SCHEMBL3391506

SCHEMBL3391506

CCCOC(=O)c1cccc([N+](=O)[O-])c1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.61
MAPT P10636 3/20 0.61
MAPK1 P28482 1/20 0.61
SMN1; SMN2 Q16637 1/20 0.61
KMT2A Q03164 3/20 0.59
ALDH1A1 P00352 2/20 0.58
ADRB2 P07550 2/20 0.57
ADRB1 P08588 2/20 0.57
ADRB3 P13945 2/20 0.57
CES2 O00748 1/20 0.57
CES1 P23141 1/20 0.57
TP53 P04637 1/20 0.55
CHRNB2 P17787 1/20 0.55
CHRNA4 P43681 1/20 0.55
MEN1 O00255 2/20 0.55
POLB P06746 1/20 0.55
CTDSP1 Q9GZU7 1/20 0.55
TSHR P16473 2/20 0.54
NPC1 O15118 1/20 0.52
RAB9A P51151 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3389458 0.92 KMT2A (0.57) LMNAMAPTMAPK1SMN1; SMN2KMT2A
SCHEMBL2822090 0.89 ESR1 (0.61) LMNAMAPTMAPK1KMT2AALDH1A1
SCHEMBL2820949 0.89 ESR1 (0.61) LMNAMAPTMAPK1KMT2AALDH1A1
SCHEMBL5710076 0.89 ESR1 (0.61) LMNAMAPTMAPK1KMT2AALDH1A1
SCHEMBL3388760 0.88 NPC1 (0.62) LMNAMAPTSMN1; SMN2KMT2AALDH1A1
SCHEMBL9420544 0.87 KMT2A (0.60) LMNAMAPTKMT2AALDH1A1ADRB2
Fluoride SCHEMBL27588568 0.87 NPC1 (0.61) LMNAMAPTSMN1; SMN2KMT2AALDH1A1
Ammonia Solution, Strong SCHEMBL9555537 0.87 NPC1 (0.61) LMNAMAPTSMN1; SMN2KMT2AALDH1A1
Hydrochloric Acid SCHEMBL29506783 0.87 NPC1 (0.61) LMNAMAPTSMN1; SMN2KMT2AALDH1A1
SCHEMBL11775003 0.85 CES2 (0.57) LMNAMAPTKMT2AALDH1A1ADRB2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3230339-B1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES (JP) 2022-03-23 EP disclosed
US-20170362376-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES, INC. (JP) 2017-12-21 US disclosed
EP-3230339-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL Toray Industries, Inc. (JP) 2017-10-18 EP disclosed
EP-3153496-A1 METHOD FOR PREPARING AZETIDINONE COMPOUND AND INTERMEDIATE OF AZETIDINONE COMPOUND Zhejiang Hisun Pharmaceutical Co., Ltd. (CN) 2017-04-12 EP disclosed
WO-2016087935-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES, INC. (JP) 2016-06-09 WO disclosed
US-8653160-B2 Inclusion complex containing epoxy resin composition for semiconductor encapsulation NIPPON SODA CO., LTD. (JP) 2014-02-18 US disclosed
EP-2573148-A1 CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME Nippon Soda Co., Ltd. (JP) 2013-03-27 EP disclosed
US-20130059942-A1 CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME NIPPON SODA CO., LTD. (JP) 2013-03-07 US disclosed
EP-2489689-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF Nippon Soda Co., Ltd. (JP) 2012-08-22 EP disclosed
US-20120196991-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) 2012-08-02 US disclosed
US-20100179250-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION NIPPON SODA CO., LTD. (JP) 2010-07-15 US disclosed
EP-2192139-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION Nippon Soda Co., Ltd. (JP) 2010-06-02 EP disclosed