SCHEMBL9108436

SCHEMBL9108436

Cc1cc(CC2CO2)c(CC2CO2)c(CC2CO2)c1CC1CO1

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.31
GLA P06280 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethane SCHEMBL29193627 0.79 SHBG (0.30)
SCHEMBL703870 0.78 TYR (0.31)
SCHEMBL8928195 0.78
SCHEMBL30490439 0.78
SCHEMBL708659 0.77 ALDH1A1 (0.33) ALDH1A1GLA
Ethane SCHEMBL27740029 0.77 CYP1A2 (0.30)
SCHEMBL6660500 0.76 TDP1 (0.34) ALDH1A1GLA
SCHEMBL3236019 0.74
SCHEMBL29231877 0.74
SCHEMBL30865852 0.73 ALDH1A1 (0.33) ALDH1A1GLA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120139131-A1 WAFER MOLD MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-06-07 US disclosed
EP-2461356-A1 Wafer mold material and method for manufacturing semiconductor apparatus Shin-Etsu Chemical Co., Ltd. (JP) 2012-06-06 EP disclosed