SCHEMBL3349470

SCHEMBL3349470

ClCCc1c2ccccc2nc2ccccc12

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 7/20 0.70
ALDH1A1 P00352 4/20 0.70
HPGD P15428 3/20 0.70
GAA P10253 2/20 0.70
MAOA P21397 2/20 0.52
MAOB P27338 1/20 0.52
KMT2A Q03164 4/20 0.48
GLA P06280 4/20 0.47
POLB P06746 3/20 0.47
HSD17B10 Q99714 3/20 0.46
CASP1 P29466 2/20 0.46
CASP7 P55210 2/20 0.46
SMN1; SMN2 Q16637 2/20 0.46
CHRM2 P08172 1/20 0.46
ADRA2A P08913 1/20 0.46
ADORA3 P0DMS8 1/20 0.46
CHRM1 P11229 1/20 0.46
NQO2 P16083 1/20 0.46
DRD1 P21728 1/20 0.46
ACHE P22303 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL321444 0.86 KDM4E (0.75) KDM4EALDH1A1HPGDGAAMAOA
SCHEMBL29446776 0.86 KDM4E (0.75) KDM4EALDH1A1HPGDGAAMAOA
SCHEMBL9669404 0.84 KDM4E (0.56) KDM4EALDH1A1HPGDGAAMAOA
SCHEMBL3343659 0.83 KDM4E (1.00) KDM4EALDH1A1HPGDGAAMAOA
SCHEMBL29446754 0.82 KDM4E (0.69) KDM4EALDH1A1HPGDGAAMAOA
SCHEMBL29385771 0.82 KDM4E (0.69) KDM4EALDH1A1HPGDGAAMAOA
SCHEMBL321679 0.82 KDM4E (0.69) KDM4EALDH1A1HPGDGAAMAOA
SCHEMBL320907 0.82 KDM4E (0.69) KDM4EALDH1A1HPGDGAAMAOA
SCHEMBL194585 0.80 KDM4E (0.67) KDM4EALDH1A1HPGDGAAMAOA
SCHEMBL600275 0.80 KDM4E (0.67) KDM4EALDH1A1HPGDGAAMAOA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US claimed
US-12353130-B2 Photosensitive resin composition and photosensitive resin multilayer body ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-07-08 US disclosed
CN-120044756-A Photosensitive resin composition 旭化成株式会社 2025-05-27 CN disclosed
CN-115524922-B Photosensitive resin composition 旭化成株式会社 2025-02-18 CN disclosed
WO-2025018412-A1 PHOTOSENSITIVE ELEMENT, PHOTOSENSITIVE ELEMENT ROLL, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING CONDUCTOR PATTERN 旭化成株式会社 2025-01-23 WO disclosed
CN-119148465-A Photosensitive resin composition, photosensitive dry film and application thereof 杭州福斯特电子材料有限公司 2024-12-17 CN disclosed
US-20240408595-A1 STRUCTURE COMPRISING MICROCHANNEL, PRODUCTION METHOD FOR SAID STRUCTURE, AND MICROCHANNEL DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-12-12 US disclosed
CN-119024642-A Photocurable resin composition, application thereof and photosensitive dry film resist laminate 杭州福斯特电子材料有限公司 2024-11-26 CN disclosed
US-12032286-B2 Method for producing multi-layered type microchannel device using photosensitive resin laminate ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-07-09 US disclosed
CN-118119565-A Structure having micro-channel, method for manufacturing same, and micro-channel device 旭化成株式会社 2024-05-31 CN disclosed
CN-102844709-B Photosensitive resin composition, photoresist film using same, method for forming resist pattern, and method for manufacturing printed wiring board NICHIGO MORTON CO LTD 2014-08-20 CN disclosed
CN-102844709-A Photosensitive resin composition, photoresist film using same, method for forming resist pattern, and method for manufacturing printed wiring board NICHIGO MORTON CO LTD 2012-12-26 CN disclosed
CN-101449208-B Photosensitive resin composition and laminate ASAHI KASEI E-MATERIALS CORP. (JP) 2011-12-14 CN disclosed
CN-102144189-A Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern, conductive pattern, printed wiring board, lead frame, base, and method for manufacturing semiconductor package ASAHI KASEI E MATERIALS CORP 2011-08-03 CN disclosed
CN-101779165-A Photosensitive resin composition and laminate thereof ASAHI KASEI EMD CORP 2010-07-14 CN disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
CN-101568882-A Photosensitive resin composition and laminate ASAHI KASEI EMD CORP (JP) 2009-10-28 CN disclosed
CN-101449208-A Photosensitive resin composition and laminate ASAHI KASEI EMD CORP (JP) 2009-06-03 CN disclosed
CN-101438208-A Photosensitive resin composition ASAHI KASEI EMD CORP (JP) 2009-05-20 CN disclosed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US disclosed