SCHEMBL3236019

SCHEMBL3236019

C=Nc1cc(CC2CO2)c(CC2CO2)c(CC2CO2)c1CC1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9108436 0.74 ALDH1A1 (0.31)
SCHEMBL8928195 0.73
SCHEMBL29189744 0.69
SCHEMBL29523199 0.68
SCHEMBL11058141 0.67
SCHEMBL8650783 0.66
SCHEMBL1673437 0.64 HTR2A (0.39)
SCHEMBL2778676 0.63 ALDH1A1 (0.39)
SCHEMBL31651031 0.62 ALDH1A1 (0.31)
SCHEMBL8195431 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0145165-B1 PROCESS FOR IMPROVING MECHANICAL PROPERTIES OF EPOXY RESINS BY ADDITION OF COBALT IONS NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) 1987-04-01 EP claimed
EP-0145165-A1 Process for improving mechanical properties of epoxy resins by addition of cobalt ions NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) 1985-06-19 EP claimed
US-12466113-B2 Internal mold release agent-containing fiber-reinforced composite molded article TORAY INDUSTRIES, INC. (JP) 2025-11-11 US disclosed
US-20230106971-A1 INTERNAL MOLD RELEASE AGENT-CONTAINING FIBER-REINFORCED COMPOSITE MOLDED ARTICLE TORAY INDUSTRIES, INC. (JP) 2023-04-06 US disclosed
EP-4108403-A1 INTERNAL MOLD RELEASE AGENNT-CONTAINING FIBER-REINFORCED COMPOSITE MOLDED ARTICLE Toray Industries, Inc. (JP) 2022-12-28 EP disclosed
US-10696016-B2 Window film and flexible display including the same SAMSUNG SDI CO., LTD. (KR) 2020-06-30 US disclosed
US-20170028677-A1 WINDOW FILM AND FLEXIBLE DISPLAY INCLUDING THE SAME SAMSUNG SDI CO., LTD. (KR) 2017-02-02 US disclosed
US-20160053138-A1 WINDOW FILM AND DISPLAY INCLUDING THE SAME SAMSUNG SDI CO., LTD. (KR) 2016-02-25 US disclosed
EP-1656414-B1 METHOD FOR JOINING PIPING SYSTEMS AND PIPING TO EQUIPMENT, FIXTURES, DEVICES, STRUCTURES, AND APPLIANCES DOW GLOBAL TECHNOLOGIES LLC (US) 2013-04-10 EP disclosed
WO-2010021888-A1 IMPROVED METHOD FOR JOINING PIPING SYSTEMS AND PIPING TO EQUIPMENT, FIXTURES, DEVICES, STRUCTURES, AND APPLIANCES DOW GLOBAL TECHNOLOGIES INC. (US) 2010-02-25 WO disclosed
US-7638007-B2 Method for joining substrates and objects DOW GLOBAL TECHNOLOGIES, INC (US) 2009-12-29 US disclosed
EP-1656414-A1 METHOD FOR JOINING PIPING SYSTEMS AND PIPING TO EQUIPMENT, FIXTURES, DEVICES, STRUCTURES, AND APPLIANCES DOW GLOBAL TECHNOLOGIES INC. (US) 2006-05-17 EP disclosed
EP-1656413-A1 METHOD FOR JOINING SUBSTRATES AND OBJECTS DOW GLOBAL TECHNOLOGIES INC. (US) 2006-05-17 EP disclosed
WO-2005017005-A1 METHOD FOR JOINING SUBSTRATES AND OBJECTS DOW GLOBAL TECHNOLOGIES INC. (US) 2005-02-24 WO disclosed
WO-2005017006-A1 METHOD FOR JOINING PIPING SYSTEMS AND PIPING TO EQUIPMENT, FIXTURES, DEVICES, STRUCTURES, AND APPLIANCES DOW GLOBAL TECHNOLOGIES INC. (US) 2005-02-24 WO disclosed
EP-1483304-A2 ORGANOBORANE AMINE COMPLEX POLYMERIZATION INITIATORS AND POLYMERIZABLE COMPOSITIONS DOW GLOBAL TECHNOLOGIES INC. (US) 2004-12-08 EP disclosed
US-6762260-B2 MIXTURES OF ACTIVATORS, LEWIS ACID CATALYSTS AND HETEROCYCLIC AMINES OR ETHERS, USED AS ADHESIVES OR COATINGS DOW GLOBAL TECHNOLOGIES INC. 2004-07-13 US disclosed
US-20040082743-A1 Organoborane amine complex polymerization initiators and polymerizable compositions SONNENSCHEIN MARK F (US) 2004-04-29 US disclosed
US-20030181611-A1 Organoborane amine complex polymerization initiators and polymerizable compositions DOW GLOBAL TECHNOLOGIES INC. 2003-09-25 US disclosed
WO-2003076485-A2 ORGANOBORANE AMINE COMPLEX POLYMERIZATION INITIATORS AND POLYMERIZABLE COMPOSITIONS DOW GLOBAL TECHNOLOGIES INC. (US) 2003-09-18 WO disclosed