SCHEMBL3260846

SCHEMBL3260846

CCO[SiH](CCCCNc1ccc(OC)cc1)OCC

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 9/20 0.56
MAPT P10636 6/20 0.56
ALDH1A1 P00352 2/20 0.46
PPARG P37231 1/20 0.46
APP P05067 1/20 0.42
PTPN1 P18031 1/20 0.40
NPC1 O15118 3/20 0.40
RAB9A P51151 3/20 0.40
L3MBTL1 Q9Y468 2/20 0.39
KDM4E B2RXH2 2/20 0.39
TDP1 Q9NUW8 2/20 0.39
THRB P10828 1/20 0.39
MAPK1 P28482 1/20 0.39
RECQL P46063 1/20 0.39
NPSR1 Q6W5P4 1/20 0.39
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
CNR1 P21554 2/20 0.38
CNR2 P34972 2/20 0.38
BCHE P06276 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3200243 0.86 GAA (0.61) GAAMAPTALDH1A1PPARGAPP
SCHEMBL722359 0.83 ALDH1A1 (0.52) MAPTALDH1A1PPARGL3MBTL1NPSR1
SCHEMBL25403135 0.81 ALDH1A1 (0.50) MAPTALDH1A1L3MBTL1NPSR1BCHE
SCHEMBL15360416 0.81 ALDH1A1 (0.50) MAPTALDH1A1L3MBTL1NPSR1BCHE
SCHEMBL11331749 0.79 GAA (0.70) GAAMAPTALDH1A1PPARGAPP
SCHEMBL483772 0.78 ALDH1A1 (0.53) GAAMAPTALDH1A1PPARGNPC1
SCHEMBL7001977 0.77 GAA (0.68) GAAMAPTALDH1A1PPARGAPP
SCHEMBL11327473 0.77 GAA (0.68) GAAMAPTALDH1A1PPARGAPP
SCHEMBL3631474 0.77 GAA (0.68) GAAMAPTALDH1A1PPARGAPP
SCHEMBL11338984 0.77 GAA (0.68) GAAMAPTALDH1A1PPARGAPP

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109071780-B Epoxy resin composition and electronic component device 昭和电工材料株式会社 2022-04-08 CN disclosed
US-7846998-B2 nonhalogenated and non-antimony sealant epoxy-resin molding material superior in flame resistance and still retaining reliability, for example, of moldability, reflow resistance, moisture resistance and high-temperature storage HITACHI CHEMICAL CO., LTD. (JP) 2010-12-07 US disclosed
US-7666953-B2 Phosphine-protonated haloaromatic compound accelerator with curing resin and curing agent HITACHI CHEMICAL CO, LTD. (JP) 2010-02-23 US disclosed
US-20090143511-A1 ENCAPSULATED EPOXY-RESIN MOLDING COMPOUND, AND ELECTRONIC COMPONENT DEVICE HITACHI CHEMICAL CO., LTD. (JP) 2009-06-04 US disclosed
US-20090137717-A1 ENCAPSULATED EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE HITACHI CHEMICAL CO., LTD. (JP) 2009-05-28 US disclosed
US-20090062430-A1 Epoxy Resin Composition for Sealing and Electronic Component Device HITACHI CHEMICAL CO., LTD. (JP) 2009-03-05 US disclosed
US-20090005480-A1 REACTION PRODUCT OF PHOSPHINE AND PROTONATED HALOARYL COMPOUND AND USE AS EPOXY CURING ACCELERATOR NAKAMURA SHINYA 2009-01-01 US disclosed
US-20080262135-A1 REACTION PRODUCT OF PHOSPHINE AND PROTONATED HALOARYL COMPOUND AND USE AS EPOXY CURING ACCELERATOR SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-10-23 US disclosed
US-20080234409-A1 nonhalogenated and non-antimony sealant epoxy-resin molding material superior in flame resistance and still retaining reliability, for example, of moldability, reflow resistance, moisture resistance and high-temperature storage HITACHI CHEMICAL CO., LTD. (JP) 2008-09-25 US disclosed
US-7397139-B2 Containing a curing agent and an inorganic filler, especially silica having a maximum diameter size of at least 32 mu m, an average particle size of 12 mu m or less and a specific surface area of 3.0 m2/g or more HITACHI CHEMICAL CO., LTD. (JP) 2008-07-08 US disclosed
US-20080039556-A1 Encapsulated Epoxy-Resin Molding Compound, And Electronic Component Device HITACHI CHEMICAL CO., LTD. (JP) 2008-02-14 US disclosed
US-20060214153-A1 Containing a curing agent and an inorganic filler, especially silica having a maximum diameter size of at least 32 mu m, an average particle size of 12 mu m or less and a specific surface area of 3.0 m2/g or more HITACHI CHEMICAL CO., LTD. (JP) 2006-09-28 US disclosed
US-20060014873-A1 Encapsulating epoxy resin composition, and electronic parts device using the same HITACHI CHEMICAL CO., LTD. (JP) 2006-01-19 US disclosed
US-20050267286-A1 Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative HITACHI CHEMICAL CO., LTD. (JP) 2005-12-01 US disclosed
US-20050222300-A1 Encapsulating epoxy resin composition, and electronic parts device using the same HITACHI CHEMICAL CO., LTD. (JP) 2005-10-06 US disclosed
US-20050165202-A1 Curing accelerator for curing resin, curing resin composition and electronic component device HITACHI CHEMICAL CO., LTD. (JP) 2005-07-28 US disclosed
WO-2003072628-A1 ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME HITACHI CHEMICAL CO., LTD. (JP) 2003-09-04 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20090005480-A1 REACTION PRODUCT OF PHOSPHINE AND PROTONATED HALOARYL COMPOUND AND USE AS EPOXY CURING ACCELERATOR HDHD5, EHMT2, HRH2 GAA 2482/4885MAPT 4473/4885ALDH1A1 839/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.