Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.53 |
| ▸ | GAA | P10253 | 3/20 | 0.53 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.53 |
| ▸ | MAPT | P10636 | 3/20 | 0.53 |
| ▸ | LMNA | P02545 | 2/20 | 0.53 |
| ▸ | HTT | P42858 | 2/20 | 0.53 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.53 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.50 |
| ▸ | SLC22A8 | Q8TCC7 | 1/20 | 0.50 |
| ▸ | HSD17B10 | Q99714 | 4/20 | 0.48 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.48 |
| ▸ | NPC1 | O15118 | 1/20 | 0.48 |
| ▸ | USP2 | O75604 | 1/20 | 0.48 |
| ▸ | RAB9A | P51151 | 1/20 | 0.48 |
| ▸ | CA12 | O43570 | 1/20 | 0.48 |
| ▸ | CA1 | P00915 | 1/20 | 0.48 |
| ▸ | CA2 | P00918 | 1/20 | 0.48 |
| ▸ | CA9 | Q16790 | 1/20 | 0.48 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.48 |
| ▸ | HPGD | P15428 | 2/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30786420 | 1.00 | ALDH1A1 (0.53) | ALDH1A1GAAMAPK1MAPTLMNA | |
| SCHEMBL6853626 | 0.92 | GAA (0.47) | ALDH1A1GAAMAPK1MAPTLMNA | |
| SCHEMBL11133333 | 0.90 | MAPK1 (0.58) | ALDH1A1GAAMAPK1MAPTLMNA | |
| SCHEMBL3015286 | 0.84 | LCK (0.55) | ALDH1A1GAAMAPK1MAPTLMNA | |
| SCHEMBL79989 | 0.84 | KDM4E (0.64) | ALDH1A1GAAMAPK1MAPTLMNA | |
| SCHEMBL29476052 | 0.84 | KDM4E (0.64) | ALDH1A1GAAMAPK1MAPTLMNA | |
| SCHEMBL21368975 | 0.84 | ALDH1A1 (0.61) | ALDH1A1GAAMAPK1MAPTLMNA | |
| SCHEMBL8814597 | 0.82 | GAA (0.67) | ALDH1A1GAAMAPK1MAPTLMNA | |
| SCHEMBL3287715 | 0.82 | PRKCI (0.58) | ALDH1A1GAAMAPK1MAPTLMNA | |
| SCHEMBL9307729 | 0.82 | KDM4E (0.61) | ALDH1A1GAAMAPK1MAPTLMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 268 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119570027-B | Colored end-capped photosensitive polymer, preparation method and application thereof, black photoresist and black matrix | 上海明士华新材料有限公司 | 2025-04-18 | — | — | CN | claimed |
| CN-119633623-A | Organic solvent composite nanofiltration membrane and preparation method and application thereof | 苏州大学 | 2025-03-18 | — | — | CN | claimed |
| CN-119570027-A | Colored end-capped photosensitive polymer, preparation method and application thereof, black photoresist and black matrix | 上海明士华新材料有限公司 | 2025-03-07 | — | — | CN | claimed |
| WO-2024216910-A1 | HIGH-CHEMICAL-RESISTANCE POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND USE THEREOF | 明士(北京)新材料开发有限公司 | 2024-10-24 | — | — | WO | claimed |
| WO-2022068900-A1 | POSITIVE PHOTOSENSITIVE POLYAMIDE ESTER RESIN AND COMPOSITION USING SAME | 明士(北京)新材料开发有限公司 | 2022-04-07 | — | — | WO | claimed |
| US-9975996-B2 | Positive photosensitive resin composition and polyhydroxyamide resin | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2018-05-22 | — | — | US | claimed |
| US-20160185905-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND POLYHYDROXYAMIDE RESIN | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2016-06-30 | — | — | US | claimed |
| US-12422750-B2 | Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device | FUJIFILM CORPORATION (JP) | 2025-09-23 | — | — | US | disclosed |
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-20250230283-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-17 | — | — | US | disclosed |
| EP-4398289-B1 | CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROCESSING LIQUID | FUJIFILM CORP (JP) | 2025-07-02 | — | — | EP | disclosed |
| CN-119570027-B | Colored end-capped photosensitive polymer, preparation method and application thereof, black photoresist and black matrix | 上海明士华新材料有限公司 | 2025-04-18 | — | — | CN | disclosed |
| WO-1991016123-A1 | POROUS POLYBENZOXAZOLE AND POLYBENZOTHIAZOLE MEMBRANES | THE DOW CHEMICAL COMPANY (US) | 1991-10-31 | — | — | WO | disclosed |
| US-5034026-A | Polybenzazole polymers containing indan moieties | THE DOW CHEMICAL COMPANY (US) | 1991-07-23 | — | — | US | disclosed |
| EP-0431971-A2 | Photosensitive composition and resin-encapsulated semiconductor device | KABUSHIKI KAISHA TOSHIBA (JP) | 1991-06-12 | — | — | EP | disclosed |
| US-5011753-A | Polyamides Containing Hexafluoroisopropylidene Groups Which May Be Cured To Form Polybenzoxazoles | HOECHST CELANESE CORPORATION (US) | 1991-04-30 | — | — | US | disclosed |
| US-4939215-A | CHEMICAL AND RADIATION RESISTANCE; AIRCRAFT, ELECTRONICS | HOECHST CELANESE CORPORATION (US) | 1990-07-03 | — | — | US | disclosed |
| US-4845183-A | MOLDING MATERIALS; FOR DIELECTRICS OR COATING SOLUTIONS; TOUGHNESS, FLEXIBILITY, TRANSPARENT | HOECHST CELANESE CORPORATION (US) | 1989-07-04 | — | — | US | disclosed |
| EP-0317942-A2 | Heat resistant polyamides and polybenzoxazoles from bis-[(aminohydroxyphenyl hexafluoro-isopropyl] diphenyl ethers | HOECHST CELANESE CORPORATION (US) | 1989-05-31 | — | — | EP | disclosed |