Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 3/20 | 0.43 |
| ▸ | NPC1 | O15118 | 1/20 | 0.43 |
| ▸ | RAB9A | P51151 | 1/20 | 0.43 |
| ▸ | BRAF | P15056 | 4/20 | 0.42 |
| ▸ | PIN1 | Q13526 | 2/20 | 0.42 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.42 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.42 |
| ▸ | CASP1 | P29466 | 1/20 | 0.42 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.42 |
| ▸ | POLB | P06746 | 3/20 | 0.40 |
| ▸ | TNKS | O95271 | 2/20 | 0.40 |
| ▸ | PARP1 | P09874 | 2/20 | 0.40 |
| ▸ | TNKS2 | Q9H2K2 | 2/20 | 0.40 |
| ▸ | ERCC1 | P07992 | 2/20 | 0.39 |
| ▸ | FEN1 | P39748 | 2/20 | 0.39 |
| ▸ | ERCC4 | Q92889 | 2/20 | 0.39 |
| ▸ | RNASEH1 | O60930 | 1/20 | 0.39 |
| ▸ | MAPT | P10636 | 2/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.39 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ammonia Solution, Strong SCHEMBL25300630 | 0.98 | GAA (0.42) | GAANPC1RAB9ABRAFPIN1 | |
| SCHEMBL22321902 | 0.92 | ADORA2B (0.45) | GAABRAFPIN1CYP1A2MAPK1 | |
| SCHEMBL28114387 | 0.91 | BRAF (0.37) | GAANPC1RAB9ABRAFPIN1 | |
| SCHEMBL9339022 | 0.88 | SMPD3 (0.46) | GAANPC1RAB9ABRAFPIN1 | |
| SCHEMBL468691 | 0.88 | LTB4R (0.47) | GAANPC1RAB9ABRAFPIN1 | |
| SCHEMBL11306970 | 0.88 | SMPD3 (0.49) | GAANPC1RAB9ABRAFPIN1 | |
| SCHEMBL29020466 | 0.87 | PIN1 (0.36) | GAANPC1RAB9ABRAFPIN1 | |
| Imidazole SCHEMBL9986412 | 0.85 | BRAF (0.40) | GAANPC1RAB9ABRAFPIN1 | |
| SCHEMBL27854971 | 0.85 | KDM4E (0.42) | GAANPC1RAB9ABRAFPIN1 | |
| SCHEMBL6618223 | 0.82 | GCGR (0.44) | BRAFPIN1CYP1A2PARP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 7159 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250277138-A1 | LAYER-ADDING ADHESIVE FILM CONTAINING MODIFIED BENZOCYCLOBUTENE FOR FC-BGA PACKAGE CARRIER, PREPARATION METHOD, AND APPLICATION THEREOF | Shenzhen Newccess Industrial Co., Ltd. (CN) | 2025-09-04 | — | — | US | claimed |
| EP-4321541-B1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2025-08-06 | — | — | EP | claimed |
| CN-120032941-A | Conductive paste and preparation method of antioxidant copper powder in conductive paste | 西北工业大学 | 2025-05-23 | — | — | CN | claimed |
| US-20250163261-A1 | LOW-DIELECTRIC RESIN COMPOSITION | NAN YA PLASTICS CORPORATION (TW) | 2025-05-22 | — | — | US | claimed |
| CN-120005486-A | Low dielectric resin composition | 南亚塑胶工业股份有限公司 | 2025-05-16 | — | — | CN | claimed |
| CN-119875555-A | Liquid epoxy resin mixture and preparation method and application thereof | 万华化学集团电子材料有限公司 | 2025-04-25 | — | — | CN | claimed |
| CN-119799229-A | Epoxy plastic package material and preparation method and application thereof | 江苏中科科化新材料股份有限公司 | 2025-04-11 | — | — | CN | claimed |
| CN-116042157-B | Low-dielectric flame-retardant lamination adhesive film for FCBGA packaging carrier plate and preparation method thereof | 深圳市纽菲斯新材料科技有限公司 | 2025-04-08 | — | — | CN | claimed |
| CN-119614117-A | Modified epoxidized polybutadiene-containing build-up adhesive film for FC-BGA packaging carrier plate and preparation method and application thereof | 深圳市纽菲斯新材料科技有限公司 | 2025-03-14 | — | — | CN | claimed |
| US-20250075028-A1 | FAST-CURE RESIN FORMULATIONS WITH CONSISTENT HANDLING CHARACTERISTICS | CYTEC INDUSTRIES, INC. (US) | 2025-03-06 | — | — | US | claimed |
| US-4689388-A | POLYHYDRAZIDE, LATENT CURING AGENT, DICYANDIAMIDE, IMIDAZOLE OR DERIVATIVE | AJINOMOTO CO., INC. (JP) | 1987-08-25 | — | — | US | claimed |
| EP-0033295-B1 | INSULATING TAPE FOR THE MANUFACTURE OF AN INSULATING JACKET FOR ELECTRIC CONDUCTORS IMPREGNATED WITH A THERMOSETTING CURING MIXTURE OF EPOXY RESIN AND ACID ANHYDRIDE | SIEMENS AKTIENGESELLSCHAFT (DE) | 1987-07-15 | — | — | EP | claimed |
| US-4663190-A | CURING EPOXY RESIN, DIBASIC ACID, IMIDAZOLE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1987-05-05 | — | — | US | claimed |
| US-4658009-A | Novel 2-substituted-4,6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct | SHIKOKU CHEMICALS CORPORATION (JP) | 1987-04-14 | — | — | US | claimed |
| US-4649174-A | WATER RESISTANCE AND SOLUTION STABILITY | ORIENT CHEMICAL INDUSTRIES, LTD. (JP) | 1987-03-10 | — | — | US | claimed |
| EP-0194895-A2 | 2-substituted-4, 6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct | SHIKOKU CHEMICALS CORPORATION (JP) | 1986-09-17 | — | — | EP | claimed |
| US-4478906-A | Impregnated insulating tape for fabricating an insulating sleeve for electric conductors | SIEMENS AKTIENGESELLSCHAFT (DE) | 1984-10-23 | — | — | US | claimed |
| EP-0102916-A2 | Insulating tape based on a thermosetting epoxy resin and an acid anhydride for the impregnation of an insulator for electrical conductors | SIEMENS AKTIENGESELLSCHAFT (DE) | 1984-03-14 | — | — | EP | claimed |
| US-4336302-A | SAID TAPE CONTAINING MICA IN A BINDER CONTAINING A QUATERNARY ONIUM SALT HARDEINING ACCELERATOR | SIEMENS AKTIENGESELLSCHAFT (DE) | 1982-06-22 | — | — | US | claimed |
| EP-0033295-A2 | Insulating tape for the manufacture of an insulating jacket for electric conductors impregnated with a thermosetting curing mixture of epoxy resin and acid anhydride | SIEMENS AKTIENGESELLSCHAFT (DE) | 1981-08-05 | — | — | EP | claimed |