Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FABP3 | P05413 | 6/20 | 0.60 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.58 |
| ▸ | CA1 | P00915 | 1/20 | 0.58 |
| ▸ | GPR84 | Q9NQS5 | 1/20 | 0.56 |
| ▸ | DNM1 | Q05193 | 2/20 | 0.56 |
| ▸ | CA2 | P00918 | 2/20 | 0.55 |
| ▸ | CES2 | O00748 | 3/20 | 0.54 |
| ▸ | CES1 | P23141 | 3/20 | 0.54 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Dodecanoate SCHEMBL230531 | 1.00 | FABP3 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Stearic Acid SCHEMBL9063410 | 1.00 | FABP3 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Octanoic Acid SCHEMBL16008346 | 1.00 | FABP3 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Myristic Acid SCHEMBL15091865 | 1.00 | FABP3 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Palmitic Acid SCHEMBL15091868 | 1.00 | FABP3 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Octanoic Acid SCHEMBL16007959 | 0.98 | DNM1 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| SCHEMBL253165 | 0.98 | CA1 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Hexanoate SCHEMBL28546350 | 0.98 | CA1 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Octanoic Acid SCHEMBL11573973 | 0.96 | FABP3 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Decanoic Acid SCHEMBL194214 | 0.96 | FABP3 (0.60) | FABP3NFKB1CA1GPR84DNM1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 593 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114369338-B | Epoxy resin composition and application thereof, epoxy resin and preparation method and application thereof | 江苏中科科化新材料股份有限公司 | 2024-03-15 | — | — | CN | claimed |
| CN-114369338-A | Epoxy resin composition and application thereof, epoxy resin and preparation method and application thereof | 江苏科化新材料科技有限公司 | 2022-04-19 | — | — | CN | claimed |
| US-9497856-B2 | Laminated structure, dry film and method of producing laminated structure | TAIYO INK MFG. CO., LTD. (JP) | 2016-11-15 | — | — | US | claimed |
| US-9018321-B2 | Resin composition | AJINOMOTO CO., INC. (JP) | 2015-04-28 | — | — | US | claimed |
| US-8716401-B2 | Semiconductor chip laminate and adhesive composition for semiconductor chip lamination | LINTEC CORPORATION (JP) | 2014-05-06 | — | — | US | claimed |
| CN-113347793-B | Method for manufacturing printed wiring board | 味之素株式会社 | 2026-05-19 | — | — | CN | disclosed |
| US-12617907-B2 | Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2026-05-05 | — | — | US | disclosed |
| EP-4734673-A1 | WIRING BOARD | Resonac Corporation (JP) | 2026-04-29 | — | — | EP | disclosed |
| US-20260109849-A1 | EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-23 | — | — | US | disclosed |
| EP-3971920-B1 | RESIN COMPOSITION | AJINOMOTO KK (JP) | 2026-04-01 | — | — | EP | disclosed |
| EP-4711416-A1 | RESIN COMPOSITION AND USE THEREOF | TOKUYAMA CORPORATION (JP) | 2026-03-18 | — | — | EP | disclosed |
| US-20260022220-A1 | RESIN COMPOSITION AND PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAME | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2026-01-22 | — | — | US | disclosed |
| EP-2698393-A1 | Resin composition | Ajinomoto Co., Inc. (JP) | 2014-02-19 | — | — | EP | disclosed |
| EP-2647667-A1 | CURABLE EPOXY RESIN COMPOSITION | Daicel Corporation (JP) | 2013-10-09 | — | — | EP | disclosed |
| US-20130256017-A1 | LAMINATED STRUCTURE, DRY FILM AND METHOD OF PRODUCING LAMINATED STRUCTURE | TAIYO INK MFG. CO., LTD. (JP) | 2013-10-03 | — | — | US | disclosed |
| US-20130241086-A1 | CURABLE EPOXY RESIN COMPOSITION | DAICEL CORPORATION (JP) | 2013-09-19 | — | — | US | disclosed |
| US-20130178559-A1 | FIBER-REINFORCED RESIN COMPOSITE MATERIAL | DAICEL CORPORATION (JP) | 2013-07-11 | — | — | US | disclosed |
| US-20100133703-A1 | Semiconductor Chip Laminate and Adhesive Composition for Semiconductor Chip Lamination | LINTEC CORPORATION (JP) | 2010-06-03 | — | — | US | disclosed |
| EP-2174969-A1 | RESIN COMPOSITION | Ajinomoto Co., Inc. (JP) | 2010-04-14 | — | — | EP | disclosed |
| US-20090030158-A1 | RESIN COMPOSITION | AJINOMOTO CO., INC (JP) | 2009-01-29 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20090030158-A1 | RESIN COMPOSITION | PPA1, PTGER1, TAF5 | FABP3 4515/4885NFKB1 1819/4885CA1 867/4885 |
| US-20260109849-A1 | EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE | ASH2L, DOT1L, ASH1L | FABP3 4310/4885NFKB1 2022/4885CA1 2457/4885 |
| US-12617907-B2 | Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board | SUZ12, RXRB, RXRG | FABP3 4532/4885NFKB1 2981/4885CA1 732/4885 |
| US-20260022220-A1 | RESIN COMPOSITION AND PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAME | P2RY11, P2RY10, PRPF40A | FABP3 4826/4885NFKB1 3594/4885CA1 727/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.