Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 15/20 | 0.40 |
| ▸ | FAAH | O00519 | 5/20 | 0.40 |
| ▸ | BCHE | P06276 | 1/20 | 0.38 |
| ▸ | TLR9 | Q9NR96 | 1/20 | 0.37 |
| ▸ | HSP90AA1 | P07900 | 3/20 | 0.33 |
| ▸ | CCR6 | P51684 | 1/20 | 0.33 |
| ▸ | PKM | P14618 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | GSK3A | P49840 | 1/20 | 0.32 |
| ▸ | GSK3B | P49841 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5178729 | 0.84 | MGLL (0.48) | MGLLFAAHBCHETLR9HSP90AA1 | |
| SCHEMBL1706734 | 0.80 | BCHE (0.43) | MGLLFAAHBCHETLR9HSP90AA1 | |
| SCHEMBL5606239 | 0.72 | BCHE (0.44) | MGLLFAAHBCHETLR9HSP90AA1 | |
| SCHEMBL3163923 | 0.64 | MGLL (0.34) | MGLLFAAHBCHETLR9 | |
| SCHEMBL14235668 | 0.63 | GAA (0.43) | MGLLMAPK1GSK3B | |
| SCHEMBL19911218 | 0.61 | MGLL (0.37) | MGLLFAAHBCHETLR9HSP90AA1 | |
| SCHEMBL349418 | 0.60 | MGLL (0.50) | MGLLFAAHBCHETLR9HSP90AA1 | |
| SCHEMBL20299221 | 0.59 | MGLL (0.37) | MGLLFAAHBCHETLR9HSP90AA1 | |
| SCHEMBL95324 | 0.58 | MGLL (1.00) | MGLLFAAHBCHEHSP90AA1CCR6 | |
| SCHEMBL8641616 | 0.58 | MGLL (0.70) | MGLLFAAHBCHEHSP90AA1CCR6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 340 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3196952-B1 | MEMS PIEZOELECTRIC TRANSDUCER FORMED AT A PCB SUPPORT STRUCTURE | AUSTRIA TECH & SYSTEM TECH (AT) | 2019-06-19 | — | — | EP | claimed |
| EP-3196952-A1 | MEMS PIEZOELECTRIC TRANSDUCER FORMED AT A PCB SUPPORT STRUCTURE | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft (AT) | 2017-07-26 | — | — | EP | claimed |
| US-RE44251-E1 | Circuit board for mounting electronic parts | IBIDEN CO., LTD. (JP) | 2013-06-04 | — | — | US | claimed |
| US-8227084-B2 | Thermosetting resin composition for high performance laminates | ISOLA USA CORP. (US) | 2012-07-24 | — | — | US | claimed |
| EP-1461387-B1 | PREPREG AND COMPOSITION OF EPOXY RESIN(S), SMA COPOLYMERS(S) AND BIS-MALEIMIDE TRIAZINE RESIN(S) | ISOLA LAMINATE SYSTEMS CORP (US) | 2012-02-08 | — | — | EP | claimed |
| US-20110111662-A1 | Thermosetting Resin Composition for High Performance Laminates | ISOLA USA CORP. | 2011-05-12 | — | — | US | claimed |
| US-7713621-B2 | Prepreg and laminate of epoxy resin, styrene-maleic anhydride copolymer and bis-maleimidetriazine | ISOLA USA CORP. (US) | 2010-05-11 | — | — | US | claimed |
| US-20100009201-A1 | Thermosetting Resin Composition for High Performance Laminates | ISOLA USA CORP. | 2010-01-14 | — | — | US | claimed |
| US-7521494-B2 | Epoxy resin, SMA copolymer and bis-maleimidetriazine resin | ISOLA USA CORP. (US) | 2009-04-21 | — | — | US | claimed |
| EP-1703555-A2 | Printed wiring board and method for manufacturing the same | IBIDEN CO., LTD. (JP) | 2006-09-20 | — | — | EP | claimed |
| US-20030158337-A1 | Thermosetting resin composition for high performance laminates | ISOLA LAMINATE SYSTEMS CORP. | 2003-08-21 | — | — | US | claimed |
| WO-2003048251-A1 | PREPREG AND COMPOSITION OF EPOXY RESIN(S), SMA COPOLYMERS(S) AND BIS-MALEIMIDE TRIAZINE RESIN(S) | ISOLA LAMINATE SYSTEMS CORP. (US) | 2003-06-12 | — | — | WO | claimed |
| US-20020122934-A1 | Electronic parts and method producing the same | TDK CORPORATION (JP) | 2002-09-05 | — | — | US | claimed |
| EP-1235235-A1 | Electronic parts and method producing the same | TDK Corporation (JP) | 2002-08-28 | — | — | EP | claimed |
| EP-0573224-B1 | Method of producing a solid resin-coated magnet powder for producing anisotropic bonded magnet | MITSUBISHI MATERIALS CORP (JP) | 1999-09-15 | — | — | EP | claimed |
| US-5918796-A | Method of fabricating package for housing semiconductor element | KYOCERA CORPORATION (JP) | 1999-07-06 | — | — | US | claimed |
| EP-0523421-B1 | Boards for high frequency circuits | HITACHI CHEMICAL CO LTD (JP) | 1997-03-19 | — | — | EP | claimed |
| EP-0573224-A1 | Solid resin-coated magnet powder for producing anisotropic bonded magnet and method of producing the same | MITSUBISHI MATERIALS CORPORATION (JP) | 1993-12-08 | — | — | EP | claimed |
| US-5021472-A | Solid fine powders of cured heat resistant resin dispersed in uncured heat resistant resin | IBIDEN CO. LTD. (JP) | 1991-06-04 | — | — | US | claimed |
| US-4752499-A | Adhesive for electroless plating and method of preparation of circuit board using this adhesive | IBIDEN CO. LTD. (JP) | 1988-06-21 | — | — | US | claimed |