Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3301725 | 0.89 | TSHR (0.33) | ALDH1A1TSHR | |
| SCHEMBL28263526 | 0.86 | ALDH1A1 (0.36) | ALDH1A1TSHR | |
| SCHEMBL28449291 | 0.81 | ALDH1A1 (0.36) | ALDH1A1TSHR | |
| SCHEMBL3299985 | 0.81 | TSHR (0.35) | TSHR | |
| SCHEMBL707612 | 0.80 | — | — | |
| SCHEMBL28457271 | 0.79 | — | — | |
| SCHEMBL27387472 | 0.78 | DNM1 (0.37) | TSHR | |
| SCHEMBL22654137 | 0.78 | TSHR (0.32) | ALDH1A1TSHR | |
| SCHEMBL28263623 | 0.77 | ALDH1A1 (0.33) | ALDH1A1TSHR | |
| SCHEMBL31326622 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116075368-A | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2023-05-05 | — | — | CN | disclosed |
| CN-108389512-B | Laminate, flexible device, and method for producing laminate | 东京应化工业株式会社 | 2022-04-15 | — | — | CN | disclosed |
| CN-108250754-B | Silicon-containing resin composition, silicon-containing resin film, silica film, light-emitting display element panel, and light-emitting display device | 东京应化工业株式会社 | 2022-01-25 | — | — | CN | disclosed |
| CN-108387954-B | Laminate, flexible device, and method for producing laminate | 东京应化工业株式会社 | 2022-01-18 | — | — | CN | disclosed |
| CN-107429059-B | Energy-sensitive resin composition | 东京应化工业株式会社 | 2020-10-23 | — | — | CN | disclosed |
| CN-107922733-B | Polyimide precursor composition | 东京应化工业株式会社 | 2020-09-11 | — | — | CN | disclosed |
| EP-1641908-B1 | CLEANING COMPOSITION, METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD OF FORMING WIRING ON SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO LTD (JP) | 2010-11-17 | — | — | EP | disclosed |
| US-7736837-B2 | Antireflective coating composition based on silicon polymer | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2010-06-15 | — | — | US | disclosed |
| US-20100093969-A1 | Process for making siloxane polymers | ZHANG RUZHI | 2010-04-15 | — | — | US | disclosed |
| EP-2132253-A1 | PROCESS FOR MAKING SILOXANE POLYMERS | AZ Electronic Materials USA Corp. (US) | 2009-12-16 | — | — | EP | disclosed |
| WO-2008104874-A1 | PROCESS FOR MAKING SILOXANE POLYMERS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2008-09-04 | — | — | WO | disclosed |
| WO-2008102259-A2 | ANTIREFLECTIVE COATING COMPOSITION BASED ON A SILICON POLYMER | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2008-08-28 | — | — | WO | disclosed |
| US-20080199789-A1 | Antireflective Coating Composition Based on Silicon Polymer | MERCK PATENT GMBH (DE) | 2008-08-21 | — | — | US | disclosed |
| US-20070298349-A1 | Antireflective Coating Compositions Comprising Siloxane Polymer | AZ ELECTRONIC MATERIALS USA CORP. | 2007-12-27 | — | — | US | disclosed |
| WO-2007148223-A2 | ANTIREFLECTIVE COATING COMPOSITIONS COMPRISING SILOXANE POLYMER | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2007-12-27 | — | — | WO | disclosed |
| EP-1641908-A1 | CLEANING COMPOSITION, METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD OF FORMING WIRING ON SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-04-05 | — | — | EP | disclosed |
| WO-2004113486-A1 | CLEANING COMPOSITION, METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD OF FORMING WIRING ON SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-12-29 | — | — | WO | disclosed |
| US-20040259761-A1 | Cleaning composition, method of cleaning semiconductor substrate, and method of forming wiring on semiconductor substrate | TOKYO OHKA KOGYO CO., LTD. INTEL CORPORATION | 2004-12-23 | — | — | US | disclosed |
| US-6515073-B2 | Comprising di-, tri- and/or tetra-(alkoxy/phenoxy)silanes and a thermosetting resin which can be condensed therewith which has an absorption capacity with respect to exposing light; can be etched at high rate for fine resist patterns | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-02-04 | — | — | US | disclosed |
| US-20010036998-A1 | Anti-reflective coating-forming composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-11-01 | — | — | US | disclosed |