Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HTR6 | P50406 | 7/20 | 0.73 |
| ▸ | TSHR | P16473 | 3/20 | 0.73 |
| ▸ | LMNA | P02545 | 2/20 | 0.73 |
| ▸ | MPO | P05164 | 1/20 | 0.73 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.73 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.73 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.67 |
| ▸ | PKM | P14618 | 2/20 | 0.67 |
| ▸ | ANXA2 | P07355 | 1/20 | 0.61 |
| ▸ | S100A10 | P60903 | 1/20 | 0.61 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.59 |
| ▸ | MEN1 | O00255 | 1/20 | 0.59 |
| ▸ | CA1 | P00915 | 4/20 | 0.50 |
| ▸ | CA2 | P00918 | 4/20 | 0.50 |
| ▸ | CA12 | O43570 | 2/20 | 0.50 |
| ▸ | CA4 | P22748 | 2/20 | 0.50 |
| ▸ | CA9 | Q16790 | 2/20 | 0.50 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.50 |
| ▸ | USP2 | O75604 | 1/20 | 0.50 |
| ▸ | CA6 | P23280 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Dapsone SCHEMBL26667340 | 0.91 | LMNA (0.83) | HTR6TSHRLMNAMPOCYP3A4 | |
| SCHEMBL34500 | 0.91 | LMNA (0.83) | HTR6TSHRLMNAMPOCYP3A4 | |
| SCHEMBL29692583 | 0.91 | LMNA (0.83) | HTR6TSHRLMNAMPOCYP3A4 | |
| SCHEMBL8721954 | 0.91 | LMNA (0.83) | HTR6TSHRLMNAMPOCYP3A4 | |
| SCHEMBL15690986 | 0.90 | HTR6 (0.59) | HTR6TSHRLMNAMPOCYP3A4 | |
| Dapsone SCHEMBL1294601 | 0.86 | HTR6 (0.73) | HTR6TSHRLMNAMPOCYP3A4 | |
| SCHEMBL1100221 | 0.86 | LMNA (0.91) | HTR6TSHRLMNAMPOCYP3A4 | |
| SCHEMBL20389273 | 0.86 | HTR6 (0.59) | HTR6TSHRLMNAMPOCYP3A4 | |
| SCHEMBL8867135 | 0.86 | HTR6 (0.59) | HTR6TSHRLMNAMPOCYP3A4 | |
| SCHEMBL8866046 | 0.86 | MEN1 (0.66) | HTR6TSHRLMNAMPOCYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 195 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240218126-A1 | POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-07-04 | — | — | US | claimed |
| EP-4393981-A1 | POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF | PI Advanced Materials Co., Ltd. (KR) | 2024-07-03 | — | — | EP | claimed |
| WO-2024117669-A1 | POLYIMIDE VARNISH FOR COATING CONDUCTOR WITH IMPROVED HEAT DISSIPATION FOR COATING CONDUCTOR AND POLYIMIDE COATING MATERIAL COMPRISING THE SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-06-06 | — | — | WO | claimed |
| WO-2024112104-A1 | POLYIMIDE FILM COMPRISING ADDITIVE AND GRAPHITE SHEET PREPARED BY USING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-05-30 | — | — | WO | claimed |
| WO-2024076094-A1 | BLACK POLYIMIDE FILM AND THE MANUFACTURING METHOD THEREOF | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-04-11 | — | — | WO | claimed |
| US-20240026098-A1 | POLYIMIDE FILM HAVING HIGH DIMENSIONAL STABILITY AND MANUFACTURING METHOD THEREFOR | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-01-25 | — | — | US | claimed |
| WO-2023243967-A1 | BLACK POLYIMIDE FILM AND MANUFACTURING METHOD THEREOF | PI ADVANCED MATERIALS CO., LTD. (KR) | 2023-12-21 | — | — | WO | claimed |
| WO-2023200191-A1 | MANUFACTURING METHOD OF POLYIMIDE POWDER AND POLYIMIDE POWDER MANUFACTURED BY THE SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2023-10-19 | — | — | WO | claimed |
| WO-2023191434-A1 | POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR | 피아이첨단소재 주식회사 | 2023-10-05 | — | — | WO | claimed |
| US-20230002613-A1 | LOW-DIELECTRIC-CONSTANT POLYIMIDE COMPOSITE POWDER, AND METHOD FOR PRODUCING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2023-01-05 | — | — | US | claimed |
| US-20240228792-A1 | BLACK VARNISH AND FILM CONTAINING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-07-11 | — | — | US | disclosed |
| US-20240218126-A1 | POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-07-04 | — | — | US | disclosed |
| EP-4393981-A1 | POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF | PI Advanced Materials Co., Ltd. (KR) | 2024-07-03 | — | — | EP | disclosed |
| WO-2024117669-A1 | POLYIMIDE VARNISH FOR COATING CONDUCTOR WITH IMPROVED HEAT DISSIPATION FOR COATING CONDUCTOR AND POLYIMIDE COATING MATERIAL COMPRISING THE SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-06-06 | — | — | WO | disclosed |
| WO-2024112104-A1 | POLYIMIDE FILM COMPRISING ADDITIVE AND GRAPHITE SHEET PREPARED BY USING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-05-30 | — | — | WO | disclosed |
| US-6183934-B1 | FOE USE IN FORMATION OF PATTERN OF INSULATION FILM, PASSIVATION FILM, .ALPHA.-RAY SHIELDING FILM, OPTICAL WAVEGUIDE | KABUSHIKI KAISHA TOSHIBA (JP) | 2001-02-06 | — | — | US | disclosed |
| US-6159654-A | Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating | KABUSHIKI KAISHA TOSHIBA (JP) | 2000-12-12 | — | — | US | disclosed |
| US-6001517-A | A THERMOSETTING POLYMER WHICH CAN BE CURED THROUGH CYCLODEHYDRATION UPON HEATING AND A CURE ACCELERATOR WHICH CAN BE DEACTIVATED OF ITS CURE ACCELERATION PROPERTY BY IRRIDIATION OF LIGHT | KABUSHIKI KAISHA TOSHIBA (JP) | 1999-12-14 | — | — | US | disclosed |
| US-5756650-A | COMPOSITION COMPRISING POLYAMIC ACID, CURE ACCELERATOR SELECTED FROM GROUP CONSISTING OF NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AMINO ACID COMPOUND, AROMATIC COMPOUND HAVING TWO OR MORE HYDROXYL GROUPS | KABUSHIKI KAISHA TOSHIBA (JP) | 1998-05-26 | — | — | US | disclosed |
| US-5578697-A | DIELECTRIC POLYMERS FOR ELECTRONICS | KABUSHIKI KAISHA TOSHIBA (JP) | 1996-11-26 | — | — | US | disclosed |