Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.34 |
| ▸ | TSHR | P16473 | 3/20 | 0.32 |
| ▸ | THRB | P10828 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16553409 | 0.77 | ALDH1A1 (0.39) | ALDH1A1TSHRTHRB | |
| SCHEMBL2143318 | 0.76 | ALDH1A1 (0.35) | ALDH1A1TSHRTHRB | |
| SCHEMBL11896929 | 0.76 | ALDH1A1 (0.35) | ALDH1A1TSHRTHRB | |
| SCHEMBL10912883 | 0.76 | ALDH1A1 (0.38) | ALDH1A1TSHR | |
| SCHEMBL3675285 | 0.76 | ALDH1A1 (0.38) | ALDH1A1TSHRTHRB | |
| SCHEMBL8595973 | 0.75 | ALDH1A1 (0.41) | ALDH1A1TSHRTHRB | |
| SCHEMBL4871064 | 0.75 | ALDH1A1 (0.31) | ALDH1A1TSHR | |
| SCHEMBL11224859 | 0.75 | TSHR (0.33) | ALDH1A1TSHR | |
| SCHEMBL2641113 | 0.73 | ALDH1A1 (0.35) | ALDH1A1TSHRTHRB | |
| SCHEMBL28357452 | 0.73 | ALDH1A1 (0.35) | ALDH1A1TSHRTHRB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024080308-A1 | COMPOSITION CONTAINING PEPTIDE, SURFACTANT, AND POLYMER | 中外製薬株式会社 | 2024-04-18 | — | — | WO | disclosed |
| EP-2978009-B1 | HANDLE SUBSTRATE, COMPOSITE SUBSTRATE FOR SEMICONDUCTOR, AND SEMICONDUCTOR CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME | NGK INSULATORS LTD (JP) | 2018-03-21 | — | — | EP | disclosed |
| US-9425083-B2 | Handle substrate, composite substrate for semiconductor, and semiconductor circuit board and method for manufacturing the same | NGK INSULATORS, LTD. (JP) | 2016-08-23 | — | — | US | disclosed |
| EP-2978009-A1 | HANDLE SUBSTRATE, COMPOSITE SUBSTRATE FOR SEMICONDUCTOR, AND SEMICONDUCTOR CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING SAME | NGK Insulators, Ltd. (JP) | 2016-01-27 | — | — | EP | disclosed |
| US-20160005643-A1 | Handle Substrate, Composite Substrate for Semiconductor, and Semiconductor Circuit Board and Method for Manufacturing the Same | NGK INSULATORS, LTD. (JP) | 2016-01-07 | — | — | US | disclosed |
| US-8778118-B2 | Manufacturing method of laser processed parts, and pressure-sensitive adhesive sheet for laser processing used for the same | NITTO DENKO CORPORATION (JP) | 2014-07-15 | — | — | US | disclosed |
| US-8624156-B2 | Manufacturing method of laser processed parts and protective sheet for laser processing | NITTO DENKO CORPORATION (JP) | 2014-01-07 | — | — | US | disclosed |
| US-20100273313-A1 | MANUFACTURING METHOD OF LASER PROCESSED PARTS, AND PRESSURE-SENSITIVE ADHESIVE SHEET FOR LASER PROCESSING USED FOR THE SAME | URAIRI MASAKATSU | 2010-10-28 | — | — | US | disclosed |
| US-7767556-B2 | Adhesive sheet for laser dicing and its manufacturing method | NITTO DENKO CORPORATION (JP) | 2010-08-03 | — | — | US | disclosed |
| US-20090253231-A1 | ADHESIVE SHEET FOR LASER DICING AND ITS MANUFACTURING METHOD | OKAWA YUJI | 2009-10-08 | — | — | US | disclosed |
| US-20060246279-A1 | Method of producing laser-processed product and adhesive sheet, for laser processing used therefor | NITTO DENKO CORPORATION (JP) | 2006-11-02 | — | — | US | disclosed |
| EP-1714730-A1 | LASER PROCESSING PROTECTION SHEET AND PRODUCTION METHODFOR LASER PROCESSED ARTICLE | Nitto Denko Corporation (JP) | 2006-10-25 | — | — | EP | disclosed |
| US-20060228650-A1 | Manufacturing method of laser processed parts and protective sheet for laser processing | NITTO DENKO CORPORATION (JP) | 2006-10-12 | — | — | US | disclosed |
| EP-1681130-A1 | Method of manufacturing parts by laser using an adhesive having an extinction coefficient of 1 or more ; adhesive sheet for laser processing parts used in such method | Nitto Denko Corporation (JP) | 2006-07-19 | — | — | EP | disclosed |
| EP-1634673-A1 | METHOD OF PRODUCING LASER-PROCESSED PRODUCT AND ADHESIVE SHEET, FOR LASER PROCESSING USED THEREFOR | Nitto Denko Corporation (JP) | 2006-03-15 | — | — | EP | disclosed |
| US-20050186709-A1 | Adhesive sheet for laser dicing and its manufacturing method | NITTO DENKO CORPORATION (JP) | 2005-08-25 | — | — | US | disclosed |
| EP-1566236-A1 | Adhesive sheet for laser dicing having a controlled average surface roughness (Ra) and its manufacturing method | Nitto Denko Corporation (JP) | 2005-08-24 | — | — | EP | disclosed |
| US-20040180148-A1 | Glass crack prevention laminate and liquid crystal display device | NITTO DENKO CORPORATION | 2004-09-16 | — | — | US | disclosed |
| US-5169886-A | Copolymer of n,n-dimethylamino (meth)acrylate and another (meth)acrylate ester | GIULINI CHEMIE GMBH (DE) | 1992-12-08 | — | — | US | disclosed |
| US-5116924-A | Acrylic copolymers | GUILINI CHEMIE GMBH (DE) | 1992-05-26 | — | — | US | disclosed |