Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | BCHE | P06276 | 1/20 | 0.43 |
| ▸ | MGLL | Q99685 | 15/20 | 0.40 |
| ▸ | FAAH | O00519 | 6/20 | 0.40 |
| ▸ | TLR9 | Q9NR96 | 1/20 | 0.37 |
| ▸ | HSP90AA1 | P07900 | 3/20 | 0.33 |
| ▸ | CCR6 | P51684 | 1/20 | 0.33 |
| ▸ | PKM | P14618 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | GSK3A | P49840 | 1/20 | 0.32 |
| ▸ | GSK3B | P49841 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL327659 | 0.80 | MGLL (0.40) | BCHEMGLLFAAHTLR9HSP90AA1 | |
| SCHEMBL5606239 | 0.77 | BCHE (0.44) | BCHEMGLLFAAHTLR9HSP90AA1 | |
| SCHEMBL6947659 | 0.73 | RECQL (0.34) | HSP90AA1 | |
| SCHEMBL5178729 | 0.73 | MGLL (0.48) | BCHEMGLLFAAHTLR9HSP90AA1 | |
| SCHEMBL28353264 | 0.69 | MGLL (0.56) | BCHEMGLLFAAHHSP90AA1CCR6 | |
| SCHEMBL8163716 | 0.69 | ALDH1A1 (0.50) | NPSR1 | |
| SCHEMBL8162536 | 0.66 | ALPL (0.44) | — | |
| SCHEMBL12661014 | 0.65 | HSP90AA1 (0.32) | HSP90AA1 | |
| SCHEMBL20062944 | 0.62 | TLR9 (0.34) | TLR9 | |
| SCHEMBL1821188 | 0.61 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 410 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240182703-A1 | RESIN COMPOSITION AND ARTICLE MADE THEREFROM | ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) | 2024-06-06 | — | — | US | claimed |
| US-20240182702-A1 | RESIN COMPOSITION AND ARTICLE MADE THEREFROM | ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) | 2024-06-06 | — | — | US | claimed |
| CN-118056872-A | Resin composition and product thereof | 台光电子材料(昆山)有限公司 | 2024-05-21 | — | — | CN | claimed |
| CN-118056850-A | Resin composition and product thereof | 台光电子材料(昆山)有限公司 | 2024-05-21 | — | — | CN | claimed |
| US-20240158576-A1 | RESIN COMPOSITION AND ARTICLE MADE THEREFROM | ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD. (CN) | 2024-05-16 | — | — | US | claimed |
| CN-117965010-A | Resin composition and product thereof | 中山台光电子材料有限公司 | 2024-05-03 | — | — | CN | claimed |
| CN-116790213-B | High-temperature-resistant conductive adhesive and preparation method thereof | 江苏特丽亮新材料科技有限公司 | 2024-02-20 | — | — | CN | claimed |
| US-11897973-B2 | Resin composition and article made therefrom | ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) | 2024-02-13 | — | — | US | claimed |
| US-20240010810-A1 | MAGNETIC DIELECTRIC RESIN COMPOSITION, AND PREPREG AND COPPER CLAD LAMINATE COMPRISING SAME | SHENGYI TECHNOLOGY CO., LTD. (CN) | 2024-01-11 | — | — | US | claimed |
| US-20240002596-A1 | RESIN COMPOSITION AND ARTICLE MADE THEREFROM | ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD., (CN) | 2024-01-04 | — | — | US | claimed |
| CN-101436550-A | Method for manufacturing coreless multi-layer packaging substrate | BRIDGE SEMICONDUCTOR CORP (CN) | 2009-05-20 | — | — | CN | claimed |
| CN-101436639-A | Manufacturing method of light-emitting diode packaging substrate | BRIDGE SEMICONDUCTOR CORP (CN) | 2009-05-20 | — | — | CN | claimed |
| WO-2008085234-A1 | PROCESS FOR FORMING FILMS AND FILMS FORMED BY THE PROCESS | DOW CORNING CORPORATION (US) | 2008-07-17 | — | — | WO | claimed |
| CN-101194326-A | Multilayer construction for forming resistors and capacitors | OAK MITSUI INC (US) | 2008-06-04 | — | — | CN | claimed |
| CN-1171514-C | Low-CTE power source and stratum | 国际商业机器公司 | 2004-10-13 | — | — | CN | claimed |
| CN-1269538-A | Low-CTE power source and stratum | IBM (US) | 2000-10-11 | — | — | CN | claimed |
| CN-1135798-A | Liquid crystal display, its mounting structure and electronic device | SEIKO EPSON CORP (JP) | 1996-11-13 | — | — | CN | claimed |
| US-5043184-A | Applying epoxy resin, curing agent, photopolymerizable compound, and photoinitiator; irradiating with actinic light, heating | SOMAR CORPORATION (JP) | 1991-08-27 | — | — | US | claimed |
| EP-0381900-A2 | Method of forming electrically conducting layer | SOMAR CORPORATION (JP) | 1990-08-16 | — | — | EP | claimed |
| EP-0381899-A2 | Thermosetting composition | SOMAR CORPORATION (JP) | 1990-08-16 | — | — | EP | claimed |