SCHEMBL3202384

SCHEMBL3202384

C[SiH](F)c1ccccc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL703210 0.73 ALDH1A1 (0.35)
SCHEMBL703367 0.73
SCHEMBL124751 0.73 TSHR (0.39)
SCHEMBL55166 0.73
SCHEMBL1539360 0.73 TSHR (0.39)
SCHEMBL16490334 0.73 ACHE (0.43)
SCHEMBL14875991 0.71 TSHR (0.37)
Hydrochloric Acid SCHEMBL11803910 0.71 TSHR (0.37)
SCHEMBL2522935 0.71 TSHR (0.37)
SCHEMBL2799322 0.71 TSHR (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3355390-B1 LITHIUM SECONDARY BATTERY INCLUDING ELECTROLYTE CONTAINING MONOFLUOROSILANE COMPOUND SAMSUNG ELECTRONICS CO LTD (KR) 2020-02-12 EP disclosed
EP-3355390-A1 LITHIUM SECONDARY BATTERY INCLUDING ELECTROLYTE CONTAINING MONOFLUOROSILANE COMPOUND Samsung Electronics Co., Ltd. (KR) 2018-08-01 EP disclosed
US-8791221-B2 Addition-curable metallosiloxane compound DAICEL CORPORATION (JP) 2014-07-29 US disclosed
EP-2650319-A1 ADDITION-CURABLE METALLOSILOXANE COMPOUND Daicel Corporation (JP) 2013-10-16 EP disclosed
US-20130267653-A1 ADDITION-CURABLE METALLOSILOXANE COMPOUND DAICEL CORPORATION (JP) 2013-10-10 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed
US-5635579-A MIXING FLUOROSILICONE CYCLIC OLIGOMER, METHYLSILOXANE CYCLIC OLIGOMER, PHENYLSILOXANE CYCLIC OLIGOMER, CHAIN STOPPER, RING OPENING CATALYST, HEATING TO FORM FLUOROSILICONE TERPOLYMERIC FLUID GENERAL ELECTRIC COMPANY (US) 1997-06-03 US disclosed