Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GSTP1 | P09211 | 1/20 | 0.36 |
| ▸ | HDAC4 | P56524 | 1/20 | 0.35 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.35 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.35 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.35 |
| ▸ | CTSK | P43235 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
| ▸ | RAB9A | P51151 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3775177 | 0.85 | GSTP1 (0.37) | GSTP1HDAC4HDAC2HDAC8HDAC6 | |
| SCHEMBL7566848 | 0.83 | GSTP1 (0.36) | GSTP1HDAC4HDAC2HDAC8HDAC6 | |
| SCHEMBL10736533 | 0.81 | ALDH1A1 (0.40) | GSTP1HDAC4HDAC2HDAC8HDAC6 | |
| SCHEMBL6669183 | 0.81 | GSTP1 (0.36) | GSTP1HDAC4HDAC2HDAC8HDAC6 | |
| SCHEMBL1695435 | 0.81 | ESR1 (0.41) | GSTP1HDAC4HDAC2HDAC8HDAC6 | |
| SCHEMBL4049811 | 0.81 | KMT2A (0.36) | GSTP1HDAC4HDAC2HDAC8HDAC6 | |
| SCHEMBL11809148 | 0.81 | GSTP1 (0.36) | GSTP1HDAC4HDAC2HDAC8HDAC6 | |
| SCHEMBL1695485 | 0.80 | ESR1 (0.40) | GSTP1HDAC4HDAC2HDAC8HDAC6 | |
| SCHEMBL7622874 | 0.80 | ESR1 (0.40) | GSTP1HDAC4HDAC2HDAC8HDAC6 | |
| SCHEMBL1695482 | 0.80 | ESR1 (0.40) | GSTP1HDAC4HDAC2HDAC8HDAC6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024150722-A1 | LAMINATE, SEMICONDUCTOR ELEMENT, AND MEMS ELEMENT | 東レ株式会社 | 2024-07-18 | — | — | WO | disclosed |
| CN-118020025-A | Photosensitive resin composition, cured product, organic EL display device, semiconductor device, and method for producing cured product | 东丽株式会社 | 2024-05-10 | — | — | CN | disclosed |
| US-11822243-B2 | Negative-type photosensitive resin composition, cured film, element and display device provided with cured film, and production method therefor | TORAY INDUSTRIES, INC. (JP) | 2023-11-21 | — | — | US | disclosed |
| CN-116802559-A | Photosensitive resin composition, cured film, electronic component, antenna element, semiconductor package, and compound | 东丽株式会社 | 2023-09-22 | — | — | CN | disclosed |
| WO-2023095785-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED ARTICLE, ORGANIC EL DISPLAY DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING CURED ARTICLE | 東レ株式会社 | 2023-06-01 | — | — | WO | disclosed |
| US-20230098085-A1 | ORGANIC EL DISPLAY DEVICE, PRODUCTION METHOD FOR CURED PRODUCT, AND PRODUCTION METHOD FOR ORGANIC EL DISPLAY DEVICE | TORAY INDUSTRIES, INC. (JP) | 2023-03-30 | — | — | US | disclosed |
| CN-115698854-A | Photosensitive resin composition, cured product, display device, semiconductor device, and method for producing cured product | 东丽株式会社 | 2023-02-03 | — | — | CN | disclosed |
| CN-109804310-B | Negative photosensitive resin composition, cured film, element and display device provided with cured film, and method for producing same | 东丽株式会社 | 2022-09-30 | — | — | CN | disclosed |
| CN-115066980-A | Organic EL display device, method for producing cured product, and method for producing organic EL display device | 东丽株式会社 | 2022-09-16 | — | — | CN | disclosed |
| CN-109791352-B | Photosensitive resin composition, method for producing conductive pattern, substrate, touch panel, and display | 东丽株式会社 | 2022-07-29 | — | — | CN | disclosed |
| US-20020009667-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2002-01-24 | — | — | US | disclosed |
| US-20020009668-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2002-01-24 | — | — | US | disclosed |
| EP-1164434-A2 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-12-19 | — | — | EP | disclosed |
| EP-1162506-A1 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-12-12 | — | — | EP | disclosed |
| US-20010023050-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2001-09-20 | — | — | US | disclosed |
| EP-1122605-A2 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-08-08 | — | — | EP | disclosed |
| EP-1085379-A1 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-03-21 | — | — | EP | disclosed |
| US-6180316-B1 | SUITABLE FOR USE AS CHEMICALLY AMPLIFIED RESIST USED IN MANUFACTURING OF INTEGRATED CIRCUITS | JSR CORPORATION (JP) | 2001-01-30 | — | — | US | disclosed |
| EP-1048983-A1 | Radiation sensitive resin composition | JSR Corporation (JP) | 2000-11-02 | — | — | EP | disclosed |
| EP-0930541-A1 | Radiation sensitive resin composition | JSR Corporation (JP) | 1999-07-21 | — | — | EP | disclosed |