SCHEMBL321962

SCHEMBL321962

c1ccc2c(-c3cnccn3)c3ccccc3nc2c1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
METAP2 P50579 1/20 0.54
CYP3A4 P08684 5/20 0.48
KMT2A Q03164 3/20 0.44
RAD52 P43351 2/20 0.44
PIM1 P11309 1/20 0.41
ALDH1A1 P00352 5/20 0.41
KDM4E B2RXH2 5/20 0.41
SMN1; SMN2 Q16637 3/20 0.41
GLA P06280 3/20 0.41
MAOA P21397 2/20 0.41
HPGD P15428 2/20 0.41
CASP1 P29466 2/20 0.41
CASP7 P55210 2/20 0.41
HSD17B10 Q99714 2/20 0.41
TDP1 Q9NUW8 2/20 0.41
CHRM2 P08172 1/20 0.41
ADRA2A P08913 1/20 0.41
ADORA3 P0DMS8 1/20 0.41
CHRM1 P11229 1/20 0.41
NQO2 P16083 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29660606 1.00 METAP2 (0.54) METAP2CYP3A4KMT2ARAD52PIM1
SCHEMBL9875643 0.84 METAP2 (0.48) METAP2CYP3A4KMT2ARAD52PIM1
SCHEMBL22470160 0.81 PIM1 (0.46) METAP2CYP3A4KMT2APIM1ALDH1A1
SCHEMBL21560819 0.81 PIM1 (0.46) METAP2CYP3A4PIM1ALDH1A1KDM4E
SCHEMBL21560905 0.81 PIM1 (0.46) METAP2CYP3A4PIM1ALDH1A1KDM4E
SCHEMBL21560750 0.81 PIM1 (0.46) METAP2CYP3A4PIM1ALDH1A1KDM4E
SCHEMBL21560825 0.81 PIM1 (0.46) METAP2CYP3A4PIM1ALDH1A1KDM4E
SCHEMBL29488283 0.80 METAP1 (0.58) METAP2KMT2AALDH1A1KDM4ESMN1; SMN2
SCHEMBL321429 0.80 METAP1 (0.58) METAP2KMT2AALDH1A1KDM4ESMN1; SMN2
SCHEMBL24433150 0.80 PIM1 (0.45) METAP2CYP3A4KMT2APIM1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 83 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106233205-B Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package 日立化成株式会社 2020-06-23 CN claimed
CN-101290471-B Photoresist combination and laminating body ASAHI KASEI EMD CORP 2011-07-06 CN claimed
CN-101290471-A Photoresist combination and laminating body ASAHI KASEI EMD CORP (JP) 2008-10-22 CN claimed
CN-111315828-B Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2023-09-29 CN disclosed
CN-112154167-B Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2023-08-22 CN disclosed
CN-110114376-B Curable composition, method for producing cured product, cured product thereof, and adhesive using same 株式会社ADEKA 2022-06-14 CN disclosed
EP-3339331-B1 COMPOSITION ADEKA CORP (JP) 2022-02-16 EP disclosed
CN-108419438-B Coloring composition 株式会社艾迪科 2021-10-01 CN disclosed
US-11054744-B2 Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package SHOWA DENKO MATERIALS CO., LTD. (JP) 2021-07-06 US disclosed
CN-112154167-A Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2020-12-29 CN disclosed
CN-111566173-A Coating composition, method for curing the composition, barrier film, and method for producing cured product 株式会社艾迪科 2020-08-21 CN disclosed
CN-101194191-A Process for producing color filter, color filter, liquid crystal display element, and liquid crystal display device FUJI FILM CORP (JP) 2008-06-04 CN disclosed
CN-101101444-A Light-sensitive resin composition, light-sensitive transfer printing material, separating wall and manufacturing method thereof, color filter and manufacturing method thereof, and displaying device FUJIFILM CORP (JP) 2008-01-09 CN disclosed
WO-2007089040-A1 LIQUID CRYSTAL DISPLAY DEVICE AND COLOR FILM PLATE, AND PROCESSES FOR PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2007-08-09 WO disclosed
CN-1721991-A Production method for photosensitive resin composition and element and related members HITACHI CHEMICAL CO LTD (JP) 2006-01-18 CN disclosed
CN-1228688-C Photosensitive resin composition, photosensitive element, method for producing protective layer pattern, and method for producing printed wiring board HITACHI CHEMICAL CO LTD (JP) 2005-11-23 CN disclosed
CN-1432141-A Photosensitive resin composition, photosensitive element, method for producing protective layer pattern, and method for producing printed wiring board HITACHI CHEMICAL CO LTD (JP) 2003-07-23 CN disclosed
EP-0305545-B1 SUBSTITUTED ACRIDINE DERIVATIVES AND THEIR USE Hitachi Chemical Co., Ltd. (JP) 1993-02-10 EP disclosed
US-5045433-A Photopolymerization initiators HITACHI CHEMICAL CO., LTD. (JP) 1991-09-03 US disclosed
EP-0305545-A1 SUBSTITUTED ACRIDINE DERIVATIVES AND THEIR USE Hitachi Chemical Co., Ltd. (JP) 1989-03-08 EP disclosed