Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 11/20 | 0.50 |
| ▸ | HSP90AA1 | P07900 | 6/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.40 |
| ▸ | NPSR1 | Q6W5P4 | 5/20 | 0.40 |
| ▸ | CCR6 | P51684 | 4/20 | 0.40 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.40 |
| ▸ | MAPT | P10636 | 3/20 | 0.40 |
| ▸ | PKM | P14618 | 3/20 | 0.40 |
| ▸ | HPGD | P15428 | 2/20 | 0.40 |
| ▸ | HTT | P42858 | 2/20 | 0.40 |
| ▸ | NLRP1 | Q9C000 | 1/20 | 0.40 |
| ▸ | TLR9 | Q9NR96 | 3/20 | 0.36 |
| ▸ | CACNA1B | Q00975 | 2/20 | 0.35 |
| ▸ | APBA1 | Q02410 | 2/20 | 0.35 |
| ▸ | GMNN | O75496 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | THPO | P40225 | 1/20 | 0.33 |
| ▸ | BLM | P54132 | 1/20 | 0.33 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.33 |
| ▸ | ATM | Q13315 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8732400 | 0.85 | HSP90AA1 (0.46) | MGLLHSP90AA1ALDH1A1NPSR1CCR6 | |
| SCHEMBL8732387 | 0.85 | MGLL (0.53) | MGLLHSP90AA1ALDH1A1NPSR1CCR6 | |
| SCHEMBL27850421 | 0.85 | MGLL (0.53) | MGLLHSP90AA1ALDH1A1NPSR1CCR6 | |
| SCHEMBL8732397 | 0.79 | MGLL (0.50) | MGLLHSP90AA1ALDH1A1NPSR1CCR6 | |
| SCHEMBL9418756 | 0.78 | MGLL (0.58) | MGLLHSP90AA1ALDH1A1NPSR1CCR6 | |
| SCHEMBL5078134 | 0.76 | MGLL (0.56) | MGLLHSP90AA1ALDH1A1NPSR1CCR6 | |
| SCHEMBL8733732 | 0.74 | MGLL (0.44) | MGLLHSP90AA1ALDH1A1NPSR1CCR6 | |
| SCHEMBL8727167 | 0.71 | MGLL (0.42) | MGLLHSP90AA1ALDH1A1NPSR1CCR6 | |
| SCHEMBL19570466 | 0.70 | MGLL (0.36) | MGLLHSP90AA1ALDH1A1NPSR1CCR6 | |
| SCHEMBL2123354 | 0.69 | HSP90AA1 (0.47) | MGLLHSP90AA1ALDH1A1NPSR1CCR6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2407503-B1 | THERMOSETTING RESIN COMPOSITION OF SEMI-IPN COMPOSITE, AND VARNISH, PREPREG AND METAL CLAD LAMINATED BOARD USING THE SAME | HITACHI CHEMICAL CO LTD (JP) | 2020-01-08 | — | — | EP | disclosed |
| US-8568891-B2 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-10-29 | — | — | US | disclosed |
| US-8501870-B2 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2013-08-06 | — | — | US | disclosed |
| EP-1985654-B1 | THERMOCURABLE RESIN COMPOSITION COMPRISING SEMI-IPN-TYPE COMPLEX, AND VARNISH, PREPREG AND METAL-CLAD LAMINATE SHEET USING THE SAME | HITACHI CHEMICAL CO LTD (JP) | 2013-04-10 | — | — | EP | disclosed |
| EP-2546287-A1 | Thermosetting resin composition of semi-ipn composite, and varnish, prepreg and metal clad laminated board using the same | Hitachi Chemical Co., Ltd. (JP) | 2013-01-16 | — | — | EP | disclosed |
| US-20130000843-A1 | THERMOSETTING RESIN COMPOSITION OF SEMI-IPN COMPOSITE, AND VARNISH, PREPREG AND METAL CLAD LAMINATED BOARD USING THE SAME | RESONAC CORPORATION (JP) | 2013-01-03 | — | — | US | disclosed |
| US-8277948-B2 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2012-10-02 | — | — | US | disclosed |
| US-20120214009-A1 | THERMOSETTING RESIN COMPOSITION OF SEMI-IPN COMPOSITE, AND VARNISH, PREPREG AND METAL CLAD LAMINATED BOARD USING THE SAME | RESONAC CORPORATION (JP) | 2012-08-23 | — | — | US | disclosed |
| EP-2407503-A1 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | Hitachi Chemical Co., Ltd. (JP) | 2012-01-18 | — | — | EP | disclosed |
| US-20100233495-A1 | Thermosetting Resin Composition of Semi-IPN Composite, and Varnish, Prepreg and Metal Clad Laminated Board Using the Same | RESONAC CORPORATION (JP) | 2010-09-16 | — | — | US | disclosed |
| EP-1985654-A1 | THERMOCURABLE RESIN COMPOSITION COMPRISING SEMI-IPN-TYPE COMPLEX, AND VARNISH, PREPREG AND METAL-CLAD LAMINATE SHEET USING THE SAME | Hitachi Chemical Co., Ltd. (JP) | 2008-10-29 | — | — | EP | disclosed |
| US-5725948-A | POLYIMIDE FROM A BISMALEIMIDE AND A DIAMINE | TOMOEGAWA PAPER CO., LTD. (JP) | 1998-03-10 | — | — | US | disclosed |