⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL649188 | 0.81 | KDM4E (0.36) | — | |
| SCHEMBL5033176 | 0.79 | GABRA1 (0.37) | — | |
| SCHEMBL29208988 | 0.78 | ALDH1A1 (0.34) | — | |
| SCHEMBL8764835 | 0.76 | ALDH1A1 (0.32) | — | |
| SCHEMBL2519387 | 0.75 | KDM4E (0.41) | — | |
| SCHEMBL11805129 | 0.73 | TYR (0.37) | — | |
| SCHEMBL25368407 | 0.72 | GAA (0.40) | — | |
| SCHEMBL30588918 | 0.72 | GAA (0.40) | — | |
| SCHEMBL23365341 | 0.72 | TDP1 (0.36) | — | |
| SCHEMBL2466440 | 0.71 | L3MBTL1 (0.44) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107400198-B | Epoxy resin composition and cured product thereof | 日铁化学材料株式会社 | 2020-12-22 | — | — | CN | disclosed |
| US-20200259104-A1 | ORGANIC ELECTROLUMINESCENCE DEVICE AND MONOAMINE COMPOUND FOR ORGANIC ELECTROLUMINESCENCE DEVICE | SAMSUNG DISPLAY CO., LTD. (KR) | 2020-08-13 | — | — | US | disclosed |
| US-10059798-B2 | Active ester resin, epoxy resin composition, cured product thereof, prepreg, circuit board, and build-up film | DIC CORPORATION (JP) | 2018-08-28 | — | — | US | disclosed |
| US-9580634-B2 | Phenolic-hydroxyl-containing resin, epoxy resin, curable resin composition, substance obtained by curing same, and semiconductor sealant | DIC CORPORATION (JP) | 2017-02-28 | — | — | US | disclosed |
| EP-2589625-B1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM | DAINIPPON INK & CHEMICALS (JP) | 2016-10-26 | — | — | EP | disclosed |
| US-20150344617-A1 | ACTIVE ESTER RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM | DIC CORPORATION (JP) | 2015-12-03 | — | — | US | disclosed |
| US-20150291861-A1 | PHENOLIC-HYDROXYL-CONTAINING RESIN, EPOXY RESIN, CURABLE RESIN COMPOSITION, SUBSTANCE OBTAINED BY CURING SAME, AND SEMICONDUCTOR SEALANT | DIC CORPORATION (JP) | 2015-10-15 | — | — | US | disclosed |
| US-8669333-B2 | Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up film | DIC CORPORATION (JP) | 2014-03-11 | — | — | US | disclosed |
| EP-2589625-A1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM | DIC Corporation (JP) | 2013-05-08 | — | — | EP | disclosed |
| US-20130101857-A1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR ENCAPSULATING MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM | DIC CORPORATION (JP) | 2013-04-25 | — | — | US | disclosed |
| US-8084567-B2 | Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin | DAINIPPON INK & CHEMICALS, INC. (JP) | 2011-12-27 | — | — | US | disclosed |
| US-7718741-B2 | Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2010-05-18 | — | — | US | disclosed |
| US-20100056747-A1 | EPOXY RESIN COMPOSITION AND CURED ARTICLE THEREOF, NOVEL EPOXY RESIN AND PRODUCTION METHOD THEREOF, AND NOVEL PHENOL RESIN | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2010-03-04 | — | — | US | disclosed |
| US-20090069490-A1 | EPOXY RESIN COMPOSITION AND CURED ARTICLE THEREOF, NOVEL EPOXY RESIN AND PRODUCTION METHOD THEREOF, AND NOVEL PHENOL RESIN | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2009-03-12 | — | — | US | disclosed |