SCHEMBL3205330

SCHEMBL3205330

CCCCOC(=O)C1(C(C)CC(C)(C)C)OO1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.38
ATM Q13315 1/20 0.36
TSHR P16473 4/20 0.34
HPGD P15428 2/20 0.34
SMN1; SMN2 Q16637 4/20 0.33
LMNA P02545 2/20 0.33
ESR1 P03372 2/20 0.33
MAPK1 P28482 2/20 0.33
CYP1A2 P05177 1/20 0.33
CYP2D6 P10635 1/20 0.33
CYP2C19 P33261 1/20 0.33
NR1H2 P55055 1/20 0.33
RNASEL Q05823 1/20 0.33
HCAR2 Q8TDS4 1/20 0.33
L3MBTL1 Q9Y468 3/20 0.32
NPC1 O15118 2/20 0.32
RAB9A P51151 2/20 0.32
POLB P06746 1/20 0.32
TDP1 Q9NUW8 2/20 0.32
NAAA Q02083 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5147618 0.74 ALDH1A1 (0.39) ALDH1A1ATMTSHRHPGDSMN1; SMN2
SCHEMBL17200969 0.72 ALDH1A1 (0.40) ALDH1A1ATMTSHRHPGDSMN1; SMN2
SCHEMBL8138522 0.72 ALDH1A1 (0.40) ALDH1A1ATMTSHRHPGDSMN1; SMN2
SCHEMBL6234059 0.68 NAAA (0.43) ALDH1A1ATMTSHRHPGDSMN1; SMN2
SCHEMBL634898 0.68 NAAA (0.37) ALDH1A1ATMTSHRHPGDSMN1; SMN2
SCHEMBL2760522 0.67 ALDH1A1 (0.45) ALDH1A1ATMTSHRHPGDSMN1; SMN2
SCHEMBL25669201 0.67 ALDH1A1 (0.41) ALDH1A1ATMTSHRHPGDSMN1; SMN2
SCHEMBL7933395 0.67 NAAA (0.42) ALDH1A1TSHRLMNAHCAR2NAAA
SCHEMBL9679728 0.66 ATM (0.42) ALDH1A1ATMTSHRHPGDSMN1; SMN2
SCHEMBL28342758 0.65 NAAA (0.47) ALDH1A1ATMTSHRLMNAMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230357476-A1 RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, AND CURED BODY SEKISUI CHEMICAL CO., LTD. (JP) 2023-11-09 US disclosed
EP-4212559-A1 RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, AND CURED BODY SEKISUI CHEMICAL CO., LTD. (JP) 2023-07-19 EP disclosed
US-20230114335-A1 A CROSSLINKING MATERIAL AND USES THEREOF PPG INDUSTRIES OHIO, INC. (US) 2023-04-13 US disclosed
EP-4126989-A1 A CROSSLINKING MATERIAL AND USES THEREOF PPG Industries Ohio Inc. (US) 2023-02-08 EP disclosed
WO-2021195329-A1 A CROSSLINKING MATERIAL AND USES THEREOF PPG INDUSTRIES OHIO, INC. (US) 2021-09-30 WO disclosed
US-10633466-B2 Low density polyethylene of high clarity, film made therefrom and a process for producing such film EQUISTAR CHEMICALS, LP (US) 2020-04-28 US disclosed
WO-2019216311-A1 RUBBER COMPOSITION NOK株式会社 (JP) 2019-11-14 WO disclosed
EP-3065944-A1 MODIFICATION OF POLYAMIDES Arkema, Inc. (US) 2016-09-14 EP disclosed
EP-2935365-A1 PROCESS FOR COPOLYMERIZING ETHYLENE AND ESTERS OF VINYL ALCOHOL Basell Polyolefine GmbH (DE) 2015-10-28 EP disclosed
WO-2015069455-A1 MODIFICATION OF POLYAMIDES ARKEMA INC. (US) 2015-05-14 WO disclosed
US-6165549-A Process for producing solvent-free acrylic sheet SOKEN CHEMICAL & ENGINEERING CO., LTD. (JP) 2000-12-26 US disclosed
EP-0328036-B1 Photopolymerizable composition HOECHST CELANESE CORP (US) 1994-03-30 EP disclosed
EP-0190021-B1 HEAT-FOAMABLE CROSSLINKED PROPYLENE RESIN COMPOSITION MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1991-09-11 EP disclosed
US-4940648-A PEROXIDE OR PERESTER, 9-PHENYLACRIDINE OR PHENAZINE PHOTOINITIATOR HOECHST CELANESE CORPORATION (US) 1990-07-10 US disclosed
US-4916165-A Heat-foamable crosslinked propylene resin composition in the form of a melt-shaped sheet structure MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1990-04-10 US disclosed
US-4870114-A HEAT RESISTANCE, STRENGTH, RIGIDITY MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1989-09-26 US disclosed
EP-0330504-A2 Photosensitive material and image forming method CANON KABUSHIKI KAISHA (JP) 1989-08-30 EP disclosed
EP-0328036-A2 Photopolymerizable composition HOECHST CELANESE CORPORATION (US) 1989-08-16 EP disclosed
EP-0190021-A2 Heat-foamable crosslinked propylene resin composition MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1986-08-06 EP disclosed
US-4474868-A ORGANIC PEROXIDE AND COMPOUND CONTAINING CATIONIC OXYGEN, SULFUR OXYGEN,SULFUR OR SELENIUM NIPPON OIL AND FATS CO., LTD. (JP) 1984-10-02 US disclosed