Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | BCAT2 | O15382 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3141367 | 0.83 | TSHR (0.31) | — | |
| SCHEMBL3256922 | 0.82 | — | — | |
| SCHEMBL11779858 | 0.74 | EPHX1 (0.45) | BCAT2 | |
| SCHEMBL3258914 | 0.70 | — | — | |
| SCHEMBL3784058 | 0.69 | KMT2A (0.41) | BCAT2 | |
| SCHEMBL3155520 | 0.67 | — | — | |
| SCHEMBL5435741 | 0.65 | THRB (0.33) | — | |
| SCHEMBL24038496 | 0.64 | ALOX15 (0.44) | BCAT2 | |
| SCHEMBL17747849 | 0.63 | C3AR1 (0.33) | — | |
| SCHEMBL3908577 | 0.63 | CA1 (0.34) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| WO-2024095927-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | 旭化成株式会社 | 2024-05-10 | — | — | WO | disclosed |
| US-20240101761-A1 | POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-03-28 | — | — | US | disclosed |
| US-20230221639-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-07-13 | — | — | US | disclosed |
| US-20230110416-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-04-13 | — | — | US | disclosed |
| US-11163234-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2021-11-02 | — | — | US | disclosed |
| US-20200409263-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-12-31 | — | — | US | disclosed |
| US-10831101-B2 | Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-11-10 | — | — | US | disclosed |
| US-20190113845-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-04-18 | — | — | US | disclosed |
| US-20180373147-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2018-12-27 | — | — | US | disclosed |
| US-20170102613-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2017-04-13 | — | — | US | disclosed |
| US-9575410-B2 | Photosensitive resin composition, method for producing hardened relief pattern, semiconductor device and display device | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2017-02-21 | — | — | US | disclosed |
| CN-104641293-A | Photosensitive resin composition | ASAHI KASEI E MATERIALS CORP | 2015-05-20 | — | — | CN | disclosed |
| CN-101495919-B | Positive photosensitive resin composition, method for preparing cured relief pattern, semiconductor device | ASAHI KASEI E MATERIALS CORP | 2015-05-06 | — | — | CN | disclosed |
| US-20140349222-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2014-11-27 | — | — | US | disclosed |
| US-7687208-B2 | Positive photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2010-03-30 | — | — | US | disclosed |
| US-20090202794-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | ASAHI KASEI EMD CORPORATION (JP) | 2009-08-13 | — | — | US | disclosed |
| EP-2056163-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2009-05-06 | — | — | EP | disclosed |