SCHEMBL339789

SCHEMBL339789

CCCC[Si](CCCC)OC

nearest known ligand 0.35

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.35
LMNA P02545 1/20 0.35
THRB P10828 1/20 0.33
ADRB2 P07550 1/20 0.30
ADRB1 P08588 1/20 0.30
ADRB3 P13945 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23365083 0.91 TSHR (0.39) TSHRLMNATHRB
SCHEMBL23365104 0.88 TSHR (0.44) TSHRLMNATHRB
SCHEMBL23365035 0.88 TSHR (0.44) TSHRLMNATHRB
SCHEMBL23365093 0.88 TSHR (0.44) TSHRLMNATHRB
SCHEMBL340593 0.80
SCHEMBL340148 0.75
SCHEMBL340717 0.73 TSHR (0.33) TSHRLMNATHRB
SCHEMBL23365103 0.71 ADRB2 (0.39) TSHRLMNATHRBADRB2ADRB1
SCHEMBL23365097 0.71 ADRB2 (0.33) TSHRLMNATHRBADRB2ADRB1
SCHEMBL23365089 0.67 TSHR (0.39) TSHRLMNATHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220403056-A1 CURED RUBBER NETWORK WITH COVALENT AND HYDROGEN-BONDED CROSSLINKS BRIDGESTONE CORPORATION (JP) 2022-12-22 US disclosed
EP-4058487-A2 CURED RUBBER NETWORK WITH COVALENT AND HYDROGEN-BONDED CROSSLINKS BRIDGESTONE CORPORATION (JP) 2022-09-21 EP disclosed
WO-2021097455-A2 CURED RUBBER NETWORK WITH COVALENT AND HYDROGEN-BONDED CROSSLINKS BRIDGESTONE CORPORATION (JP) 2021-05-20 WO disclosed
EP-2065455-B1 Pressure-sensitive adhesive tape NITTO DENKO CORP (JP) 2012-05-16 EP disclosed
US-20120015100-A1 Pressure-Sensitive Adhesive Tape NITTO DENKO CORPORATION (JP) 2012-01-19 US disclosed
EP-2383321-A2 Process for producing an adhesive composition and adhesive tape comprising an adhesive composition produced by said process Nitto Denko Corporation (JP) 2011-11-02 EP disclosed
US-20090142593-A1 PRESSURE-SENSITIVE ADHESIVE TAPE NITTO DENKO CORPORATION (JP) 2009-06-04 US disclosed
EP-2065455-A1 Pressure-sensitive adhesive tape NITTO DENKO CORPORATION (JP) 2009-06-03 EP disclosed