SCHEMBL336529

SCHEMBL336529

O=C1c2ccc3ccccc3c2C(=O)N1S(=O)(=O)C(F)(F)F

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DNMT1 P26358 1/20 0.45
CES1 P23141 3/20 0.38
ALDH1A1 P00352 5/20 0.38
MEN1 O00255 3/20 0.38
KMT2A Q03164 3/20 0.38
MAPT P10636 3/20 0.38
RAB9A P51151 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
HPGD P15428 4/20 0.36
TP53 P04637 2/20 0.36
MAPK1 P28482 2/20 0.36
USP2 O75604 1/20 0.36
LMNA P02545 1/20 0.36
CYP1A2 P05177 1/20 0.36
CYP2D6 P10635 1/20 0.36
CYP2C9 P11712 1/20 0.36
ALOX12 P18054 1/20 0.36
CYP2C19 P33261 1/20 0.36
HIF1A Q16665 1/20 0.36
POLB P06746 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28737197 0.78 PTGS2 (0.34) ALDH1A1MEN1KMT2AMAPTRAB9A
Trifluoromethanesulfonic Acid SCHEMBL51718 0.77 DNMT1 (0.43) DNMT1CES1ALDH1A1MEN1KMT2A
SCHEMBL7782937 0.77 DNMT1 (0.43) DNMT1CES1ALDH1A1MEN1KMT2A
SCHEMBL30643544 0.77 CASP1 (0.42) CES1ALDH1A1MEN1KMT2AMAPT
SCHEMBL8423045 0.77 CASP1 (0.42) CES1ALDH1A1MEN1KMT2AMAPT
SCHEMBL184225 0.76 DNMT1 (0.42) DNMT1CES1ALDH1A1MEN1KMT2A
SCHEMBL29139803 0.75 DNMT1 (0.38) DNMT1CES1ALDH1A1MEN1KMT2A
SCHEMBL28379089 0.73 ERCC1 (0.50) DNMT1CES1ALDH1A1MEN1KMT2A
SCHEMBL6734024 0.69 DNMT1 (0.50) DNMT1CES1ALDH1A1MEN1KMT2A
SCHEMBL8407062 0.69 DNMT1 (0.50) DNMT1CES1ALDH1A1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8765868-B2 Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2014-07-01 US disclosed
US-8097386-B2 Positive-type photosensitive resin composition, method for producing patterns, and electronic parts HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2012-01-17 US disclosed
US-20110027544-A1 Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2011-02-03 US disclosed
US-20100227126-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNS, AND ELECTRONIC PARTS HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2010-09-09 US disclosed