SCHEMBL3384477

SCHEMBL3384477

C=C(C)C(=O)OOC(C)(C)OC(=O)OC(C)(C)c1ccc(C(C)C)cc1

nearest known ligand 0.36

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
CYP2D6 P10635 1/20 0.36
CYP2C9 P11712 1/20 0.36
HIF1A Q16665 1/20 0.36
PTPN5 P54829 1/20 0.33
KIF11 P52732 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3385470 0.84 CYP2D6 (0.35) CYP2D6CYP2C9HIF1A
SCHEMBL3385457 0.82 CYP2D6 (0.36) CYP2D6CYP2C9HIF1APTPN5KIF11
SCHEMBL8853450 0.82 CYP2D6 (0.38) CYP2D6CYP2C9HIF1APTPN5KIF11
SCHEMBL10714980 0.80 ALDH1A1 (0.34)
SCHEMBL3384672 0.79 CYP2D6 (0.33) CYP2D6CYP2C9HIF1A
SCHEMBL8763275 0.78 CYP2D6 (0.36) CYP2D6CYP2C9HIF1APTPN5KIF11
SCHEMBL3383812 0.78 ALDH1A1 (0.39)
SCHEMBL9861898 0.73 CYP2D6 (0.35) CYP2D6CYP2C9HIF1A
SCHEMBL3384623 0.73 ALDH1A1 (0.35)
SCHEMBL21347448 0.73 CYP2C9 (0.50) CYP2D6CYP2C9HIF1APTPN5KIF11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0991082-B1 COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM TDK CORP (JP) 2010-11-24 EP disclosed
EP-0953608-B1 HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM TDK CORP (JP) 2008-12-24 EP disclosed
US-6500535-B1 FINELY DISPERSED CROSSLINKED TERPOLYMER COMPRISING ALPHA-OLEFIN, CONJUGATED DIENE, AND VINYL AROMATIC MONOMERS TDK CORPORATION (JP) 2002-12-31 US disclosed
US-20020190818-A1 High frequency band pass filter TDK CORPORATION (JP) 2002-12-19 US disclosed
US-6420476-B1 MOLECULAR WEIGHT CONTROL FOR HEAT RESISTANT LOW DIELECTRIC POLYMER TDK CORPORATION (JP) 2002-07-16 US disclosed
EP-0991082-A1 COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM TDK Corporation (JP) 2000-04-05 EP disclosed
EP-0953608-A1 HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM TDK Corporation (JP) 1999-11-03 EP disclosed
EP-0295821-B1 Method for production of graft resin composition NIPPON OILS & FATS CO LTD (JP) 1994-01-05 EP disclosed
US-4839423-A USING A UNSATURATED ORGANIC PEROXY FREE RADICAL CATALYSY NIPPON OIL & FATS CO., LTD. (JP) 1989-06-13 US disclosed