SCHEMBL3313680

SCHEMBL3313680

CC(F)(F)C(F)(F)S(=O)(=O)O

nearest known ligand 0.39

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
TSHR P16473 1/20 0.33
TDP1 Q9NUW8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL28320011 0.97 ALDH1A1 (0.38) ALDH1A1L3MBTL1TSHRTDP1
SCHEMBL682284 0.82 ALDH1A1 (0.36) ALDH1A1L3MBTL1TSHRTDP1
SCHEMBL4448952 0.81 ALDH1A1 (0.39) ALDH1A1L3MBTL1TSHRTDP1
SCHEMBL776627 0.81 ALDH1A1 (0.39) ALDH1A1L3MBTL1TSHRTDP1
SCHEMBL16110455 0.81 ALDH1A1 (0.39) ALDH1A1L3MBTL1TSHRTDP1
SCHEMBL12256268 0.80 ALDH1A1 (0.35) ALDH1A1L3MBTL1
SCHEMBL301944 0.79 ALDH1A1 (0.47) ALDH1A1L3MBTL1TSHRTDP1
SCHEMBL13107713 0.79 ALDH1A1 (0.38) ALDH1A1L3MBTL1TSHRTDP1
SCHEMBL18008301 0.78 CA2 (0.37) ALDH1A1L3MBTL1
SCHEMBL18008012 0.78 CA2 (0.37) ALDH1A1L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 122 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20030170561-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2003-09-11 US claimed
US-20240291009-A1 METHOD FOR PURIFYING TREATMENT TARGET SOLUTION AGC Inc. (JP) 2024-08-29 US disclosed
EP-4417582-A1 METHOD FOR PURIFYING TREATMENT TARGET SOLUTION AGC Inc. (JP) 2024-08-21 EP disclosed
CN-118176168-A Method for purifying liquid to be treated AGC株式会社 2024-06-11 CN disclosed
US-11914295-B2 Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-02-27 US disclosed
US-20230333472-A1 THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION CONTAINING THE MATERIAL FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-19 US disclosed
US-20230244149-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-08-03 US disclosed
US-11687000-B2 Sulfonium compound, chemically amplified resist composition, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-06-27 US disclosed
WO-2023063339-A1 METHOD FOR PURIFYING TREATMENT TARGET SOLUTION AGC株式会社 2023-04-20 WO disclosed
US-11121324-B2 Dihetero amines in electrically conductive polymer compositions LG CHEM, LTD. 2021-09-14 US disclosed
EP-1736829-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2006-12-27 EP disclosed
EP-1726608-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2006-11-29 EP disclosed
US-20060234153-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2006-10-19 US disclosed
US-7108955-B2 Polysiloxane, process for production thereof and radiation-sensitive resin composition JSR CORPORATION (JP) 2006-09-19 US disclosed
US-20050171226-A1 Radiation sensitive resin composition JSR CORPORATION (JP) 2005-08-04 US disclosed
EP-1557718-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2005-07-27 EP disclosed
US-20040143082-A1 Polysiloxane, process for production thereof and radiation-sensitive resin composition JSR CORPORATION (JP) 2004-07-22 US disclosed
EP-1398339-A1 POLYSILOXANE, PROCESS FOR PRODUCTION THEREOF AND RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2004-03-17 EP disclosed
US-20030219680-A1 Photoresists useful for microfabrication utilizing deep ultraviolet rays such as an excimer laser, x-rays such as synchrotron radiation, and electron beams JSR CORPORATION (JP) 2003-11-27 US disclosed
US-20030170561-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2003-09-11 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11121324-B2 Dihetero amines in electrically conductive polymer compositions PARN, PARG, KCNH2 ALDH1A1 3615/4885L3MBTL1 4521/4885TSHR 3277/4885
US-11687000-B2 Sulfonium compound, chemically amplified resist composition, and patterning process ETV6, PKD1, PKD2 ALDH1A1 3150/4885L3MBTL1 3765/4885TSHR 4142/4885
US-20230333472-A1 THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION CONTAINING THE MATERIAL FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY, AND PATTERNING PROCESS RPS4X, SIK3, MLX ALDH1A1 4644/4885L3MBTL1 1564/4885TSHR 439/4885
US-11914295-B2 Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process RPS4X, SIK3, MLX ALDH1A1 4644/4885L3MBTL1 1564/4885TSHR 439/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.