Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.52 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.52 |
| ▸ | PTGS1 | P23219 | 5/20 | 0.46 |
| ▸ | PGK1 | P00558 | 2/20 | 0.39 |
| ▸ | PGK2 | P07205 | 2/20 | 0.39 |
| ▸ | P2RX1 | P51575 | 3/20 | 0.37 |
| ▸ | KIF11 | P52732 | 1/20 | 0.36 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.35 |
| ▸ | CASP1 | P29466 | 1/20 | 0.35 |
| ▸ | RECQL | P46063 | 1/20 | 0.35 |
| ▸ | GLA | P06280 | 1/20 | 0.35 |
| ▸ | POLB | P06746 | 1/20 | 0.35 |
| ▸ | GAA | P10253 | 1/20 | 0.35 |
| ▸ | ACP3 | P15309 | 1/20 | 0.35 |
| ▸ | HTR1A | P08908 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30645311 | 1.00 | TSHR (0.52) | TSHRMAPK1PTGS1PGK1PGK2 | |
| SCHEMBL19472449 | 0.90 | MAPK1 (0.45) | TSHRMAPK1PTGS1PGK1PGK2 | |
| SCHEMBL29617169 | 0.87 | PTGS1 (0.52) | TSHRMAPK1PTGS1PGK1PGK2 | |
| SCHEMBL7152607 | 0.87 | PTGS1 (0.52) | TSHRMAPK1PTGS1PGK1PGK2 | |
| SCHEMBL9688354 | 0.82 | CYP3A4 (0.52) | TSHRMAPK1CYP3A4CASP1RECQL | |
| SCHEMBL30471399 | 0.82 | CYP3A4 (0.52) | TSHRMAPK1CYP3A4CASP1RECQL | |
| SCHEMBL19477881 | 0.81 | KIF11 (0.48) | TSHRMAPK1PTGS1P2RX1KIF11 | |
| SCHEMBL7616716 | 0.80 | P2RX1 (0.46) | TSHRPGK1PGK2P2RX1KIF11 | |
| SCHEMBL1536240 | 0.76 | MAOA (0.52) | TSHRCYP3A4CASP1RECQLGAA | |
| SCHEMBL21636282 | 0.76 | MAOA (0.52) | TSHRCYP3A4CASP1RECQLGAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118725244-A | Polyurethane elastomer with fluorine-containing polyimide oligomer chain extension and preparation method thereof | 山东奥卓新材料有限公司 | 2024-10-01 | — | — | CN | claimed |
| US-20240150524-A1 | POLYIMIDES HAVING LOW DIELECTRIC LOSS | SOLVAY SPECIALTY POLYMERS ITALY S.P.A. (IT) | 2024-05-09 | — | — | US | claimed |
| WO-2022175169-A1 | POLYIMIDES HAVING LOW DIELECTRIC LOSS | SOLVAY SPECIALTY POLYMERS ITALY S.P.A. (IT) | 2022-08-25 | — | — | WO | claimed |
| US-20090242823-A1 | PROCESS FOR PREPARING POLYIMIDE BASED COMPOSITIONS USEFUL IN HIGH FREQUENCY CIRCUITRY APPLICATIONS | E. I. DU PONT DE NEMOURS AND COMPANY | 2009-10-01 | — | — | US | claimed |
| EP-2001676-A1 | CAPACITIVE POLYIMIDE LAMINATE | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2008-12-17 | — | — | EP | claimed |
| EP-2001942-A1 | PROCESS FOR PREPARING POLYIMIDE BASED COMPOSITIONS USEFUL IN HIGH FREQUENCY CIRCUITRY APPLICATIONS | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2008-12-17 | — | — | EP | claimed |
| WO-2007126533-A1 | CAPACITIVE POLYIMIDE LAMINATE | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-11-08 | — | — | WO | claimed |
| WO-2007117372-A1 | PROCESS FOR PREPARING POLYIMIDE BASED COMPOSITIONS USEFUL IN HIGH FREQUENCY CIRCUITRY APPLICATIONS | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-10-18 | — | — | WO | claimed |
| US-20070232734-A1 | Polyimide based compositions useful in high frequency circuitry applications and methods relating thereto | KANAKARAJAN KARTHIKEYAN | 2007-10-04 | — | — | US | claimed |
| US-20070231588-A1 | Capacitive polyimide laminate | E. I. DU PONT DE NEMOURS AND COMPANY | 2007-10-04 | — | — | US | claimed |
| EP-1672009-A1 | Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device | E.I.Du pont de nemours and company (US) | 2006-06-21 | — | — | EP | claimed |
| US-20060124693-A1 | Thermally conductive polyimide film composites having high mechanical elongation useful as a heat conducting portion of an electronic device | E. I. DU PONT DE NEMOURS AND COMPANY | 2006-06-15 | — | — | US | claimed |
| US-20060127686-A1 | Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device | E. I. DU PONT DE NEMOURS AND COMPANY | 2006-06-15 | — | — | US | claimed |
| CN-118725244-A | Polyurethane elastomer with fluorine-containing polyimide oligomer chain extension and preparation method thereof | 山东奥卓新材料有限公司 | 2024-10-01 | — | — | CN | disclosed |
| US-20240166818-A1 | POLYIMIDES HAVING LOW DIELECTRIC LOSS | SOLVAY SPECIALTY POLYMERS ITALY S.P.A. (IT) | 2024-05-23 | — | — | US | disclosed |
| US-20240150524-A1 | POLYIMIDES HAVING LOW DIELECTRIC LOSS | SOLVAY SPECIALTY POLYMERS ITALY S.P.A. (IT) | 2024-05-09 | — | — | US | disclosed |
| EP-1672009-A1 | Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device | E.I.Du pont de nemours and company (US) | 2006-06-21 | — | — | EP | disclosed |
| EP-1672008-A1 | Thermally conductive polyimide film composites having high mechanical elongation useful as a heat conducting portion of an electronic device | E.I.Du pont de nemours and company (US) | 2006-06-21 | — | — | EP | disclosed |
| US-20060124693-A1 | Thermally conductive polyimide film composites having high mechanical elongation useful as a heat conducting portion of an electronic device | E. I. DU PONT DE NEMOURS AND COMPANY | 2006-06-15 | — | — | US | disclosed |
| US-20060127686-A1 | Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device | E. I. DU PONT DE NEMOURS AND COMPANY | 2006-06-15 | — | — | US | disclosed |