Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 4/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.34 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.34 |
| ▸ | CCR6 | P51684 | 1/20 | 0.34 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.34 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.34 |
| ▸ | APOBEC3G | Q9HC16 | 1/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.34 |
| ▸ | MGLL | Q99685 | 4/20 | 0.32 |
| ▸ | FAAH | O00519 | 3/20 | 0.32 |
| ▸ | HCAR1 | Q9BXC0 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.30 |
| ▸ | POLB | P06746 | 2/20 | 0.30 |
| ▸ | GMNN | O75496 | 1/20 | 0.30 |
| ▸ | MAPT | P10636 | 1/20 | 0.30 |
| ▸ | THPO | P40225 | 1/20 | 0.30 |
| ▸ | BLM | P54132 | 1/20 | 0.30 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.30 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10457189 | 0.79 | POLB (0.39) | ALDH1A1KMT2AMEN1POLB | |
| Cyclohexane SCHEMBL28396853 | 0.75 | ALDH1A1 (0.33) | LMNAALDH1A1HSP90AA1CCR6CACNA1B | |
| SCHEMBL7943976 | 0.75 | ALDH1A1 (0.33) | LMNAALDH1A1HSP90AA1CCR6CACNA1B | |
| SCHEMBL9786693 | 0.71 | ALDH1A1 (0.31) | LMNAALDH1A1HSP90AA1CCR6CACNA1B | |
| SCHEMBL22805696 | 0.71 | MGLL (0.31) | LMNAALDH1A1HSP90AA1MGLLFAAH | |
| SCHEMBL29010970 | 0.71 | HCAR1 (0.36) | LMNAALDH1A1HSP90AA1CCR6CACNA1B | |
| SCHEMBL29010796 | 0.71 | HCAR1 (0.36) | LMNAALDH1A1HSP90AA1CCR6CACNA1B | |
| SCHEMBL9786702 | 0.71 | ALDH1A1 (0.31) | LMNAALDH1A1HSP90AA1CCR6CACNA1B | |
| SCHEMBL718672 | 0.71 | HCAR1 (0.36) | LMNAALDH1A1HSP90AA1CCR6CACNA1B | |
| SCHEMBL6260834 | 0.70 | MGLL (0.32) | LMNAALDH1A1HSP90AA1MGLLFAAH |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024185371-A1 | RESIN COMPOSITION, AND INTER-LAYER INSULATING ADHESIVE FILM, LAMINATED CIRCUIT BOARD, ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE USING SAME | ナミックス株式会社 | 2024-09-12 | — | — | WO | disclosed |
| EP-3405010-B1 | MULTILAYER TRANSMISSION LINE PLATE | RESONAC CORP (JP) | 2024-06-26 | — | — | EP | disclosed |
| CN-113717526-B | Resin composition, support with resin layer, prepreg, and laminate | 株式会社力森诺科 | 2024-06-11 | — | — | CN | disclosed |
| EP-3246352-B1 | RESIN COMPOSITION, SUPPORT WITH RESIN LAYER, PREPREG, LAMINATE, MULTILAYERED PRINTED WIRING BOARD, AND PRINTED WIRING BOARD FOR MILLIMETER-WAVE RADAR | RESONAC CORP (JP) | 2024-04-10 | — | — | EP | disclosed |
| US-11745482-B2 | Fluororesin substrate laminate | RESONAC CORPORATION (JP) | 2023-09-05 | — | — | US | disclosed |
| EP-3483214-B1 | RESIN COMPOSITION, RESIN FILM, LAMINATE, MULTILAYER PRINTED WIRING BOARD AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD | RESONAC CORP (JP) | 2023-08-30 | — | — | EP | disclosed |
| CN-113337117-B | Resin composition, support, prepreg, laminate, multilayer printed wiring board, and printed wiring board for millimeter wave radar | 株式会社力森诺科 | 2023-07-14 | — | — | CN | disclosed |
| WO-2023079959-A1 | SILICONE ADDITIVE FOR RESIN MODIFICATION AND CURABLE RESIN COMPOSITION CONTAINING SAME | 信越化学工業株式会社 | 2023-05-11 | — | — | WO | disclosed |
| US-11339251-B2 | Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-05-24 | — | — | US | disclosed |
| US-11286346-B2 | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-03-29 | — | — | US | disclosed |
| EP-2546287-A1 | Thermosetting resin composition of semi-ipn composite, and varnish, prepreg and metal clad laminated board using the same | Hitachi Chemical Co., Ltd. (JP) | 2013-01-16 | — | — | EP | disclosed |
| US-20130000843-A1 | THERMOSETTING RESIN COMPOSITION OF SEMI-IPN COMPOSITE, AND VARNISH, PREPREG AND METAL CLAD LAMINATED BOARD USING THE SAME | RESONAC CORPORATION (JP) | 2013-01-03 | — | — | US | disclosed |
| US-8277948-B2 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2012-10-02 | — | — | US | disclosed |
| US-20120214009-A1 | THERMOSETTING RESIN COMPOSITION OF SEMI-IPN COMPOSITE, AND VARNISH, PREPREG AND METAL CLAD LAMINATED BOARD USING THE SAME | RESONAC CORPORATION (JP) | 2012-08-23 | — | — | US | disclosed |
| EP-2407503-A1 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | Hitachi Chemical Co., Ltd. (JP) | 2012-01-18 | — | — | EP | disclosed |
| US-20100233495-A1 | Thermosetting Resin Composition of Semi-IPN Composite, and Varnish, Prepreg and Metal Clad Laminated Board Using the Same | RESONAC CORPORATION (JP) | 2010-09-16 | — | — | US | disclosed |
| US-20100129676-A1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | RESONAC CORPORATION (JP) | 2010-05-27 | — | — | US | disclosed |
| EP-2141198-A1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | Hitachi Chemical Company, Ltd. (JP) | 2010-01-06 | — | — | EP | disclosed |
| EP-1985654-A1 | THERMOCURABLE RESIN COMPOSITION COMPRISING SEMI-IPN-TYPE COMPLEX, AND VARNISH, PREPREG AND METAL-CLAD LAMINATE SHEET USING THE SAME | Hitachi Chemical Co., Ltd. (JP) | 2008-10-29 | — | — | EP | disclosed |
| WO-2008099904-A1 | SILANE COMPOUND, PRODUCTION METHOD THEREOF, AND RESIN COMPOSITION CONTAINING SILANE COMPOUND | NIPPON SHOKUBAI CO., LTD. (JP) | 2008-08-21 | — | — | WO | disclosed |