SCHEMBL336086

SCHEMBL336086

O=CC(=O)C1CCCCC1

nearest known ligand 0.54

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
CES2 O00748 1/20 0.52
CES1 P23141 1/20 0.52
HDAC8 Q9BY41 1/20 0.44
HDAC6 Q9UBN7 1/20 0.44
TSHR P16473 2/20 0.42
ALDH1A1 P00352 1/20 0.42
ADH1B P00325 2/20 0.40
ADH1C P00326 2/20 0.40
ADH1A P07327 2/20 0.40
ADH4 P08319 1/20 0.40
HSD11B1 P28845 2/20 0.38
EPHX1 P07099 4/20 0.37
RECQL P46063 1/20 0.37
SRD5A2 P31213 1/20 0.36
ADH7 P40394 1/20 0.36
HSD11B2 P80365 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Water SCHEMBL11679290 0.97 CES2 (0.50) CES2CES1HDAC8HDAC6TSHR
Water SCHEMBL11679288 0.97 CES2 (0.50) CES2CES1HDAC8HDAC6TSHR
SCHEMBL3628732 0.97
SCHEMBL14905737 0.92
SCHEMBL27496040 0.87 CES2 (0.41) CES2CES1HDAC8HDAC6TSHR
SCHEMBL1370935 0.85
SCHEMBL27622993 0.82
SCHEMBL27702215 0.78 CES2 (0.52) CES2CES1HDAC8HDAC6TSHR
SCHEMBL14206645 0.77 TSHR (0.46) TSHREPHX1
SCHEMBL28822104 0.77 MAPT (0.31) CES2CES1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 612 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118307932-A High-temperature-resistant high-thermal-conductivity epoxy insulation heat-conducting composition and preparation method thereof 上海晟皎科技有限公司 2024-07-09 CN claimed
WO-2024051931-A1 AMINO COMPOUND-CONTAINING DISPERSION POWDER COMPOSITIONS WACKER CHEMIE AG (DE) 2024-03-14 WO claimed
CN-117542726-A Semiconductor device cleaning method and semiconductor device 粤芯半导体技术股份有限公司 2024-02-09 CN claimed
CN-112789302-B Two-part cyanoacrylate curable adhesive systems 汉高股份有限及两合公司 2023-05-16 CN claimed
CN-112789302-A Two-part cyanoacrylate curable adhesive systems 汉高股份有限及两合公司 2021-05-11 CN claimed
US-20140087207-A1 ARTICLES COMPRISING A WEATHER-RESISTANT ADHESIVE LAYER IN CONTACT WITH A LOW SURFACE-ENERGY MATERIAL DU PONT (US) 2014-03-27 US claimed
US-8309632-B2 Liquid crystalline epoxy nanocomposite material and application thereof NATIONAL TAIWAN UNIVERSITY (TW) 2012-11-13 US claimed
US-20110009521-A1 Liquid crystalline epoxy nanicomposite material and application thereof NATIONAL TAIWAN UNIVERSITY (TW) 2011-01-13 US claimed
US-7616374-B2 Electrophoretic displays with improved high temperature performance SIPIX IMAGING, INC. (US) 2009-11-10 US claimed
CN-1916004-A Organic-inorganic metal hybrid material and composition comprising the same SAMSUNG ELECTRONICS CO LTD (KR) 2007-02-21 CN claimed
EP-0733689-A1 Chloroprene rubber adhesive composition KONISHI CO., LTD. (JP) 1996-09-25 EP claimed
US-5318851-A Curable composition with auxiliary curing agent; coatings ELF ATOCHEM N.A., INC. (US) 1994-06-07 US claimed
US-5310825-A Toughness, prepregs, composites BP CHEMICALS (HITCO) INC. (US) 1994-05-10 US claimed
EP-0455755-A4 EPOXY MATRIX TOUGHENED WITH POLYIMIDE THERMOPLASTIC RESIN 1992-08-12 EP claimed
EP-0455755-A1 EPOXY MATRIX TOUGHENED WITH POLYIMIDE THERMOPLASTIC RESIN. HITCO (US) 1991-11-13 EP claimed
WO-1991002029-A1 EPOXY MATRIX TOUGHENED WITH POLYIMIDE THERMOPLASTIC RESIN HITCO (US) 1991-02-21 WO claimed
US-4448940-A POLYOXAZOLINES BASED ON DINITRILES AND DIEPOXY COMPOUNDS; POLYISOCYANURATE; FLEXIBILITY; PRINTED CIRCUITS HITACHI, LTD. (JP) 1984-05-15 US claimed
US-4421806-A CURED POLYBUTADIENE OR CARBOXY-TERMINATED POLYBUTADIENE LOCKHEED MISSILES & SPACE COMPANY, INC. (US) 1983-12-20 US claimed
US-4338225-A High performance resin reaction products of carboxyl terminated 1,2-polybutadiene with epoxides and acid terminated difunctional aliphatic alcohols THE BOEING COMPANY 1982-07-06 US claimed
US-4276135-A Photocurable organopolysiloxane compositions SHIN-ETSU CHEMICAL CO. LTD. (JP) 1981-06-30 US claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20110009521-A1 Liquid crystalline epoxy nanicomposite material and application thereof NUP205, CNP, NOS2 CES2 36/4885CES1 735/4885HDAC8 753/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.