SCHEMBL329255

SCHEMBL329255

C(OCC1CO1)C1CO1.CCC(CO)(CO)CO

nearest known ligand 0.48

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.48
MAPK1 P28482 1/20 0.48
SMN1; SMN2 Q16637 1/20 0.47
ALDH1A1 P00352 7/20 0.44
TDP1 Q9NUW8 1/20 0.44
TP53 P04637 3/20 0.33
MAPT P10636 2/20 0.33
HPGD P15428 2/20 0.33
MEN1 O00255 1/20 0.33
CYP1A2 P05177 1/20 0.33
KMT2A Q03164 1/20 0.33
PPARG P37231 1/20 0.33
HIF1A Q16665 1/20 0.33
PDK1 Q15118 2/20 0.32
CYP3A4 P08684 1/20 0.32
GLA P06280 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9058586 0.96 TSHR (0.48) TSHRMAPK1SMN1; SMN2ALDH1A1TDP1
SCHEMBL329256 0.89 TSHR (0.55) TSHRMAPK1SMN1; SMN2ALDH1A1TDP1
SCHEMBL123922 0.89 TSHR (0.55) TSHRMAPK1SMN1; SMN2ALDH1A1TDP1
SCHEMBL311322 0.87 TSHR (0.50) TSHRMAPK1SMN1; SMN2ALDH1A1TDP1
SCHEMBL7518576 0.86 SMN1; SMN2 (0.51) TSHRMAPK1SMN1; SMN2ALDH1A1TDP1
Alcohol SCHEMBL150777 0.83 SMN1; SMN2 (0.58) TSHRMAPK1SMN1; SMN2ALDH1A1TDP1
SCHEMBL16296603 0.82 TSHR (0.50) TSHRMAPK1SMN1; SMN2ALDH1A1TDP1
SCHEMBL13399059 0.81 TSHR (0.47) TSHRMAPK1SMN1; SMN2ALDH1A1TDP1
Ether SCHEMBL10799553 0.81 ALDH1A1 (0.60) TSHRMAPK1SMN1; SMN2ALDH1A1TDP1
SCHEMBL4461926 0.81 TSHR (0.59) TSHRMAPK1SMN1; SMN2ALDH1A1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2027 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3986973-B1 PROCESS FOR PREPARING A BONDING RESIN STORA ENSO OYJ (FI) 2025-12-17 EP claimed
EP-4638637-A1 IMPROVED BONDING RESIN Stora Enso Oyj (FI) 2025-10-29 EP claimed
EP-4612248-A1 A BIOPOLYMER ADHESIVE SYSTEM AND A METHOD OF SEPARATELY APPLYING PARTS OF THE BIOPOLYMER ADHESIVE SYSTEM Stora Enso Oyj (FI) 2025-09-10 EP claimed
US-20250270404-A1 BONDING RESIN STORA ENSO OYJ (FI) 2025-08-28 US claimed
CN-120059650-A Detachable heat-conducting epoxy structural adhesive, preparation method thereof and application thereof in new energy battery 华南理工大学 2025-05-30 CN claimed
US-20250144599-A1 ANTIMICROBIAL WATER-ABSORBENT CROSS-LINKED POLYMERIC POLYCARBOXYLIC ACID AND RELATED METHODS ECOVIA RENEWABLES INC. 2025-05-08 US claimed
US-12286565-B2 Process for preparing a bonding resin STORA ENSO OYJ (FI) 2025-04-29 US claimed
US-20250129198-A1 PROCESS FOR THE PREPARATION OF A BONDING RESIN STORA ENSO OYJ (FI) 2025-04-24 US claimed
EP-4526390-A1 IMPROVED BONDING RESIN Stora Enso Oyj (FI) 2025-03-26 EP claimed
US-20250051623-A1 PROCESS FOR THE PREPARATION OF A BONDING RESIN STORA ENSO OYJ (FI) 2025-02-13 US claimed
EP-0441383-B1 Use of a copolymer for the making of contact lenses MITSUBISHI RAYON CO (JP) 1996-05-08 EP claimed
EP-0430209-B1 Resin composition for cast polymerization MITSUBISHI RAYON CO (JP) 1996-02-28 EP claimed
US-5278217-A Comprising a hydrophilic compound, surface treating agent TOKAI RUBBER INDUSTRIES, LTD. (JP) 1994-01-11 US claimed
US-5247038-A Optical materials MITSUBISHI RAYON CO., LTD. (JP) 1993-09-21 US claimed
US-5183870-A A curable polybutylene glycol di(meth)acrylate, a urethane or epoxy (meth)acrylate and a (meth)acrylate; heat and water resistance; impact strength; dyeability; workability MITSUBISHI RAYON CO., LTD (JP) 1993-02-02 US claimed
EP-0450963-A1 Thermosetting resin composition NIPPON PAINT CO., LTD. (JP) 1991-10-09 EP claimed
EP-0441383-A2 Use of a copolymer for the making of contact lenses MITSUBISHI RAYON CO., LTD. (JP) 1991-08-14 EP claimed
EP-0430209-A2 Resin composition for cast polymerization MITSUBISHI RAYON CO., LTD. (JP) 1991-06-05 EP claimed
US-4265745-A CROSSLINKED POLYEPOXY COMPOUND AND POLYAMINO COMPOUND AND A MICROPOROUS SUBSTRATE PROVIDES FLEXIBILITY AND CHEMICAL RESISTANCE TEIJIN LIMITED (JP) 1981-05-05 US claimed
US-4055430-A Light sensitive material containing an ethylene compound dye former, an organic polymer compound containing chlorine and a plasticizer FUJI PHOTO FILM CO., LTD. (JA) 1977-10-25 US claimed