Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP2D6 | P10635 | 1/20 | 0.36 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.36 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.36 |
| ▸ | PTPN5 | P54829 | 1/20 | 0.33 |
| ▸ | TYR | P14679 | 1/20 | 0.31 |
| ▸ | KIF11 | P52732 | 1/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.30 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3385618 | 0.84 | CYP2D6 (0.35) | CYP2D6CYP2C9HIF1ATYR | |
| SCHEMBL3384477 | 0.82 | CYP2D6 (0.36) | CYP2D6CYP2C9HIF1APTPN5KIF11 | |
| SCHEMBL10714822 | 0.80 | ALDH1A1 (0.34) | — | |
| SCHEMBL3380731 | 0.79 | CYP2D6 (0.33) | CYP2D6CYP2C9HIF1A | |
| SCHEMBL3385623 | 0.78 | THRB (0.33) | HIF1AMAPK1 | |
| SCHEMBL8972258 | 0.76 | CYP2D6 (0.32) | CYP2D6CYP2C9HIF1A | |
| SCHEMBL8853450 | 0.74 | CYP2D6 (0.38) | CYP2D6CYP2C9HIF1APTPN5KIF11 | |
| SCHEMBL10349876 | 0.73 | CYP2D6 (0.35) | CYP2D6CYP2C9HIF1A | |
| SCHEMBL3384787 | 0.73 | THRB (0.31) | — | |
| SCHEMBL8763275 | 0.72 | CYP2D6 (0.36) | CYP2D6CYP2C9HIF1APTPN5KIF11 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0991082-B1 | COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM | TDK CORP (JP) | 2010-11-24 | — | — | EP | disclosed |
| EP-0953608-B1 | HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM | TDK CORP (JP) | 2008-12-24 | — | — | EP | disclosed |
| US-6500535-B1 | FINELY DISPERSED CROSSLINKED TERPOLYMER COMPRISING ALPHA-OLEFIN, CONJUGATED DIENE, AND VINYL AROMATIC MONOMERS | TDK CORPORATION (JP) | 2002-12-31 | — | — | US | disclosed |
| US-20020190818-A1 | High frequency band pass filter | TDK CORPORATION (JP) | 2002-12-19 | — | — | US | disclosed |
| US-6420476-B1 | MOLECULAR WEIGHT CONTROL FOR HEAT RESISTANT LOW DIELECTRIC POLYMER | TDK CORPORATION (JP) | 2002-07-16 | — | — | US | disclosed |
| EP-0991082-A1 | COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM | TDK Corporation (JP) | 2000-04-05 | — | — | EP | disclosed |
| EP-0953608-A1 | HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM | TDK Corporation (JP) | 1999-11-03 | — | — | EP | disclosed |
| EP-0295821-B1 | Method for production of graft resin composition | NIPPON OILS & FATS CO LTD (JP) | 1994-01-05 | — | — | EP | disclosed |
| EP-0338303-A2 | Thermoplastic resin composition and method for preparing the same | NIPPON PETROCHEMICALS CO., LTD. (JP) | 1989-10-25 | — | — | EP | disclosed |