Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FABP3 | P05413 | 6/20 | 0.60 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.58 |
| ▸ | CA1 | P00915 | 1/20 | 0.58 |
| ▸ | GPR84 | Q9NQS5 | 1/20 | 0.56 |
| ▸ | DNM1 | Q05193 | 2/20 | 0.56 |
| ▸ | CA2 | P00918 | 2/20 | 0.55 |
| ▸ | CES2 | O00748 | 3/20 | 0.54 |
| ▸ | CES1 | P23141 | 3/20 | 0.54 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Stearic Acid SCHEMBL9063410 | 1.00 | FABP3 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Octanoic Acid SCHEMBL16008346 | 1.00 | FABP3 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Myristic Acid SCHEMBL15091865 | 1.00 | FABP3 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Decanoic Acid SCHEMBL3323693 | 1.00 | FABP3 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Palmitic Acid SCHEMBL15091868 | 1.00 | FABP3 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Octanoic Acid SCHEMBL16007959 | 0.98 | DNM1 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| SCHEMBL253165 | 0.98 | CA1 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Hexanoate SCHEMBL28546350 | 0.98 | CA1 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Octanoic Acid SCHEMBL11573973 | 0.96 | FABP3 (0.60) | FABP3NFKB1CA1GPR84DNM1 | |
| Decanoic Acid SCHEMBL194214 | 0.96 | FABP3 (0.60) | FABP3NFKB1CA1GPR84DNM1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 218 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250142194-A1 | BONDED BODY, MANUFACTURING METHOD OF BONDED BODY, IMAGING MODULE, ELECTRONIC DEVICE, AND RESIN COMPOSITION | CANON KABUSHIKI KAISHA (JP) | 2025-05-01 | — | — | US | claimed |
| US-20260109860-A1 | HEAT-CURABLE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-23 | — | — | US | disclosed |
| EP-4729563-A1 | HEAT-CURABLE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD., (JP) | 2026-04-22 | — | — | EP | disclosed |
| US-12565608-B2 | Thermally conductive resin composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-03 | — | — | US | disclosed |
| EP-4679461-A2 | RESIN COMPOSITION AND PRODUCTION METHOD OF THE SAME | AJINOMOTO CO., INC. (JP) | 2026-01-14 | — | — | EP | disclosed |
| US-20250346788-A1 | POLYMALEIMIDE RESIN, RESIN COMPOSITION, CURED OBJECT, SHEET, LAMINATE, AND PRINTED WIRING BOARD | RESONAC CORP (JP) | 2025-11-13 | — | — | US | disclosed |
| US-20250324789-A1 | IMAGING MODULE AND IMAGING APPARATUS | CANON KK (JP) | 2025-10-16 | — | — | US | disclosed |
| US-20250277087-A1 | MALEIMIDE RESIN, RESIN COMPOSITION, CURED PRODUCT, SHEET, LAMINATE, AND PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2025-09-04 | — | — | US | disclosed |
| EP-4586285-A1 | RESIN COMPOSITION | AJINOMOTO CO., INC. (JP) | 2025-07-16 | — | — | EP | disclosed |
| CN-120192630-A | Resin composition | 味之素株式会社 | 2025-06-24 | — | — | CN | disclosed |
| EP-2647667-A1 | CURABLE EPOXY RESIN COMPOSITION | Daicel Corporation (JP) | 2013-10-09 | — | — | EP | disclosed |
| US-20130241086-A1 | CURABLE EPOXY RESIN COMPOSITION | DAICEL CORPORATION (JP) | 2013-09-19 | — | — | US | disclosed |
| US-20130178559-A1 | FIBER-REINFORCED RESIN COMPOSITE MATERIAL | DAICEL CORPORATION (JP) | 2013-07-11 | — | — | US | disclosed |
| US-8399575-B2 | Crosslinkable materials based on organosilicon compounds | WACKER CHEMIE AG (DE) | 2013-03-19 | — | — | US | disclosed |
| US-20120004364-A1 | Crosslinkable Materials Based On Organosilicon Compounds | WACKER CHEMIE AG (DE) | 2012-01-05 | — | — | US | disclosed |
| EP-2031024-B1 | Crosslinkable materials based on organosilicon compounds | WACKER CHEMIE AG (DE) | 2010-02-24 | — | — | EP | disclosed |
| EP-2150577-A1 | CROSS-LINKABLE MASSES COMPRISING PHOSPHORUS COMPOUNDS | Wacker Chemie AG (DE) | 2010-02-10 | — | — | EP | disclosed |
| US-20090062471-A1 | CROSSLINKABLE MATERIALS BASED ON ORGANOSILICON COMPOUNDS | WACKER CHEMIE AG (DE) | 2009-03-05 | — | — | US | disclosed |
| EP-2031024-A1 | Crosslinkable materials based on organosilicon compounds | Wacker Chemie AG (DE) | 2009-03-04 | — | — | EP | disclosed |
| WO-2008141951-A1 | CROSS-LINKABLE MASSES COMPRISING PHOSPHORUS COMPOUNDS | WACKER CHEMIE AG (DE) | 2008-11-27 | — | — | WO | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12565608-B2 | Thermally conductive resin composition | ITGAM, RAE1, FCGR1A | FABP3 3999/4885NFKB1 2614/4885CA1 1109/4885 |
| US-20260109860-A1 | HEAT-CURABLE RESIN COMPOSITION | RAD51, COL2A1, SEM1 | FABP3 4826/4885NFKB1 2562/4885CA1 291/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.