Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 3/20 | 0.50 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.50 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.50 |
| ▸ | MEN1 | O00255 | 1/20 | 0.50 |
| ▸ | THRB | P10828 | 1/20 | 0.50 |
| ▸ | BLM | P54132 | 1/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.46 |
| ▸ | TSHR | P16473 | 2/20 | 0.46 |
| ▸ | TRIM24 | O15164 | 1/20 | 0.46 |
| ▸ | TRIM33 | Q9UPN9 | 1/20 | 0.46 |
| ▸ | ERN1 | O75460 | 3/20 | 0.39 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.39 |
| ▸ | HPGD | P15428 | 1/20 | 0.38 |
| ▸ | HTT | P42858 | 1/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.38 |
| ▸ | TLR2 | O60603 | 1/20 | 0.37 |
| ▸ | TLR1 | Q15399 | 1/20 | 0.37 |
| ▸ | TLR6 | Q9Y2C9 | 1/20 | 0.37 |
| ▸ | SRC | P12931 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL26703568 | 0.82 | LMNA (0.55) | LMNATDP1KMT2AMEN1THRB | |
| SCHEMBL536090 | 0.82 | LMNA (0.55) | LMNATDP1KMT2AMEN1THRB | |
| SCHEMBL20344754 | 0.78 | LMNA (0.50) | LMNATDP1KMT2AMEN1THRB | |
| SCHEMBL3150347 | 0.78 | LMNA (0.50) | LMNATDP1KMT2AMEN1THRB | |
| SCHEMBL22620679 | 0.78 | LMNA (0.50) | LMNATDP1KMT2AMEN1THRB | |
| SCHEMBL2948538 | 0.78 | ALDH1A1 (0.41) | LMNATDP1KMT2AMEN1ALDH1A1 | |
| SCHEMBL29558672 | 0.78 | LMNA (0.50) | LMNATDP1KMT2AMEN1THRB | |
| Formaldehyde SCHEMBL28869544 | 0.78 | TDP1 (0.50) | LMNATDP1KMT2AMEN1THRB | |
| SCHEMBL6754118 | 0.78 | KMT2A (0.44) | LMNATDP1KMT2AMEN1THRB | |
| SCHEMBL17267879 | 0.77 | LMNA (0.48) | LMNATDP1KMT2AMEN1THRB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 538 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5792592-A | Photosensitive liquid precursor solutions and use thereof in making thin films | SYMETRIX CORPORATION (US) | 1998-08-11 | — | — | US | claimed |
| US-4975471-A | Photo-curable epoxy resin type composition | KABUSHIKI KAISHA TOSHIBA (JP) | 1990-12-04 | — | — | US | claimed |
| US-20240240041-A1 | RADIATION-CURABLE COMPOSITION TO PRODUCE SUPPORT SUB-STRUCTURE FOR 3D PHOTOPOLYMER JETTING | BASF SE (DE) | 2024-07-18 | — | — | US | disclosed |
| US-12030968-B2 | Shelf-stable build materials for 3D printing | 3D SYSTEMS, INC. (US) | 2024-07-09 | — | — | US | disclosed |
| US-12018165-B2 | Inks for 3D printing having low print through depth | 3D SYSTEMS, INC. | 2024-06-25 | — | — | US | disclosed |
| WO-2024124024-A1 | INKS FOR 3D PRINTING HAVING HIGH MODULUS AND DISPERSION STABILITY | 3D SYSTEMS, INC. (US) | 2024-06-13 | — | — | WO | disclosed |
| US-20240191089-A1 | INKS FOR 3D PRINTING HAVING HIGH MODULUS AND DISPERSION STABILITY | 3D SYSTEMS, INC. | 2024-06-13 | — | — | US | disclosed |
| EP-3707214-B1 | INKS FOR 3D PRINTING HAVING LOW PRINT THROUGH DEPTH | 3D SYSTEMS INC (US) | 2024-06-12 | — | — | EP | disclosed |
| US-20240174781-A1 | FLAME RESISTANT BUILD MATERIALS AND ASSOCIATED PRINTED 3D ARTICLES | 3D SYSTEMS, INC. | 2024-05-30 | — | — | US | disclosed |
| CN-113784996-B | Device for obtaining photopolymerization prepolymer | 麦提建筑公司 | 2024-05-24 | — | — | CN | disclosed |
| US-20240158610-A1 | ADDITIVES FOR BUILD MATERIALS AND ASSOCIATED PRINTED 3D ARTICLES | 3D SYSTEMS, INC. | 2024-05-16 | — | — | US | disclosed |
| EP-0536086-A1 | Photosensitive mixtures | CIBA-GEIGY AG (CH) | 1993-04-07 | — | — | EP | disclosed |
| EP-0517657-A1 | Photosensitive compositions | CIBA-GEIGY AG (CH) | 1992-12-09 | — | — | EP | disclosed |
| EP-0506616-A1 | Photosensitive acrylate mixture | CIBA-GEIGY AG (CH) | 1992-09-30 | — | — | EP | disclosed |
| US-5055378-A | Radiation curable acrylated Bisphenol A novolak epoxy resins; curing agents, fillers, photoinitiators; protective coating for printed circuit | KABUSHIKI KAISHA TOSHIBA (JP) | 1991-10-08 | — | — | US | disclosed |
| EP-0425441-A2 | Photosensitive mixture | CIBA-GEIGY AG (CH) | 1991-05-02 | — | — | EP | disclosed |
| EP-0378144-A2 | Photocurable compositions | CIBA-GEIGY AG (CH) | 1990-07-18 | — | — | EP | disclosed |
| US-4925773-A | PHOTOCURABLE RESIN | KABUSHIKI KAISHA TOSHIBA (JP) | 1990-05-15 | — | — | US | disclosed |
| EP-0273729-A2 | Solder resist ink composition | KABUSHIKI KAISHA TOSHIBA (JP) | 1988-07-06 | — | — | EP | disclosed |
| EP-0193643-A2 | Curable resin composition | KABUSHIKI KAISHA TOSHIBA (JP) | 1986-09-10 | — | — | EP | disclosed |