Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KMT2A | Q03164 | 2/20 | 0.57 |
| ▸ | LMNA | P02545 | 2/20 | 0.56 |
| ▸ | MAPT | P10636 | 2/20 | 0.56 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.56 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.56 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.55 |
| ▸ | ADRB2 | P07550 | 2/20 | 0.55 |
| ▸ | ADRB1 | P08588 | 2/20 | 0.55 |
| ▸ | ADRB3 | P13945 | 2/20 | 0.55 |
| ▸ | CES2 | O00748 | 1/20 | 0.54 |
| ▸ | CES1 | P23141 | 1/20 | 0.54 |
| ▸ | CACNA1F | O60840 | 1/20 | 0.54 |
| ▸ | CACNA1D | Q01668 | 1/20 | 0.54 |
| ▸ | CACNA1S | Q13698 | 1/20 | 0.54 |
| ▸ | CACNA1C | Q13936 | 1/20 | 0.54 |
| ▸ | ESR1 | P03372 | 1/20 | 0.53 |
| ▸ | CHRNB2 | P17787 | 1/20 | 0.53 |
| ▸ | CHRNA4 | P43681 | 1/20 | 0.53 |
| ▸ | TP53 | P04637 | 1/20 | 0.53 |
| ▸ | MEN1 | O00255 | 1/20 | 0.52 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2820949 | 0.95 | ESR1 (0.61) | KMT2ALMNAMAPTMAPK1ALDH1A1 | |
| SCHEMBL5710076 | 0.95 | ESR1 (0.61) | KMT2ALMNAMAPTMAPK1ALDH1A1 | |
| SCHEMBL2822090 | 0.95 | ESR1 (0.61) | KMT2ALMNAMAPTMAPK1ALDH1A1 | |
| SCHEMBL3391506 | 0.92 | LMNA (0.61) | KMT2ALMNAMAPTMAPK1SMN1; SMN2 | |
| SCHEMBL8500035 | 0.86 | MEN1 (0.50) | KMT2ALMNAMAPTMAPK1SMN1; SMN2 | |
| SCHEMBL3646790 | 0.86 | TP53 (0.56) | KMT2ALMNAMAPTALDH1A1ADRB2 | |
| SCHEMBL18020904 | 0.85 | ESR1 (0.62) | LMNAMAPK1SMN1; SMN2ALDH1A1ESR1 | |
| SCHEMBL11358519 | 0.85 | ESR1 (0.62) | LMNAMAPK1SMN1; SMN2ALDH1A1ESR1 | |
| SCHEMBL3388760 | 0.85 | NPC1 (0.62) | KMT2ALMNAMAPTSMN1; SMN2ALDH1A1 | |
| SCHEMBL3654588 | 0.85 | CA12 (0.55) | KMT2ALMNAMAPTALDH1A1ADRB2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3230339-B1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | TORAY INDUSTRIES (JP) | 2022-03-23 | — | — | EP | disclosed |
| CN-106905173-B | Process for preparing aminobenzoic acid or esters thereof | 河北科技大学 | 2020-03-03 | — | — | CN | disclosed |
| CN-107001594-B | Composition epoxy resin, prepreg, the manufacturing method of fiber reinforced plastic materials and fiber reinforced plastic materials | 东丽株式会社 | 2019-07-23 | — | — | CN | disclosed |
| US-20170362376-A1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | TORAY INDUSTRIES, INC. (JP) | 2017-12-21 | — | — | US | disclosed |
| EP-3230339-A1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | Toray Industries, Inc. (JP) | 2017-10-18 | — | — | EP | disclosed |
| WO-2016087935-A1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | TORAY INDUSTRIES, INC. (JP) | 2016-06-09 | — | — | WO | disclosed |
| US-8653160-B2 | Inclusion complex containing epoxy resin composition for semiconductor encapsulation | NIPPON SODA CO., LTD. (JP) | 2014-02-18 | — | — | US | disclosed |
| EP-2573148-A1 | CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME | Nippon Soda Co., Ltd. (JP) | 2013-03-27 | — | — | EP | disclosed |
| US-20130059942-A1 | CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME | NIPPON SODA CO., LTD. (JP) | 2013-03-07 | — | — | US | disclosed |
| EP-2489689-A1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | Nippon Soda Co., Ltd. (JP) | 2012-08-22 | — | — | EP | disclosed |
| US-20120196991-A1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) | 2012-08-02 | — | — | US | disclosed |
| US-20100179250-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | NIPPON SODA CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |
| EP-2192139-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | Nippon Soda Co., Ltd. (JP) | 2010-06-02 | — | — | EP | disclosed |