SCHEMBL336522

SCHEMBL336522

Cc1cc(CO)c(O)cc1CO

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SHBG P04278 1/20 0.48
PKM P14618 2/20 0.45
KLF10 Q13118 1/20 0.42
KDM4E B2RXH2 6/20 0.41
ALDH1A1 P00352 5/20 0.41
MEN1 O00255 5/20 0.41
KMT2A Q03164 5/20 0.41
TDP1 Q9NUW8 4/20 0.41
MAPT P10636 4/20 0.41
THRB P10828 3/20 0.41
POLB P06746 2/20 0.41
HKDC1 Q2TB90 2/20 0.41
L3MBTL1 Q9Y468 2/20 0.41
G6PD P11413 2/20 0.41
GAA P10253 1/20 0.41
PABPC1 P11940 1/20 0.41
RECQL P46063 3/20 0.38
MAPK1 P28482 3/20 0.38
APEX1 P27695 2/20 0.38
HTT P42858 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5075167 0.90 SHBG (0.54) SHBGPKMKLF10KDM4EALDH1A1
SCHEMBL5097086 0.87 SHBG (0.52) SHBGPKMKLF10KDM4EALDH1A1
SCHEMBL28472333 0.85 SHBG (0.48) SHBGPKMKLF10KDM4EALDH1A1
SCHEMBL14283762 0.85 KDM4E (0.50) SHBGPKMKLF10KDM4EALDH1A1
SCHEMBL30595358 0.85 SHBG (0.54) SHBGPKMKLF10KDM4EALDH1A1
SCHEMBL4064913 0.85 SHBG (0.54) SHBGPKMKLF10KDM4EALDH1A1
SCHEMBL8830418 0.84 KLF10 (0.46) SHBGPKMKLF10KDM4EALDH1A1
SCHEMBL394846 0.81 SHBG (0.48) SHBGPKMKDM4EALDH1A1MAPT
SCHEMBL13513916 0.79 SHBG (0.44) SHBGPKMKLF10KDM4EALDH1A1
SCHEMBL6254952 0.78 KLF10 (0.43) PKMKLF10KDM4EALDH1A1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8765868-B2 Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2014-07-01 US disclosed
US-8097386-B2 Positive-type photosensitive resin composition, method for producing patterns, and electronic parts HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2012-01-17 US disclosed
US-20110027544-A1 Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2011-02-03 US disclosed
US-20100227126-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNS, AND ELECTRONIC PARTS HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2010-09-09 US disclosed
EP-1204703-A1 THERMOPLASTIC VULCANIZATES FROM DYNAMICALLY VULCANIZED TPU/APOLAR RUBBER BLENDS HUNTSMAN INTERNATIONAL LLC (US) 2002-05-15 EP disclosed
WO-2001010950-A1 THERMOPLASTIC VULCANIZATES FROM DYNAMICALLY VULCANIZED TPU/APOLAR RUBBER BLENDS HUNTSMAN INTERNATIONAL LLC (US) 2001-02-15 WO disclosed
EP-0385408-B1 Color diffusion transfer photographic light-sensitive material FUJI PHOTO FILM CO LTD (JP) 1997-02-05 EP disclosed
US-5063135-A Including a novolak phenolic resin interlayer; antisoilants; antifogging agents; thin film strength; high speed completion time; adhesion FUJI PHOTO FILM CO., LTD. (JP) 1991-11-05 US disclosed
EP-0050802-B1 LIGHT-SENSITIVE COMPOSITION, LIGHT-SENSITIVE COPYING MATERIAL MADE THEREFROM, AND PROCESS FOR PRODUCING A PRINTING FORME FROM THIS MATERIAL HOECHST AKTIENGESELLSCHAFT (DE) 1985-04-10 EP disclosed