS3NOS2
SCHEMBL13485983 0.79 NOS3 (0.41) UHRF1KDM4EKMT2ANOS3NOS2
SCHEMBL3840770 0.79 NOS3 (0.42) UHRF1KDM4EKMT2ANOS3NOS2
SCHEMBL29756246 0.79 NOS3 (0.41) UHRF1KDM4EKMT2ANOS3NOS2
SCHEMBL24843657 0.75 UHRF1 (0.38) UHRF1KDM4EKMT2ANOS3NOS2
SCHEMBL9938081 0.75 UHRF1 (0.38) UHRF1KDM4EKMT2ANOS3NOS2
SCHEMBL16914054 0.75 KDM4E (0.38) UHRF1KDM4EKMT2ANOS3NOS2
SCHEMBL25393497 0.75 KDM4E (0.38) KDM4EKMT2ANOS3NOS2NOS1
SCHEMBL9939737 0.75 LMNA (0.44) UHRF1KDM4EKMT2ANOS3NOS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1326138-B1 NEGATIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION AND METHOD OF FORMING IMAGE FROM THE SAME PI R & D CO LTD (JP) 2014-11-05 EP claimed
US-7648815-B2 Solvent solubility; adhesive; heat resistance; dielectric film pattern PI R&D CO., LTD. (JP) 2010-01-19 US claimed
US-9220671-B2 Dye composition comprising at least four dye precursors including at least one oxidation base and at least one coupler L'OREAL (FR) 2015-12-29 US disclosed
EP-1326138-B1 NEGATIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION AND METHOD OF FORMING IMAGE FROM THE SAME PI R & D CO LTD (JP) 2014-11-05 EP disclosed
US-7648815-B2 Solvent solubility; adhesive; heat resistance; dielectric film pattern PI R&D CO., LTD. (JP) 2010-01-19 US disclosed
US-20040041129-A1 Solvent solubility; adhesive; heat resistance; dielectric film pattern PI R&D CO., LTD. (JP) 2004-03-04 US disclosed
US-6627377-B1 Soluble in organic solvents, which excels in adhesiveness, heat resistance, mechanical properties and flexibility, which shows properties of alkali-soluble highly sensitive positive-type photoresist PI R&D CO., LTD. (JP) 2003-09-30 US disclosed
EP-1326138-A1 NEGATIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION AND METHOD OF FORMING IMAGE FROM THE SAME PI R & D Co., Ltd. (JP) 2003-07-09 EP disclosed
EP-1024407-A1 POSITIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION PI R & D Co Ltd (JP) 2000-08-02 EP disclosed