SCHEMBL3349467

SCHEMBL3349467

CC(Cl)c1c2ccccc2nc2ccccc12

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOA P21397 2/20 0.52
MAOB P27338 1/20 0.52
POLB P06746 2/20 0.47
KDM4E B2RXH2 6/20 0.46
ALDH1A1 P00352 5/20 0.46
HPGD P15428 4/20 0.46
GLA P06280 4/20 0.46
SMN1; SMN2 Q16637 3/20 0.46
CASP1 P29466 2/20 0.46
CASP7 P55210 2/20 0.46
HSD17B10 Q99714 2/20 0.46
CHRM2 P08172 1/20 0.46
ADRA2A P08913 1/20 0.46
ADORA3 P0DMS8 1/20 0.46
CHRM1 P11229 1/20 0.46
NQO2 P16083 1/20 0.46
DRD1 P21728 1/20 0.46
ACHE P22303 1/20 0.46
SLC6A2 P23975 1/20 0.46
ADRA1A P35348 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1102408 0.82 KDM4E (0.50) MAOAMAOBPOLBKDM4EALDH1A1
SCHEMBL17423904 0.82 KDM4E (0.50) MAOAMAOBPOLBKDM4EALDH1A1
SCHEMBL6749119 0.81 CYP1A2 (0.36) KDM4EALDH1A1SMN1; SMN2HSD17B10TDP1
SCHEMBL3347479 0.78 POLB (0.47) MAOAMAOBPOLBKDM4EALDH1A1
Hydrochloric Acid SCHEMBL9687047 0.76 MAOA (0.50) MAOAMAOBKDM4EALDH1A1HPGD
SCHEMBL29853736 0.76 L3MBTL1 (0.45) MAOAPOLBKDM4EALDH1A1HPGD
SCHEMBL4645643 0.76 L3MBTL1 (0.45) MAOAPOLBKDM4EALDH1A1HPGD
SCHEMBL3343034 0.75 POLB (0.59) MAOAMAOBPOLBKDM4EALDH1A1
SCHEMBL13941688 0.75 POLB (0.53) MAOAMAOBPOLBKDM4EALDH1A1
SCHEMBL12386870 0.75 KDM4E (0.50) MAOAMAOBPOLBKDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US claimed
US-12353130-B2 Photosensitive resin composition and photosensitive resin multilayer body ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-07-08 US disclosed
CN-120044756-A Photosensitive resin composition 旭化成株式会社 2025-05-27 CN disclosed
CN-115524922-B Photosensitive resin composition 旭化成株式会社 2025-02-18 CN disclosed
WO-2025018412-A1 PHOTOSENSITIVE ELEMENT, PHOTOSENSITIVE ELEMENT ROLL, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING CONDUCTOR PATTERN 旭化成株式会社 2025-01-23 WO disclosed
US-20240408595-A1 STRUCTURE COMPRISING MICROCHANNEL, PRODUCTION METHOD FOR SAID STRUCTURE, AND MICROCHANNEL DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-12-12 US disclosed
CN-119024642-A Photocurable resin composition, application thereof and photosensitive dry film resist laminate 杭州福斯特电子材料有限公司 2024-11-26 CN disclosed
US-12032286-B2 Method for producing multi-layered type microchannel device using photosensitive resin laminate ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-07-09 US disclosed
CN-118119565-A Structure having micro-channel, method for manufacturing same, and micro-channel device 旭化成株式会社 2024-05-31 CN disclosed
US-20240059803-A1 PHOTOSENSITIVE RESIN MULTILAYER BODY AND METHOD FOR PRODUCING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-02-22 US disclosed
CN-111596526-A Photosensitive resin composition and photosensitive resin laminate 旭化成株式会社 2020-08-28 CN disclosed
CN-111566173-A Coating composition, method for curing the composition, barrier film, and method for producing cured product 株式会社艾迪科 2020-08-21 CN disclosed
CN-111527450-A Photosensitive resin laminate and method for producing same 旭化成株式会社 2020-08-11 CN disclosed
CN-106462068-B Photosensitive resin composition and method for forming circuit pattern 旭化成株式会社 2020-07-24 CN disclosed
CN-111316164-A Photosensitive resin laminate and method for producing resist pattern 旭化成株式会社 2020-06-19 CN disclosed
CN-106966074-B Photosensitive resin laminate roll 旭化成株式会社 2020-05-05 CN disclosed
CN-106918993-B Photosensitive resin composition, photosensitive resin laminate, and method for forming protective pattern 旭化成株式会社 2020-03-10 CN disclosed
EP-3339331-A1 COMPOSITION Adeka Corporation (JP) 2018-06-27 EP disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US disclosed