Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 7/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.37 |
| ▸ | IDO1 | P14902 | 1/20 | 0.36 |
| ▸ | TDO2 | P48775 | 1/20 | 0.36 |
| ▸ | MEN1 | O00255 | 2/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.35 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.35 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.35 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.35 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.35 |
| ▸ | ATM | Q13315 | 1/20 | 0.35 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.31 |
| ▸ | HTT | P42858 | 1/20 | 0.31 |
| ▸ | PKM | P14618 | 1/20 | 0.30 |
| ▸ | CETP | P11597 | 1/20 | 0.30 |
| ▸ | LMNA | P02545 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL24355085 | 0.81 | KDM4E (0.39) | KDM4EALDH1A1IDO1TDO2MEN1 | |
| SCHEMBL14423159 | 0.79 | KDM4E (0.33) | KDM4EALDH1A1MEN1KMT2ACYP1A2 | |
| SCHEMBL10946796 | 0.79 | KDM4E (0.42) | KDM4EALDH1A1IDO1TDO2MEN1 | |
| SCHEMBL13532352 | 0.79 | KDM4E (0.40) | KDM4EALDH1A1IDO1TDO2MEN1 | |
| SCHEMBL15922747 | 0.76 | KDM4E (0.45) | KDM4EALDH1A1IDO1TDO2MEN1 | |
| SCHEMBL1977356 | 0.76 | KDM4E (0.45) | KDM4EALDH1A1IDO1TDO2MEN1 | |
| SCHEMBL14117842 | 0.76 | KDM4E (0.43) | KDM4EALDH1A1IDO1TDO2MEN1 | |
| SCHEMBL12256142 | 0.75 | KDM4E (0.42) | KDM4EALDH1A1IDO1TDO2MEN1 | |
| SCHEMBL3363553 | 0.75 | KDM4E (0.41) | KDM4EALDH1A1IDO1TDO2MEN1 | |
| SCHEMBL19689430 | 0.74 | KDM4E (0.44) | KDM4EALDH1A1IDO1TDO2MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1164434-B1 | Radiation-sensitive resin composition | JSR CORP (JP) | 2010-10-06 | — | — | EP | disclosed |
| EP-1183571-B1 | FLUORINATED PHOTORESISTS AND PROCESSES FOR MICROLITHOGRAPHY | DU PONT (US) | 2010-06-02 | — | — | EP | disclosed |
| US-7700262-B2 | Top coat material and use thereof in lithography processes | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-04-20 | — | — | US | disclosed |
| US-7638261-B2 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2009-12-29 | — | — | US | disclosed |
| US-20090148790-A1 | RADIATION-SENSITIVE RESIN COMPOSITION | JSR CORPORATION (JP) | 2009-06-11 | — | — | US | disclosed |
| US-7521169-B2 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2009-04-21 | — | — | US | disclosed |
| US-20080166568-A1 | TOP COAT MATERIAL AND USE THEREOF IN LITHOGRAPHY PROCESSES | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-07-10 | — | — | US | disclosed |
| US-7335456-B2 | Top coat material and use thereof in lithography processes | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-02-26 | — | — | US | disclosed |
| US-7335456-B2 | Top coat material and use thereof in lithography processes | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-02-26 | — | — | US | disclosed |
| US-20080038676-A1 | TOP COAT MATERIAL AND USE THEREOF IN LITHOGRAPHY PROCESSES | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-02-14 | — | — | US | disclosed |
| US-20040072094-A1 | Radiation sensitive resin composition | JSR CORPORATION (JP) | 2004-04-15 | — | — | US | disclosed |
| US-6677419-B1 | REACTING STOICHIOMETRIC EXCESS OF UNSATURATED ALICYCLIC MONOMER WITH ANOTHER UNSATURATED MONOMER, HAVING LESS THAN TWO ELECTRON-WITHDRAWING GROUPS APPENDED TO UNSATURATION, IN PRESENCE OF FREE RADICAL INITIATOR | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2004-01-13 | — | — | US | disclosed |
| US-20030219680-A1 | Photoresists useful for microfabrication utilizing deep ultraviolet rays such as an excimer laser, x-rays such as synchrotron radiation, and electron beams | JSR CORPORATION (JP) | 2003-11-27 | — | — | US | disclosed |
| US-6623907-B2 | Chemical amplified photoresist | JSR CORPORATION (JP) | 2003-09-23 | — | — | US | disclosed |
| US-20020058201-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2002-05-16 | — | — | US | disclosed |
| EP-1193558-A2 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2002-04-03 | — | — | EP | disclosed |
| US-20020009668-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2002-01-24 | — | — | US | disclosed |
| EP-1164434-A2 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-12-19 | — | — | EP | disclosed |
| US-20010023050-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2001-09-20 | — | — | US | disclosed |
| EP-1122605-A2 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-08-08 | — | — | EP | disclosed |